{"id":"https://openalex.org/W7225254499","doi":"https://doi.org/10.1177/09544089261502680","title":"Numerical and experimental investigation of twin-side-cooled heat sink for electronic chips","display_name":"Numerical and experimental investigation of twin-side-cooled heat sink for electronic chips","publication_year":2026,"publication_date":"2026-11-04","ids":{"openalex":"https://openalex.org/W7225254499","doi":"https://doi.org/10.1177/09544089261502680"},"language":"en","primary_location":{"id":"doi:10.1177/09544089261502680","doi":"https://doi.org/10.1177/09544089261502680","is_oa":false,"landing_page_url":"https://doi.org/10.1177/09544089261502680","pdf_url":null,"source":{"id":"https://openalex.org/S4210186341","display_name":"Proceedings of the Institution of Mechanical Engineers Part E Journal of Process Mechanical Engineering","issn_l":"0954-4089","issn":["0954-4089","2041-3009"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","ki-jl-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320017","host_organization_name":"SAGE Publishing","host_organization_lineage":["https://openalex.org/P4310320017"],"host_organization_lineage_names":["SAGE Publishing"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5026153995","display_name":"Vineet Singh","orcid":"https://orcid.org/0000-0003-3328-2588","observed_orcids":["https://orcid.org/0000-0003-3328-2588"]},"institutions":[{"id":"https://openalex.org/I2801192375","display_name":"IFTM University","ror":"https://ror.org/02v2sn747","country_code":"IN","type":"education","lineage":["https://openalex.org/I2801192375"]},{"id":"https://openalex.org/I4210092444","display_name":"Instituto Federal de Educa\u00e7\u00e3o, Ci\u00eancia e Tecnologia do Tri\u00e2ngulo Mineiro","ror":"https://ror.org/00ge23k91","country_code":"BR","type":"education","lineage":["https://openalex.org/I1293487690","https://openalex.org/I2801200668","https://openalex.org/I4210092444"]},{"id":"https://openalex.org/I4210095110","display_name":"Macao University of Tourism","ror":"https://ror.org/00nx0vn86","country_code":"MO","type":"education","lineage":["https://openalex.org/I4210095110"]}],"countries":["BR","IN","MO"],"is_corresponding":true,"raw_author_name":"Vineet Singh","raw_affiliation_strings":["IFTM University"],"raw_orcid":"https://orcid.org/0000-0003-3328-2588","affiliations":[{"raw_affiliation_string":"IFTM University","institution_ids":["https://openalex.org/I2801192375","https://openalex.org/I4210092444","https://openalex.org/I4210095110"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103191911","display_name":"Niraj Kumar","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I154970844","display_name":"Jaypee Institute of Information Technology","ror":"https://ror.org/05sttyy11","country_code":"IN","type":"education","lineage":["https://openalex.org/I154970844"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Niraj Kumar","raw_affiliation_strings":["Department of Mechanical Engineering and Design, Jaypee Institute of Information Technology"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering and Design, Jaypee Institute of Information Technology","institution_ids":["https://openalex.org/I154970844"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5069464111","display_name":"Vaibhav Trivedi","orcid":"https://orcid.org/0000-0002-0064-133X","observed_orcids":["https://orcid.org/0000-0002-0064-133X"]},"institutions":[{"id":"https://openalex.org/I2801192375","display_name":"IFTM University","ror":"https://ror.org/02v2sn747","country_code":"IN","type":"education","lineage":["https://openalex.org/I2801192375"]},{"id":"https://openalex.org/I4210092444","display_name":"Instituto Federal de Educa\u00e7\u00e3o, Ci\u00eancia e Tecnologia do Tri\u00e2ngulo Mineiro","ror":"https://ror.org/00ge23k91","country_code":"BR","type":"education","lineage":["https://openalex.org/I1293487690","https://openalex.org/I2801200668","https://openalex.org/I4210092444"]},{"id":"https://openalex.org/I4210095110","display_name":"Macao University of Tourism","ror":"https://ror.org/00nx0vn86","country_code":"MO","type":"education","lineage":["https://openalex.org/I4210095110"]}],"countries":["BR","IN","MO"],"is_corresponding":false,"raw_author_name":"Vaibhav Trivedi","raw_affiliation_strings":["IFTM University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IFTM University","institution_ids":["https://openalex.org/I2801192375","https://openalex.org/I4210092444","https://openalex.org/I4210095110"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5028047349","display_name":"Vikash Kumar Chauhan","orcid":"https://orcid.org/0000-0002-2175-5539","observed_orcids":["https://orcid.org/0000-0002-2175-5539"]},"institutions":[{"id":"https://openalex.org/I4405263758","display_name":"G.L. Bajaj Institute of Technology and Management Greater Noida","ror":"https://ror.org/05x7qvh17","country_code":"IN","type":"education","lineage":["https://openalex.org/I4405263758"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Vikash Kumar Chauhan","raw_affiliation_strings":["G. L. Bajaj Institute of Technology and Management"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"G. L. Bajaj Institute of Technology and Management","institution_ids":["https://openalex.org/I4405263758"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5160616863","display_name":"Rishi Nigam","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Rishi Nigam","raw_affiliation_strings":["Department of Electronics and Communication Engineering, Government Engineering College Kaimur, Bihar, India"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electronics and Communication Engineering, Government Engineering College Kaimur, Bihar, India","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5037134102","display_name":"Yogesh Kumar","orcid":"https://orcid.org/0000-0003-3691-1781","observed_orcids":["https://orcid.org/0000-0003-3691-1781"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Yogesh Kumar","raw_affiliation_strings":["CCS University Meerut"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CCS University Meerut","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5026153995"],"corresponding_institution_ids":["https://openalex.org/I2801192375","https://openalex.org/I4210092444","https://openalex.org/I4210095110"],"apc_list":{"value":4150,"currency":"USD","value_usd":4150},"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.74962081,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.9883000254631042,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.9883000254631042,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10850","display_name":"Heat Transfer and Boiling Studies","score":0.00419999985024333,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13116","display_name":"Heat Transfer and Numerical Methods","score":0.002199999988079071,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/heat-sinks","display_name":"heat sinks","score":0.8569999933242798},{"id":"https://openalex.org/keywords/chip-cooling","display_name":"chip cooling","score":0.8700000047683716},{"id":"https://openalex.org/keywords/phase-change-materials","display_name":"phase change materials","score":0.8420000076293945},{"id":"https://openalex.org/keywords/hybrid-cooling","display_name":"hybrid cooling","score":0.9319999814033508},{"id":"https://openalex.org/keywords/air-cooling","display_name":"air cooling","score":0.8700000047683716},{"id":"https://openalex.org/keywords/heat-transfer-enhancement","display_name":"heat transfer enhancement","score":0.6830000281333923},{"id":"https://openalex.org/keywords/nusselt-number","display_name":"Nusselt number","score":0.8920000195503235},{"id":"https://openalex.org/keywords/heat-generation-rate","display_name":"heat generation rate","score":0.8849999904632568},{"id":"https://openalex.org/keywords/finned-heat-sinks","display_name":"finned heat sinks","score":0.621999979019165},{"id":"https://openalex.org/keywords/electronics-thermal-management","display_name":"electronics thermal management","score":0.5630000233650208}],"concepts":[{"id":"https://openalex.org/C186937647","wikidata":"https://www.wikidata.org/wiki/Q1796959","display_name":"Heat sink","level":2,"score":0.9056000113487244},{"id":"https://openalex.org/C50517652","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat transfer","level":2,"score":0.6287000179290771},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5986999869346619},{"id":"https://openalex.org/C130230704","wikidata":"https://www.wikidata.org/wiki/Q898280","display_name":"Nusselt number","level":4,"score":0.5856000185012817},{"id":"https://openalex.org/C194945478","wikidata":"https://www.wikidata.org/wiki/Q5693253","display_name":"Heat capacity rate","level":4,"score":0.5855000019073486},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.5187000036239624},{"id":"https://openalex.org/C48632124","wikidata":"https://www.wikidata.org/wiki/Q617088","display_name":"Heat spreader","level":3,"score":0.5138000249862671},{"id":"https://openalex.org/C105873366","wikidata":"https://www.wikidata.org/wiki/Q1208873","display_name":"Air cooling","level":2,"score":0.5127000212669373},{"id":"https://openalex.org/C29700514","wikidata":"https://www.wikidata.org/wiki/Q634340","display_name":"Heat transfer coefficient","level":3,"score":0.4943999946117401},{"id":"https://openalex.org/C2778952998","wikidata":"https://www.wikidata.org/wiki/Q17010280","display_name":"Electronics cooling","level":3,"score":0.47440001368522644},{"id":"https://openalex.org/C57879066","wikidata":"https://www.wikidata.org/wiki/Q41217","display_name":"Mechanics","level":1,"score":0.4724000096321106},{"id":"https://openalex.org/C39420092","wikidata":"https://www.wikidata.org/wiki/Q17075298","display_name":"Plate fin heat exchanger","level":4,"score":0.4440000057220459},{"id":"https://openalex.org/C2778119658","wikidata":"https://www.wikidata.org/wiki/Q1806889","display_name":"Phase-change material","level":3,"score":0.41100001335144043},{"id":"https://openalex.org/C167131557","wikidata":"https://www.wikidata.org/wiki/Q5186725","display_name":"Critical heat flux","level":4,"score":0.40610000491142273},{"id":"https://openalex.org/C159188206","wikidata":"https://www.wikidata.org/wiki/Q1478382","display_name":"Heat flux","level":3,"score":0.390500009059906},{"id":"https://openalex.org/C79795727","wikidata":"https://www.wikidata.org/wiki/Q3068508","display_name":"Passive cooling","level":3,"score":0.38920000195503235},{"id":"https://openalex.org/C11026015","wikidata":"https://www.wikidata.org/wiki/Q840551","display_name":"Computer cooling","level":3,"score":0.38600000739097595},{"id":"https://openalex.org/C158139659","wikidata":"https://www.wikidata.org/wiki/Q1127694","display_name":"Intercooler","level":3,"score":0.38260000944137573},{"id":"https://openalex.org/C91721477","wikidata":"https://www.wikidata.org/wiki/Q778612","display_name":"Fin","level":2,"score":0.3684000074863434},{"id":"https://openalex.org/C65473313","wikidata":"https://www.wikidata.org/wiki/Q17007798","display_name":"Copper in heat exchangers","level":5,"score":0.3481000065803528},{"id":"https://openalex.org/C204826919","wikidata":"https://www.wikidata.org/wiki/Q905855","display_name":"NTU method","level":5,"score":0.33739998936653137},{"id":"https://openalex.org/C44044945","wikidata":"https://www.wikidata.org/wiki/Q17028110","display_name":"Hybrid heat","level":4,"score":0.3208000063896179},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.31940001249313354},{"id":"https://openalex.org/C46787917","wikidata":"https://www.wikidata.org/wiki/Q7512410","display_name":"Sigma heat","level":5,"score":0.31150001287460327},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.3052999973297119},{"id":"https://openalex.org/C182748727","wikidata":"https://www.wikidata.org/wiki/Q178932","display_name":"Reynolds number","level":3,"score":0.302700012922287},{"id":"https://openalex.org/C37728375","wikidata":"https://www.wikidata.org/wiki/Q600568","display_name":"Heat pipe","level":3,"score":0.3012999892234802},{"id":"https://openalex.org/C192391303","wikidata":"https://www.wikidata.org/wiki/Q1324943","display_name":"Thermal reservoir","level":4,"score":0.296099990606308},{"id":"https://openalex.org/C32375409","wikidata":"https://www.wikidata.org/wiki/Q261231","display_name":"Plate heat exchanger","level":3,"score":0.2816999852657318},{"id":"https://openalex.org/C201289731","wikidata":"https://www.wikidata.org/wiki/Q1172599","display_name":"Inlet","level":2,"score":0.2770000100135803},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.27090001106262207},{"id":"https://openalex.org/C7694927","wikidata":"https://www.wikidata.org/wiki/Q7667810","display_name":"Water cooling","level":2,"score":0.2703999876976013},{"id":"https://openalex.org/C118227150","wikidata":"https://www.wikidata.org/wiki/Q6839192","display_name":"Micro heat exchanger","level":4,"score":0.2676999866962433},{"id":"https://openalex.org/C41231900","wikidata":"https://www.wikidata.org/wiki/Q918227","display_name":"Convective heat transfer","level":3,"score":0.26489999890327454},{"id":"https://openalex.org/C2777777821","wikidata":"https://www.wikidata.org/wiki/Q25111513","display_name":"Heat transfer enhancement","level":4,"score":0.25279998779296875}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1177/09544089261502680","doi":"https://doi.org/10.1177/09544089261502680","is_oa":false,"landing_page_url":"https://doi.org/10.1177/09544089261502680","pdf_url":null,"source":{"id":"https://openalex.org/S4210186341","display_name":"Proceedings of the Institution of Mechanical Engineers Part E Journal of Process Mechanical Engineering","issn_l":"0954-4089","issn":["0954-4089","2041-3009"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-d","jufo-1","ki-jl-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320017","host_organization_name":"SAGE Publishing","host_organization_lineage":["https://openalex.org/P4310320017"],"host_organization_lineage_names":["SAGE Publishing"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.5690000057220459}],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":31,"referenced_works":["https://openalex.org/W1003300593","https://openalex.org/W1970273216","https://openalex.org/W1987343361","https://openalex.org/W2010364538","https://openalex.org/W2039780870","https://openalex.org/W2051960695","https://openalex.org/W2062932750","https://openalex.org/W2070525361","https://openalex.org/W2078383106","https://openalex.org/W2086917395","https://openalex.org/W2150132925","https://openalex.org/W2531093493","https://openalex.org/W2546956260","https://openalex.org/W2598455937","https://openalex.org/W2761435929","https://openalex.org/W2765457922","https://openalex.org/W2773514307","https://openalex.org/W2793096770","https://openalex.org/W2793450998","https://openalex.org/W2797922402","https://openalex.org/W2806744603","https://openalex.org/W2924750700","https://openalex.org/W3114290478","https://openalex.org/W3133424002","https://openalex.org/W3155266077","https://openalex.org/W3156979683","https://openalex.org/W4281250763","https://openalex.org/W4293173578","https://openalex.org/W4322766225","https://openalex.org/W4390739217","https://openalex.org/W4399257950"],"related_works":["https://openalex.org/W7128735187","https://openalex.org/W7218359963","https://openalex.org/W4414561359","https://openalex.org/W4388177493","https://openalex.org/W3129748732","https://openalex.org/W2801657948","https://openalex.org/W4401064868","https://openalex.org/W2264190046","https://openalex.org/W7117759805","https://openalex.org/W4404796616"],"abstract_inverted_index":{"A":[0],"heat":[1,45,61,82,116,125,158,172,176,186,203,236,258],"sink":[2,83,126,187],"is":[3,109,153,193],"an":[4],"important":[5],"component":[6],"in":[7,118,146,231],"the":[8,22,33,44,49,88,92,107,115,124,141,157,167,171,182,185,189,196,269],"electronics":[9],"industry,":[10],"used":[11,134,154],"to":[12,32,70,155,201,245],"cool":[13,156],"electronic":[14,24],"chips":[15],"and":[16,94,99,132,136,149,219,249,252,279],"prevent":[17],"overheating-induced":[18],"failure.":[19],"It":[20,192],"cools":[21,87],"small":[23],"components":[25],"through":[26,111],"its":[27],"large":[28],"surface":[29],"area":[30],"due":[31],"integration":[34],"of":[35,38,48,106,123,170,184,206,217,223,229,261],"various":[36],"types":[37],"fins.":[39],"This":[40],"research":[41],"article":[42],"investigates":[43],"transfer":[46,237],"characteristics":[47],"25":[50,53],"mm":[51,54,57],"\u00d7":[52,55,67,72,208,263],"1":[56,131],"chip":[58,89],"size":[59],"with":[60,97],"generation":[62,204,259],"rates":[63],"ranging":[64],"from":[65,91,243],"8":[66],"10":[68,73,209,264],"5":[69],"4":[71,262],"6":[74,210,265],"W/m":[75,211,266],"3":[76,148,212,267],".":[77],"For":[78],"this,":[79],"a":[80,202,220,226,257],"novel":[81],"was":[84],"proposed,":[85],"which":[86,119],"effectively":[90],"top":[93],"bottom":[95],"sides":[96],"air":[98,135,178,215],"phase":[100,137],"change":[101,138],"material":[102,139],"fluids.":[103],"The":[104,160,234],"effectiveness":[105],"cooling":[108,112,142,152,179],"enhanced":[110],"arrangements":[113],"inside":[114],"sink,":[117],"four":[120],"different":[121],"cases":[122,241],"have":[127],"been":[128],"analysed.":[129],"Cases":[130,147,273],"2":[133,165],"as":[140],"fluid":[143],"alone,":[144],"but":[145],"4,":[150],"hybrid":[151],"sink.":[159,173],"study":[161],"revealed":[162],"that":[163,195,199],"Case":[164,232],"denotes":[166],"minimum":[168],"temperature":[169,183,216],"At":[174,256],"lower":[175],"generation,":[177],"alone":[180],"maintains":[181],"within":[188],"required":[190],"limit.":[191],"found":[194],"optimum":[197],"condition":[198],"corresponds":[200],"rate":[205,260],"1.6":[207],",":[213,268],"inlet":[214],"36.16\u00b0C":[218],"Reynolds":[221],"number":[222,228],"277.77":[224],"gives":[225],"Nusselt":[227],"14.72":[230],"1.":[233],"maximum":[235],"efficiency":[238],"for":[239,272],"all":[240],"increases":[242],"0.59":[244],"0.73":[246],"between":[247],"100":[248],"500":[250],"seconds":[251],"then":[253],"remains":[254],"constant.":[255],"comparative":[270],"temperatures":[271],"1\u20134":[274],"are":[275],"303.77,":[276],"303.27,":[277],"304.12":[278],"305.51":[280],"K,":[281],"respectively.":[282]},"counts_by_year":[],"updated_date":"2026-11-06T12:05:46.655746","created_date":"2026-11-05T00:00:00"}