{"id":"https://openalex.org/W7225254079","doi":"https://doi.org/10.1115/msec2026-175477","title":"From Thermal History to Properties: Location-Resolved Characterization in Additive Manufacturing With Miniature Tensile Specimens","display_name":"From Thermal History to Properties: Location-Resolved Characterization in Additive Manufacturing With Miniature Tensile Specimens","publication_year":2026,"publication_date":"2026-06-14","ids":{"openalex":"https://openalex.org/W7225254079","doi":"https://doi.org/10.1115/msec2026-175477"},"language":"en","primary_location":{"id":"doi:10.1115/msec2026-175477","doi":"https://doi.org/10.1115/msec2026-175477","is_oa":false,"landing_page_url":"https://doi.org/10.1115/msec2026-175477","pdf_url":null,"source":{"id":"https://openalex.org/S4306503479","display_name":"ASME International Manufacturing Science and Engineering Conference (MSEC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Volume 1: Additive Manufacturing; Advanced Materials Manufacturing; Biomanufacturing; Life Cycle Engineering","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5134045737","display_name":"Prudhvi Raj Pola","orcid":"https://orcid.org/0009-0003-0984-8809","observed_orcids":["https://orcid.org/0009-0003-0984-8809"]},"institutions":[{"id":"https://openalex.org/I115475287","display_name":"Oklahoma State University","ror":"https://ror.org/01g9vbr38","country_code":"US","type":"education","lineage":["https://openalex.org/I115475287"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Prudhvi Raj Pola","raw_affiliation_strings":["Oklahoma State University , , ,"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Oklahoma State University , , ,","institution_ids":["https://openalex.org/I115475287"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111073179","display_name":"Clinton Switzer","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I115475287","display_name":"Oklahoma State University","ror":"https://ror.org/01g9vbr38","country_code":"US","type":"education","lineage":["https://openalex.org/I115475287"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Clinton Switzer","raw_affiliation_strings":["Oklahoma State University , , ,"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Oklahoma State University , , ,","institution_ids":["https://openalex.org/I115475287"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012655323","display_name":"Siddhesh Chaudhari","orcid":"https://orcid.org/0009-0002-1945-7310","observed_orcids":["https://orcid.org/0009-0002-1945-7310"]},"institutions":[{"id":"https://openalex.org/I115475287","display_name":"Oklahoma State University","ror":"https://ror.org/01g9vbr38","country_code":"US","type":"education","lineage":["https://openalex.org/I115475287"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Siddhesh Chaudhari","raw_affiliation_strings":["Oklahoma State University , , ,"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Oklahoma State University , , ,","institution_ids":["https://openalex.org/I115475287"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037915561","display_name":"Kaustubh Deshmukh","orcid":"https://orcid.org/0000-0003-1371-5059","observed_orcids":["https://orcid.org/0000-0003-1371-5059"]},"institutions":[{"id":"https://openalex.org/I859038795","display_name":"Virginia Tech","ror":"https://ror.org/02smfhw86","country_code":"US","type":"education","lineage":["https://openalex.org/I859038795"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kaustubh Deshmukh","raw_affiliation_strings":["Virginia Tech , , ,"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Virginia Tech , , ,","institution_ids":["https://openalex.org/I859038795"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045182089","display_name":"Prahalada Rao","orcid":"https://orcid.org/0000-0002-9642-622X","observed_orcids":["https://orcid.org/0000-0002-9642-622X"]},"institutions":[{"id":"https://openalex.org/I859038795","display_name":"Virginia Tech","ror":"https://ror.org/02smfhw86","country_code":"US","type":"education","lineage":["https://openalex.org/I859038795"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Prahalada Rao","raw_affiliation_strings":["Virginia Tech , , ,"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Virginia Tech , , ,","institution_ids":["https://openalex.org/I859038795"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5160654959","display_name":"Ranji Vaidyanathan","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I115475287","display_name":"Oklahoma State University","ror":"https://ror.org/01g9vbr38","country_code":"US","type":"education","lineage":["https://openalex.org/I115475287"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ranji Vaidyanathan","raw_affiliation_strings":["Oklahoma State University , , ,"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Oklahoma State University , , ,","institution_ids":["https://openalex.org/I115475287"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10705","display_name":"Additive Manufacturing Materials and Processes","score":0.7470999956130981,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10705","display_name":"Additive Manufacturing Materials and Processes","score":0.7470999956130981,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.24770000576972961,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10707","display_name":"Cellular and Composite Structures","score":0.001500000013038516,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/additive-manufacturing","display_name":"additive manufacturing","score":0.996999979019165},{"id":"https://openalex.org/keywords/thermal-history","display_name":"thermal history","score":0.8730000257492065},{"id":"https://openalex.org/keywords/heterogeneous-microstructure","display_name":"heterogeneous microstructure","score":0.9369999766349792},{"id":"https://openalex.org/keywords/grain-structure","display_name":"grain structure","score":0.6330000162124634},{"id":"https://openalex.org/keywords/defect-distribution","display_name":"defect distribution","score":0.7319999933242798},{"id":"https://openalex.org/keywords/residual-stress","display_name":"residual stress","score":0.9950000047683716},{"id":"https://openalex.org/keywords/anisotropy","display_name":"anisotropy","score":0.7820000052452087},{"id":"https://openalex.org/keywords/structure-property-relationships","display_name":"structure-property relationships","score":0.9020000100135803},{"id":"https://openalex.org/keywords/yield-strength","display_name":"yield strength","score":0.7319999933242798},{"id":"https://openalex.org/keywords/tensile-strength","display_name":"tensile strength","score":0.7699999809265137},{"id":"https://openalex.org/keywords/failure-strain","display_name":"failure strain","score":0.828000009059906}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7365000247955322},{"id":"https://openalex.org/C2780841128","wikidata":"https://www.wikidata.org/wiki/Q5073781","display_name":"Characterization (materials science)","level":2,"score":0.7250000238418579},{"id":"https://openalex.org/C112950240","wikidata":"https://www.wikidata.org/wiki/Q76005","display_name":"Ultimate tensile strength","level":2,"score":0.6805999875068665},{"id":"https://openalex.org/C2776512210","wikidata":"https://www.wikidata.org/wiki/Q5311608","display_name":"Ductility (Earth science)","level":3,"score":0.6340000033378601},{"id":"https://openalex.org/C182508753","wikidata":"https://www.wikidata.org/wiki/Q115605","display_name":"Tensile testing","level":3,"score":0.6312999725341797},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5738999843597412},{"id":"https://openalex.org/C31555180","wikidata":"https://www.wikidata.org/wiki/Q3523867","display_name":"Material properties","level":2,"score":0.5037999749183655},{"id":"https://openalex.org/C37292000","wikidata":"https://www.wikidata.org/wiki/Q1257918","display_name":"Residual stress","level":2,"score":0.49790000915527344},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.451200008392334},{"id":"https://openalex.org/C85725439","wikidata":"https://www.wikidata.org/wiki/Q466686","display_name":"Anisotropy","level":2,"score":0.4487000107765198},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.40689998865127563},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3937999904155731},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.38530001044273376},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.37380000948905945},{"id":"https://openalex.org/C115635565","wikidata":"https://www.wikidata.org/wiki/Q860900","display_name":"Digital image correlation","level":2,"score":0.34139999747276306},{"id":"https://openalex.org/C134121241","wikidata":"https://www.wikidata.org/wiki/Q899301","display_name":"Yield (engineering)","level":2,"score":0.3231000006198883},{"id":"https://openalex.org/C192191005","wikidata":"https://www.wikidata.org/wiki/Q466491","display_name":"Grain size","level":2,"score":0.2728999853134155},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.265500009059906},{"id":"https://openalex.org/C149912024","wikidata":"https://www.wikidata.org/wiki/Q462188","display_name":"Creep","level":2,"score":0.2644999921321869},{"id":"https://openalex.org/C200070095","wikidata":"https://www.wikidata.org/wiki/Q1297687","display_name":"Structural material","level":2,"score":0.259799987077713}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1115/msec2026-175477","doi":"https://doi.org/10.1115/msec2026-175477","is_oa":false,"landing_page_url":"https://doi.org/10.1115/msec2026-175477","pdf_url":null,"source":{"id":"https://openalex.org/S4306503479","display_name":"ASME International Manufacturing Science and Engineering Conference (MSEC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Volume 1: Additive Manufacturing; Advanced Materials Manufacturing; Biomanufacturing; Life Cycle Engineering","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.651199996471405}],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W7161882074","https://openalex.org/W4313500138","https://openalex.org/W2592914946","https://openalex.org/W3034103403","https://openalex.org/W7221767969","https://openalex.org/W7140205330","https://openalex.org/W7154953782","https://openalex.org/W6908486168","https://openalex.org/W2914009187","https://openalex.org/W4381512679"],"abstract_inverted_index":{"Abstract":[0],"Additive":[1],"Manufacturing":[2],"(AM)":[3],"enables":[4,255],"the":[5,25,37],"fabrication":[6],"of":[7,30,176,260,271],"complex":[8,129],"components":[9,32],"directly":[10],"from":[11,87,165],"digital":[12],"models,":[13],"using":[14],"a":[15,96,139,169,256],"layer-by-layer":[16],"process":[17],"with":[18,205,218],"minimal":[19],"waste.":[20],"Despite":[21],"these":[22,134],"advantages,":[23],"ensuring":[24],"structural":[26],"integrity":[27],"and":[28,42,103,120,184,225,246,267],"reliability":[29],"AM":[31,130,171,249],"remains":[33],"challenging":[34],"due":[35],"to":[36,55,92,142],"highly":[38],"variable":[39],"thermal":[40,89,209],"histories":[41,90,210],"resulting":[43],"microstructural":[44,51],"heterogeneity":[45,245],"inherent":[46,91],"in":[47,100,147,197,207,220,248,274],"layer-wise":[48],"fabrication.":[49,213],"These":[50,214],"variations":[52,85,99,196,215],"often":[53,110],"lead":[54],"location-dependent":[56],"mechanical":[57,75,145,198,244],"behavior":[58,146],"that":[59,105,232],"cannot":[60],"be":[61],"fully":[62],"captured":[63],"through":[64],"conventional":[65,264],"bulk":[66,70,265],"testing":[67,72,114,234,266],"methods.":[68],"Traditional":[69],"tensile":[71,152,182],"provides":[73,121],"averaged":[74],"properties":[76],"over":[77],"relatively":[78],"large":[79],"material":[80,118,237],"volumes,":[81],"which":[82,203],"obscures":[83],"spatial":[84,195],"arising":[86],"heterogeneous":[88],"additive":[93],"manufacturing.":[94],"As":[95],"result,":[97],"localized":[98,252],"stiffness,":[101,178],"strength,":[102,180,183],"ductility":[104],"may":[106],"govern":[107],"part":[108,261],"performance":[109,199,262],"remain":[111],"undetected.":[112],"Bulk":[113],"also":[115],"requires":[116],"significant":[117],"usage":[119,238],"limited":[122],"insight":[123,242],"into":[124,243],"location-specific":[125],"microstructure-property":[126],"relationships":[127,273],"within":[128,168],"geometries.":[131],"To":[132],"address":[133],"limitations,":[135],"this":[136],"study":[137],"employs":[138],"mini-specimen-based":[140],"approach":[141,254],"characterize":[143],"location-resolved":[144],"additively":[148,275],"manufactured":[149,276],"components.":[150,277],"Miniature":[151],"specimens":[153],"measuring":[154],"3":[155],"mm":[156,159,162],"x":[157,160],"1":[158],"0.25":[161],"were":[163],"extracted":[164],"multiple":[166],"locations":[167],"single":[170],"part,":[172],"enabling":[173],"direct":[174],"measurement":[175],"local":[177,208],"yield":[179],"ultimate":[181],"strain-to-failure":[185],"at":[186],"each":[187],"extraction":[188,201],"site.":[189],"The":[190,229],"mini-specimen":[191,233],"tests":[192],"reveal":[193],"clear":[194],"across":[200],"locations,":[202],"correlate":[204],"differences":[206],"experienced":[211],"during":[212],"are":[216],"associated":[217],"changes":[219],"grain":[221],"structure,":[222],"defect":[223],"distribution,":[224],"residual":[226],"stress":[227],"state.":[228],"results":[230],"demonstrate":[231],"significantly":[235],"reduces":[236],"while":[239],"providing":[240],"high-resolution":[241],"anisotropy":[247],"parts.":[250],"This":[251],"characterization":[253],"more":[257],"representative":[258],"assessment":[259],"than":[263],"supports":[268],"improved":[269],"understanding":[270],"structure\u2014property":[272]},"counts_by_year":[],"updated_date":"2026-11-10T11:39:43.021295","created_date":"2026-11-05T00:00:00"}