{"id":"https://openalex.org/W7225200768","doi":"https://doi.org/10.1063/5.0354715","title":"Mechanism of low-stress and high-density SiO2 dielectric film deposition in TEOS/O2 PECVD: A multiscale simulation study","display_name":"Mechanism of low-stress and high-density SiO2 dielectric film deposition in TEOS/O2 PECVD: A multiscale simulation study","publication_year":2026,"publication_date":"2026-11-03","ids":{"openalex":"https://openalex.org/W7225200768","doi":"https://doi.org/10.1063/5.0354715"},"language":"en","primary_location":{"id":"doi:10.1063/5.0354715","doi":"https://doi.org/10.1063/5.0354715","is_oa":false,"landing_page_url":"https://doi.org/10.1063/5.0354715","pdf_url":null,"source":{"id":"https://openalex.org/S187991544","display_name":"Journal of Applied Physics","issn_l":"0021-8979","issn":["0021-8979","1089-7550","1520-8850"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["anvur-scientific","cwts-core","dongbi-d","jufo-1","norway-1","poland-100","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320257","host_organization_name":"American Institute of Physics","host_organization_lineage":["https://openalex.org/P4310320257"],"host_organization_lineage_names":["American Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Applied Physics","raw_type":"journal-article"},"volume":null,"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5037387285","display_name":"Yongkun Wang","orcid":"https://orcid.org/0000-0002-7848-1348","observed_orcids":["https://orcid.org/0000-0002-7848-1348"]},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Yongkun Wang","raw_affiliation_strings":["School of Mechano-electronic Engineering, Xidian University 1 , Xi'an 710071,","State Key Laboratory of Electromechanical Integrated Manufacturing of High-performance Electronic Equipments, Xidian University 2 , Xi'an 710071,"],"raw_orcid":"https://orcid.org/0000-0002-7848-1348","affiliations":[{"raw_affiliation_string":"School of Mechano-electronic Engineering, Xidian University 1 , Xi'an 710071,","institution_ids":["https://openalex.org/I149594827"]},{"raw_affiliation_string":"State Key Laboratory of Electromechanical Integrated Manufacturing of High-performance Electronic Equipments, Xidian University 2 , Xi'an 710071,","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5160389307","display_name":"Ding Xia","orcid":"https://orcid.org/0009-0004-5198-6540","observed_orcids":["https://orcid.org/0009-0004-5198-6540"]},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ding Xia","raw_affiliation_strings":["School of Mechano-electronic Engineering, Xidian University 1 , Xi'an 710071,","State Key Laboratory of Electromechanical Integrated Manufacturing of High-performance Electronic Equipments, Xidian University 2 , Xi'an 710071,"],"raw_orcid":"https://orcid.org/0009-0004-5198-6540","affiliations":[{"raw_affiliation_string":"School of Mechano-electronic Engineering, Xidian University 1 , Xi'an 710071,","institution_ids":["https://openalex.org/I149594827"]},{"raw_affiliation_string":"State Key Laboratory of Electromechanical Integrated Manufacturing of High-performance Electronic Equipments, Xidian University 2 , Xi'an 710071,","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5160473791","display_name":"Wenlong Song","orcid":"https://orcid.org/0009-0000-9976-0111","observed_orcids":["https://orcid.org/0009-0000-9976-0111"]},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wenlong Song","raw_affiliation_strings":["School of Mechano-electronic Engineering, Xidian University 1 , Xi'an 710071,","State Key Laboratory of Electromechanical Integrated Manufacturing of High-performance Electronic Equipments, Xidian University 2 , Xi'an 710071,"],"raw_orcid":"https://orcid.org/0009-0000-9976-0111","affiliations":[{"raw_affiliation_string":"School of Mechano-electronic Engineering, Xidian University 1 , Xi'an 710071,","institution_ids":["https://openalex.org/I149594827"]},{"raw_affiliation_string":"State Key Laboratory of Electromechanical Integrated Manufacturing of High-performance Electronic Equipments, Xidian University 2 , Xi'an 710071,","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5126533677","display_name":"ZhiZhuo Huang","orcid":"https://orcid.org/0009-0002-1859-4559","observed_orcids":["https://orcid.org/0009-0002-1859-4559"]},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"ZhiZhuo Huang","raw_affiliation_strings":["School of Mechano-electronic Engineering, Xidian University 1 , Xi'an 710071,","State Key Laboratory of Electromechanical Integrated Manufacturing of High-performance Electronic Equipments, Xidian University 2 , Xi'an 710071,"],"raw_orcid":"https://orcid.org/0009-0002-1859-4559","affiliations":[{"raw_affiliation_string":"School of Mechano-electronic Engineering, Xidian University 1 , Xi'an 710071,","institution_ids":["https://openalex.org/I149594827"]},{"raw_affiliation_string":"State Key Laboratory of Electromechanical Integrated Manufacturing of High-performance Electronic Equipments, Xidian University 2 , Xi'an 710071,","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5126558411","display_name":"Ruoshi Zhang","orcid":"https://orcid.org/0009-0004-1423-7030","observed_orcids":["https://orcid.org/0009-0004-1423-7030"]},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ruoshi Zhang","raw_affiliation_strings":["School of Mechano-electronic Engineering, Xidian University 1 , Xi'an 710071,","State Key Laboratory of Electromechanical Integrated Manufacturing of High-performance Electronic Equipments, Xidian University 2 , Xi'an 710071,"],"raw_orcid":"https://orcid.org/0009-0004-1423-7030","affiliations":[{"raw_affiliation_string":"School of Mechano-electronic Engineering, Xidian University 1 , Xi'an 710071,","institution_ids":["https://openalex.org/I149594827"]},{"raw_affiliation_string":"State Key Laboratory of Electromechanical Integrated Manufacturing of High-performance Electronic Equipments, Xidian University 2 , Xi'an 710071,","institution_ids":["https://openalex.org/I149594827"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5126558312","display_name":"XiaoXu Yang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I149594827","display_name":"Xidian University","ror":"https://ror.org/05s92vm98","country_code":"CN","type":"education","lineage":["https://openalex.org/I149594827"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"XiaoXu Yang","raw_affiliation_strings":["School of Mechano-electronic Engineering, Xidian University 1 , Xi'an 710071,","State Key Laboratory of Electromechanical Integrated Manufacturing of High-performance Electronic Equipments, Xidian University 2 , Xi'an 710071,"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Mechano-electronic Engineering, Xidian University 1 , Xi'an 710071,","institution_ids":["https://openalex.org/I149594827"]},{"raw_affiliation_string":"State Key Laboratory of Electromechanical Integrated Manufacturing of High-performance Electronic Equipments, Xidian University 2 , Xi'an 710071,","institution_ids":["https://openalex.org/I149594827"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5037387285"],"corresponding_institution_ids":["https://openalex.org/I149594827"],"apc_list":{"value":3500,"currency":"USD","value_usd":3500},"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.74304714,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"140","issue":"17","first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.5264000296592712,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.5264000296592712,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.30300000309944153,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10781","display_name":"Plasma Diagnostics and Applications","score":0.13770000636577606,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/tetraethyl-orthosilicate","display_name":"tetraethoxysilane","score":0.8740000128746033},{"id":"https://openalex.org/keywords/residual-stress","display_name":"residual stress","score":0.7360000014305115},{"id":"https://openalex.org/keywords/film-densification","display_name":"film densification","score":0.9959999918937683},{"id":"https://openalex.org/keywords/compressive-stress","display_name":"compressive stress","score":0.7919999957084656},{"id":"https://openalex.org/keywords/multiscale-modeling","display_name":"multiscale modeling","score":0.6179999709129333},{"id":"https://openalex.org/keywords/plasma-discharge-simulation","display_name":"plasma discharge modeling","score":0.6240000128746033},{"id":"https://openalex.org/keywords/electron-impact-dissociation","display_name":"electron impact dissociation","score":0.8529999852180481},{"id":"https://openalex.org/keywords/deposition-flux","display_name":"deposition flux","score":0.5849999785423279},{"id":"https://openalex.org/keywords/high-frequency-power","display_name":"high-frequency power","score":0.7490000128746033},{"id":"https://openalex.org/keywords/low-frequency-power","display_name":"low-frequency power","score":0.8669999837875366},{"id":"https://openalex.org/keywords/process-parameter-optimization","display_name":"process parameter optimization","score":0.5320000052452087}],"concepts":[{"id":"https://openalex.org/C187937830","wikidata":"https://www.wikidata.org/wiki/Q175403","display_name":"Microelectronics","level":2,"score":0.8032000064849854},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7646999955177307},{"id":"https://openalex.org/C64297162","wikidata":"https://www.wikidata.org/wiki/Q1987070","display_name":"Deposition (geology)","level":3,"score":0.7613999843597412},{"id":"https://openalex.org/C2777432599","wikidata":"https://www.wikidata.org/wiki/Q421458","display_name":"Tetraethyl orthosilicate","level":2,"score":0.6305999755859375},{"id":"https://openalex.org/C38347018","wikidata":"https://www.wikidata.org/wiki/Q905958","display_name":"Plasma-enhanced chemical vapor deposition","level":3,"score":0.6209999918937683},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.6115000247955322},{"id":"https://openalex.org/C57410435","wikidata":"https://www.wikidata.org/wiki/Q505668","display_name":"Chemical vapor deposition","level":2,"score":0.5752999782562256},{"id":"https://openalex.org/C37292000","wikidata":"https://www.wikidata.org/wiki/Q1257918","display_name":"Residual stress","level":2,"score":0.5040000081062317},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.47609999775886536},{"id":"https://openalex.org/C69544855","wikidata":"https://www.wikidata.org/wiki/Q757625","display_name":"Atomic layer deposition","level":3,"score":0.4350999891757965},{"id":"https://openalex.org/C118442862","wikidata":"https://www.wikidata.org/wiki/Q899143","display_name":"Ion plating","level":3,"score":0.41280001401901245},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.40549999475479126},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.39419999718666077},{"id":"https://openalex.org/C42360764","wikidata":"https://www.wikidata.org/wiki/Q83588","display_name":"Chemical engineering","level":1,"score":0.3569999933242798},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.33489999175071716},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.33230000734329224},{"id":"https://openalex.org/C2778517922","wikidata":"https://www.wikidata.org/wiki/Q7140482","display_name":"Particle (ecology)","level":2,"score":0.3310999870300293},{"id":"https://openalex.org/C145738678","wikidata":"https://www.wikidata.org/wiki/Q4364316","display_name":"Plasma processing","level":3,"score":0.3301999866962433},{"id":"https://openalex.org/C159467904","wikidata":"https://www.wikidata.org/wiki/Q2001702","display_name":"Chemical physics","level":1,"score":0.3075999915599823},{"id":"https://openalex.org/C2961886","wikidata":"https://www.wikidata.org/wiki/Q7140496","display_name":"Particle deposition","level":3,"score":0.30070000886917114},{"id":"https://openalex.org/C51576277","wikidata":"https://www.wikidata.org/wiki/Q900134","display_name":"Physical vapor deposition","level":3,"score":0.29829999804496765},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.29249998927116394},{"id":"https://openalex.org/C95121573","wikidata":"https://www.wikidata.org/wiki/Q190474","display_name":"Activation energy","level":2,"score":0.28790000081062317},{"id":"https://openalex.org/C75937256","wikidata":"https://www.wikidata.org/wiki/Q1440781","display_name":"Carbon film","level":3,"score":0.2858999967575073},{"id":"https://openalex.org/C195839","wikidata":"https://www.wikidata.org/wiki/Q901959","display_name":"Surface energy","level":2,"score":0.28119999170303345},{"id":"https://openalex.org/C82706917","wikidata":"https://www.wikidata.org/wiki/Q10251","display_name":"Plasma","level":2,"score":0.2791999876499176},{"id":"https://openalex.org/C172120300","wikidata":"https://www.wikidata.org/wiki/Q1134348","display_name":"Volumetric flow rate","level":2,"score":0.2653999924659729},{"id":"https://openalex.org/C70401718","wikidata":"https://www.wikidata.org/wiki/Q343241","display_name":"Dielectric strength","level":3,"score":0.26249998807907104},{"id":"https://openalex.org/C2779866884","wikidata":"https://www.wikidata.org/wiki/Q1872538","display_name":"Low-k dielectric","level":3,"score":0.2596000134944916},{"id":"https://openalex.org/C204366326","wikidata":"https://www.wikidata.org/wiki/Q3027650","display_name":"Deformation (meteorology)","level":2,"score":0.2524999976158142}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1063/5.0354715","doi":"https://doi.org/10.1063/5.0354715","is_oa":false,"landing_page_url":"https://doi.org/10.1063/5.0354715","pdf_url":null,"source":{"id":"https://openalex.org/S187991544","display_name":"Journal of Applied Physics","issn_l":"0021-8979","issn":["0021-8979","1089-7550","1520-8850"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["anvur-scientific","cwts-core","dongbi-d","jufo-1","norway-1","poland-100","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320257","host_organization_name":"American Institute of Physics","host_organization_lineage":["https://openalex.org/P4310320257"],"host_organization_lineage_names":["American Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Applied Physics","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320324173","display_name":"Natural Science Foundation of Shaanxi Province","ror":null}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":48,"referenced_works":["https://openalex.org/W1486440173","https://openalex.org/W1969247074","https://openalex.org/W1970426374","https://openalex.org/W1970486977","https://openalex.org/W1970964580","https://openalex.org/W1978557462","https://openalex.org/W1988981612","https://openalex.org/W1996448605","https://openalex.org/W2003103344","https://openalex.org/W2009539955","https://openalex.org/W2012467245","https://openalex.org/W2025849812","https://openalex.org/W2035319641","https://openalex.org/W2035402516","https://openalex.org/W2040200521","https://openalex.org/W2040203998","https://openalex.org/W2049877196","https://openalex.org/W2057521117","https://openalex.org/W2064830413","https://openalex.org/W2069262387","https://openalex.org/W2153357396","https://openalex.org/W2163835630","https://openalex.org/W2239897753","https://openalex.org/W2473654724","https://openalex.org/W2518072455","https://openalex.org/W2918268923","https://openalex.org/W2945012023","https://openalex.org/W2953472377","https://openalex.org/W3017088997","https://openalex.org/W3091319284","https://openalex.org/W3157506534","https://openalex.org/W3195824537","https://openalex.org/W4296360451","https://openalex.org/W4297348013","https://openalex.org/W4310224720","https://openalex.org/W4327589949","https://openalex.org/W4363647913","https://openalex.org/W4378233577","https://openalex.org/W4378978966","https://openalex.org/W4392862736","https://openalex.org/W4395701361","https://openalex.org/W4399155299","https://openalex.org/W4402991610","https://openalex.org/W4405475125","https://openalex.org/W4408556500","https://openalex.org/W4414142041","https://openalex.org/W4415871083","https://openalex.org/W7104539176"],"related_works":["https://openalex.org/W2239897753","https://openalex.org/W3107617052","https://openalex.org/W2069331614","https://openalex.org/W2953100696","https://openalex.org/W2057521117","https://openalex.org/W4391663087","https://openalex.org/W2947953308","https://openalex.org/W1892458390","https://openalex.org/W2049295628","https://openalex.org/W7112444365"],"abstract_inverted_index":{"With":[0],"the":[1,30,72,86,97,112,125,153,158,223,240],"development":[2],"of":[3,47,114,243],"microelectronic":[4],"devices":[5],"toward":[6],"higher":[7],"integration":[8],"and":[9,26,32,38,79,93,120,129,143,165,174,186,192,228,245],"reliability,":[10],"plasma-enhanced":[11],"chemical":[12],"vapor":[13],"deposition":[14,64,80,106,115,127,141,176,241],"(PECVD)":[15],"SiO2":[16,62,233],"dielectric":[17,247],"films":[18],"play":[19],"an":[20],"important":[21],"role":[22],"in":[23,65,217,231],"device":[24],"insulation":[25],"surface":[27,94],"passivation.":[28],"However,":[29],"coupling":[31,87],"trade-off":[33],"mechanism":[34],"between":[35,226],"film":[36,63,118,144,162,168],"densification":[37,119,227],"residual":[39],"stress":[40,193],"remain":[41],"unclear,":[42],"which":[43],"limits":[44],"further":[45,204],"improvement":[46,216],"their":[48],"comprehensive":[49,209],"performance.":[50,163,219],"To":[51],"address":[52],"this":[53,55],"issue,":[54],"study":[56,221],"establishes":[57],"a":[58,66,75,100,135,208,214],"multiscale":[59],"framework":[60],"for":[61,238],"tetraethyl":[67],"orthosilicate":[68],"(TEOS)/O2":[69],"system.":[70],"At":[71,96],"reactor":[73],"scale,":[74,99],"comsol-based":[76],"plasma":[77,183],"discharge":[78],"model":[81,107],"is":[82,108,147,157],"developed":[83],"to":[84,110,213],"analyze":[85],"among":[88,138],"electron-impact":[89],"dissociation,":[90],"active-oxygen":[91],"oxidation,":[92],"deposition.":[95],"atomic":[98],"Large-scale":[101],"Atomic/Molecular":[102],"Massively":[103],"Parallel":[104],"Simulator-based":[105],"constructed":[109],"investigate":[111],"effects":[113],"conditions":[116],"on":[117],"residual-stress":[121],"evolution.":[122],"By":[123],"converting":[124],"macroscopic":[126],"rate":[128,156],"particle":[130,196],"energy":[131],"into":[132],"atomic-scale":[133],"inputs,":[134],"cross-scale":[136],"relationship":[137,225],"process":[139,201,242],"parameters,":[140],"behavior,":[142],"structural":[145,190],"properties":[146],"established.":[148],"The":[149],"results":[150],"show":[151],"that":[152],"TEOS":[154],"flow":[155],"dominant":[159],"factor":[160],"affecting":[161],"Temperature":[164],"pressure":[166],"regulate":[167],"growth":[169],"by":[170,206],"altering":[171],"active-species":[172],"transport":[173],"effective":[175],"flux,":[177],"whereas":[178],"high-frequency":[179],"power":[180,188],"mainly":[181],"affects":[182],"reaction":[184],"activity":[185],"low-frequency":[187],"controls":[189],"rearrangement":[191],"state":[194],"through":[195],"bombardment":[197],"energy.":[198],"An":[199],"optimized":[200],"solution":[202],"was":[203],"obtained":[205],"constructing":[207],"evaluation":[210],"function,":[211],"leading":[212],"36.4%":[215],"overall":[218],"This":[220],"reveals":[222],"intrinsic":[224],"compressive-stress":[229],"accumulation":[230],"PECVD":[232],"films,":[234],"providing":[235],"theoretical":[236],"guidance":[237],"optimizing":[239],"low-stress":[244],"high-density":[246],"films.":[248]},"counts_by_year":[],"updated_date":"2026-11-05T12:25:35.769452","created_date":"2026-11-04T00:00:00"}