{"id":"https://openalex.org/W7224748544","doi":"https://doi.org/10.5781/jwj.2026.44.5.10","title":"Effects of DBC Copper Layer Thickness on the Electrical, Thermal, and Thermo-Mechanical Performance of Parallel SiC Chip Power Modules","display_name":"Effects of DBC Copper Layer Thickness on the Electrical, Thermal, and Thermo-Mechanical Performance of Parallel SiC Chip Power Modules","publication_year":2026,"publication_date":"2026-10-30","ids":{"openalex":"https://openalex.org/W7224748544","doi":"https://doi.org/10.5781/jwj.2026.44.5.10"},"language":"en","primary_location":{"id":"doi:10.5781/jwj.2026.44.5.10","doi":"https://doi.org/10.5781/jwj.2026.44.5.10","is_oa":true,"landing_page_url":"https://doi.org/10.5781/jwj.2026.44.5.10","pdf_url":"https://www.e-jwj.org/upload/jwj-2026-44-5-10.pdf","source":{"id":"https://openalex.org/S4210223004","display_name":"Journal of Welding and Joining","issn_l":"1225-6153","issn":["1225-6153","2287-8955","2466-2100","2466-2232"],"is_oa":true,"is_in_doaj":false,"is_core":false,"listed_in":["kci-registered"],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Welding and Joining","raw_type":"journal-article"},"volume":null,"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"diamond","oa_url":"https://www.e-jwj.org/upload/jwj-2026-44-5-10.pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5160174004","display_name":"Hee Chan You","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I139264467","display_name":"Seoul National University","ror":"https://ror.org/04h9pn542","country_code":"KR","type":"education","lineage":["https://openalex.org/I139264467"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hee Chan You","raw_affiliation_strings":["Department of Future Automotive Mobility, Seoul National University, Seoul, 08826, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Future Automotive Mobility, Seoul National University, Seoul, 08826, Korea","institution_ids":["https://openalex.org/I139264467"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108805456","display_name":"S.H. Won","orcid":"https://orcid.org/0009-0006-2499-0266","observed_orcids":["https://orcid.org/0009-0006-2499-0266"]},"institutions":[{"id":"https://openalex.org/I139264467","display_name":"Seoul National University","ror":"https://ror.org/04h9pn542","country_code":"KR","type":"education","lineage":["https://openalex.org/I139264467"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Seung Hyun Won","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Seoul National University, Seoul, 08826, Korea","Inter-University Semiconductor Research Center, Seoul National University, Seoul, 08826, Korea"],"raw_orcid":"https://orcid.org/0009-0006-2499-0266","affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Seoul National University, Seoul, 08826, Korea","institution_ids":["https://openalex.org/I139264467"]},{"raw_affiliation_string":"Inter-University Semiconductor Research Center, Seoul National University, Seoul, 08826, Korea","institution_ids":["https://openalex.org/I139264467"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5102957011","display_name":"Sang Won Yoon","orcid":"https://orcid.org/0000-0002-0201-8031","observed_orcids":["https://orcid.org/0000-0002-0201-8031"]},"institutions":[{"id":"https://openalex.org/I139264467","display_name":"Seoul National University","ror":"https://ror.org/04h9pn542","country_code":"KR","type":"education","lineage":["https://openalex.org/I139264467"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sang Won Yoon","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Seoul National University, Seoul, 08826, Korea","Department of Future Automotive Mobility, Seoul National University, Seoul, 08826, Korea","Inter-University Semiconductor Research Center, Seoul National University, Seoul, 08826, Korea"],"raw_orcid":"https://orcid.org/0000-0002-0201-8031","affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Seoul National University, Seoul, 08826, Korea","institution_ids":["https://openalex.org/I139264467"]},{"raw_affiliation_string":"Department of Future Automotive Mobility, Seoul National University, Seoul, 08826, Korea","institution_ids":["https://openalex.org/I139264467"]},{"raw_affiliation_string":"Inter-University Semiconductor Research Center, Seoul National University, Seoul, 08826, Korea","institution_ids":["https://openalex.org/I139264467"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I139264467"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":true,"cited_by_count":0,"citation_normalized_percentile":{"value":0.73242124,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"44","issue":"5","first_page":"507","last_page":"515"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9071999788284302,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9071999788284302,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.08749999850988388,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.0006000000284984708,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/direct-bonded-copper","display_name":"direct bonded copper","score":0.8429999947547913},{"id":"https://openalex.org/keywords/copper-layer-thickness","display_name":"copper layer thickness","score":0.9259999990463257},{"id":"https://openalex.org/keywords/sic-power-modules","display_name":"SiC power modules","score":0.8560000061988831},{"id":"https://openalex.org/keywords/thermal-coupling","display_name":"thermal coupling","score":0.6639999747276306},{"id":"https://openalex.org/keywords/electrothermal-simulation","display_name":"electro-thermal simulation","score":0.8899999856948853},{"id":"https://openalex.org/keywords/conduction-losses","display_name":"conduction losses","score":0.9309999942779541},{"id":"https://openalex.org/keywords/chip-temperature","display_name":"chip temperature","score":0.9520000219345093},{"id":"https://openalex.org/keywords/thermomechanical-analysis","display_name":"thermomechanical analysis","score":0.8130000233650208},{"id":"https://openalex.org/keywords/solder-joints","display_name":"solder joints","score":0.41200000047683716},{"id":"https://openalex.org/keywords/thermal-cycling","display_name":"thermal cycling","score":0.8830000162124634}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8687000274658203},{"id":"https://openalex.org/C193523891","wikidata":"https://www.wikidata.org/wiki/Q1771950","display_name":"dBc","level":3,"score":0.8238000273704529},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.7110999822616577},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5726000070571899},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.5716000199317932},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.46810001134872437},{"id":"https://openalex.org/C172100665","wikidata":"https://www.wikidata.org/wiki/Q7465774","display_name":"Thermal conduction","level":2,"score":0.4603999853134155},{"id":"https://openalex.org/C21881925","wikidata":"https://www.wikidata.org/wiki/Q3503313","display_name":"Power density","level":3,"score":0.4528000056743622},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.4156999886035919},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.36489999294281006},{"id":"https://openalex.org/C2778022156","wikidata":"https://www.wikidata.org/wiki/Q576145","display_name":"Strain (injury)","level":2,"score":0.32519999146461487},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.32010000944137573},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.296999990940094},{"id":"https://openalex.org/C129014197","wikidata":"https://www.wikidata.org/wiki/Q906544","display_name":"Power semiconductor device","level":3,"score":0.2928999960422516},{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.275299996137619},{"id":"https://openalex.org/C207740977","wikidata":"https://www.wikidata.org/wiki/Q234072","display_name":"Current density","level":2,"score":0.2743000090122223},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.2635999917984009}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.5781/jwj.2026.44.5.10","doi":"https://doi.org/10.5781/jwj.2026.44.5.10","is_oa":true,"landing_page_url":"https://doi.org/10.5781/jwj.2026.44.5.10","pdf_url":"https://www.e-jwj.org/upload/jwj-2026-44-5-10.pdf","source":{"id":"https://openalex.org/S4210223004","display_name":"Journal of Welding and Joining","issn_l":"1225-6153","issn":["1225-6153","2287-8955","2466-2100","2466-2232"],"is_oa":true,"is_in_doaj":false,"is_core":false,"listed_in":["kci-registered"],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Welding and Joining","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.5781/jwj.2026.44.5.10","doi":"https://doi.org/10.5781/jwj.2026.44.5.10","is_oa":true,"landing_page_url":"https://doi.org/10.5781/jwj.2026.44.5.10","pdf_url":"https://www.e-jwj.org/upload/jwj-2026-44-5-10.pdf","source":{"id":"https://openalex.org/S4210223004","display_name":"Journal of Welding and Joining","issn_l":"1225-6153","issn":["1225-6153","2287-8955","2466-2100","2466-2232"],"is_oa":true,"is_in_doaj":false,"is_core":false,"listed_in":["kci-registered"],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Welding and Joining","raw_type":"journal-article"},"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.428600013256073,"id":"https://metadata.un.org/sdg/9"}],"study_designs":[],"awards":[{"id":"https://openalex.org/G2865555180","display_name":null,"funder_award_id":"RS-2025-02214408","funder_id":"https://openalex.org/F4320322064","funder_display_name":"Korea Institute for Advancement of Technology"},{"id":"https://openalex.org/G3925139469","display_name":null,"funder_award_id":"RS-2026-25536963","funder_id":"https://openalex.org/F4320321681","funder_display_name":"Ministry of Trade, Industry and Energy"},{"id":"https://openalex.org/G4415256126","display_name":null,"funder_award_id":"RS-2025-02214408","funder_id":"https://openalex.org/F4320321681","funder_display_name":"Ministry of Trade, Industry and Energy"}],"funders":[{"id":"https://openalex.org/F4320321681","display_name":"Ministry of Trade, Industry and Energy","ror":"https://ror.org/008nkqk13"},{"id":"https://openalex.org/F4320322064","display_name":"Korea Institute for Advancement of Technology","ror":"https://ror.org/015w1qa96"},{"id":"https://openalex.org/F4320334879","display_name":"Korea Evaluation Institute of Industrial Technology","ror":"https://ror.org/03z9cwa38"}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W7224748544.pdf","grobid_xml":"https://content.openalex.org/works/W7224748544.grobid-xml"},"referenced_works_count":12,"referenced_works":["https://openalex.org/W1917918047","https://openalex.org/W1999071155","https://openalex.org/W2001325135","https://openalex.org/W2013950089","https://openalex.org/W2113809036","https://openalex.org/W2963956401","https://openalex.org/W3031630999","https://openalex.org/W4205823980","https://openalex.org/W4395672387","https://openalex.org/W4399666091","https://openalex.org/W4405755173","https://openalex.org/W4417131400"],"related_works":["https://openalex.org/W2036296621","https://openalex.org/W2533892407","https://openalex.org/W2054270308","https://openalex.org/W1555409371","https://openalex.org/W4414898699","https://openalex.org/W2577449612","https://openalex.org/W7131290758","https://openalex.org/W1843597061","https://openalex.org/W2162123774","https://openalex.org/W4312573474"],"abstract_inverted_index":{"Direct":[0],"Bonded":[1],"Copper":[2],"(DBC)":[3],"substrates":[4],"simultaneously":[5],"provide":[6],"current":[7],"conduction,":[8],"heat":[9],"spreading,":[10],"and":[11,38,74,91,160,170,177],"structural":[12],"support":[13],"in":[14,132,138,183],"multi-chip":[15],"power":[16,48],"modules,":[17],"making":[18],"Cu":[19,32,66,82,107,155,172],"thickness":[20,33,83,108,156],"a":[21,42,86],"key":[22],"trade-off":[23],"variable.":[24],"This":[25],"study":[26],"investigates":[27],"the":[28,35,56,80,95,104,118,129,139,153,168],"effects":[29,58],"of":[30,41,59,64,117],"DBC":[31],"on":[34],"electrical,":[36],"thermal,":[37],"thermo-mechanical":[39],"responses":[40],"300":[43,96],"A":[44,97],"parallel":[45],"SiC":[46],"chip":[47,60,76,162],"module.":[49],"Thermal-coupling":[50],"analysis":[51,100,126],"was":[52],"performed":[53],"to":[54,111,122],"distinguish":[55],"temperature":[57,77],"spacing":[61],"from":[62,109,120],"those":[63],"top":[65,81,154,169],"thickness.":[67],"Electro-thermal":[68],"simulation":[69],"showed":[70,101,127,148],"that":[71,102,128],"conduction":[72,158],"loss":[73,159],"maximum":[75,161],"increased":[78,157],"as":[79],"decreased,":[84],"with":[85],"pronounced":[87],"change":[88],"between":[89],"0.175":[90],"0.160":[92],"mm":[93,113],"under":[94],"condition.":[98],"Thermo-mechanical":[99],"reducing":[103,152,166],"symmetric":[105],"top/bottom":[106],"0.30/0.30":[110],"0.15/0.15":[112],"decreases":[114],"reflow":[115,175],"warpage":[116,176],"baseplate":[119],"183.930":[121],"30.091":[123],"\u03bcm.":[124],"Thermal-cycling":[125],"cycle":[130],"increment":[131],"volume-averaged":[133],"inelastic":[134,179],"strain":[135,180],"energy":[136,181],"density":[137,182],"evaluated":[140],"solder":[141,178],"region":[142],"decreased":[143,174],"by":[144],"17.2%.":[145],"The":[146],"results":[147],"distinct":[149],"thickness-dependent":[150],"responses:":[151],"temperature,":[163],"whereas":[164],"symmetrically":[165],"both":[167],"bottom":[171],"thicknesses":[173],"simulation.":[184]},"counts_by_year":[],"updated_date":"2026-11-04T10:54:05.112534","created_date":"2026-10-31T00:00:00"}