{"id":"https://openalex.org/W7222930828","doi":"https://doi.org/10.1038/s41378-026-01470-3","title":"A fabrication-aware vectorized generative representation for topology optimization of path-defined MEMS microstructures","display_name":"A fabrication-aware vectorized generative representation for topology optimization of path-defined MEMS microstructures","publication_year":2026,"publication_date":"2026-10-19","ids":{"openalex":"https://openalex.org/W7222930828","doi":"https://doi.org/10.1038/s41378-026-01470-3","pmid":"https://pubmed.ncbi.nlm.nih.gov/42897129","pmcid":"https://www.ncbi.nlm.nih.gov/pmc/articles/13680617"},"language":"en","primary_location":{"id":"doi:10.1038/s41378-026-01470-3","doi":"https://doi.org/10.1038/s41378-026-01470-3","is_oa":true,"landing_page_url":"https://doi.org/10.1038/s41378-026-01470-3","pdf_url":"https://www.nature.com/articles/s41378-026-01470-3.pdf","source":{"id":"https://openalex.org/S2739050901","display_name":"Microsystems & Nanoengineering","issn_l":"2055-7434","issn":["2055-7434","2096-1030"],"is_oa":true,"is_in_doaj":true,"is_core":true,"listed_in":["cwts-core","doaj","dongbi-b","jufo-2","ki-jl-1","norway-1","oarl","poland-140","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319965","host_organization_name":"Springer Nature","host_organization_lineage":["https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Nature"],"type":"journal"},"license":"cc-by-nc-nd","license_id":"https://openalex.org/licenses/cc-by-nc-nd","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microsystems &amp; Nanoengineering","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref","doaj","pubmed"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://www.nature.com/articles/s41378-026-01470-3.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113124638","display_name":"Gong-Zeng Liu","orcid":"https://orcid.org/0009-0009-8786-6547","observed_orcids":["https://orcid.org/0009-0009-8786-6547"]},"institutions":[{"id":"https://openalex.org/I76569877","display_name":"Southeast University","ror":"https://ror.org/04ct4d772","country_code":"CN","type":"education","lineage":["https://openalex.org/I76569877"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Gong-Zeng Liu","raw_affiliation_strings":["Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China"],"raw_orcid":"https://orcid.org/0009-0009-8786-6547","affiliations":[{"raw_affiliation_string":"Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China","institution_ids":["https://openalex.org/I76569877"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5159089129","display_name":"Lin-Feng Zhao","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I111599522","display_name":"Jiangnan University","ror":"https://ror.org/04mkzax54","country_code":"CN","type":"education","lineage":["https://openalex.org/I111599522"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Lin-Feng Zhao","raw_affiliation_strings":["Jiangsu Provincial Key Laboratory of MEMS Sensors and ASIC Manufacturing Technology, Jiangnan University, Wuxi, China","School of Integrated Circuits, Jiangnan University, Wuxi, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Jiangsu Provincial Key Laboratory of MEMS Sensors and ASIC Manufacturing Technology, Jiangnan University, Wuxi, China","institution_ids":["https://openalex.org/I111599522"]},{"raw_affiliation_string":"School of Integrated Circuits, Jiangnan University, Wuxi, China","institution_ids":["https://openalex.org/I111599522"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5159077401","display_name":"Jie Zhang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I76569877","display_name":"Southeast University","ror":"https://ror.org/04ct4d772","country_code":"CN","type":"education","lineage":["https://openalex.org/I76569877"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jie Zhang","raw_affiliation_strings":["Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China","institution_ids":["https://openalex.org/I76569877"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100408628","display_name":"Xiang Liu","orcid":"https://orcid.org/0000-0003-1588-6185","observed_orcids":["https://orcid.org/0000-0003-1588-6185"]},"institutions":[{"id":"https://openalex.org/I76569877","display_name":"Southeast University","ror":"https://ror.org/04ct4d772","country_code":"CN","type":"education","lineage":["https://openalex.org/I76569877"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiang Liu","raw_affiliation_strings":["Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China","institution_ids":["https://openalex.org/I76569877"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5159057800","display_name":"Yi-Meng Lv","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I76569877","display_name":"Southeast University","ror":"https://ror.org/04ct4d772","country_code":"CN","type":"education","lineage":["https://openalex.org/I76569877"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yi-Meng Lv","raw_affiliation_strings":["Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China","institution_ids":["https://openalex.org/I76569877"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5159069346","display_name":"Tian-Yu Geng","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I76569877","display_name":"Southeast University","ror":"https://ror.org/04ct4d772","country_code":"CN","type":"education","lineage":["https://openalex.org/I76569877"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Tian-Yu Geng","raw_affiliation_strings":["Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China","institution_ids":["https://openalex.org/I76569877"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5062146745","display_name":"Zai\u2010Fa Zhou","orcid":"https://orcid.org/0000-0002-2608-8480","observed_orcids":["https://orcid.org/0000-0002-2608-8480"]},"institutions":[{"id":"https://openalex.org/I76569877","display_name":"Southeast University","ror":"https://ror.org/04ct4d772","country_code":"CN","type":"education","lineage":["https://openalex.org/I76569877"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Zai-Fa Zhou","raw_affiliation_strings":["Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China. zfzhou@seu.edu.cn"],"raw_orcid":"https://orcid.org/0000-0002-2608-8480","affiliations":[{"raw_affiliation_string":"Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China. zfzhou@seu.edu.cn","institution_ids":["https://openalex.org/I76569877"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5062146745"],"corresponding_institution_ids":["https://openalex.org/I76569877"],"apc_list":{"value":3790,"currency":"USD","value_usd":3790},"apc_paid":{"value":3790,"currency":"USD","value_usd":3790},"fwci":0.0,"has_fulltext":true,"cited_by_count":0,"citation_normalized_percentile":{"value":0.72772121,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"12","issue":"1","first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11115","display_name":"Topology Optimization in Engineering","score":0.98580002784729,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11115","display_name":"Topology Optimization in Engineering","score":0.98580002784729,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.013799999840557575,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10100","display_name":"Metaheuristic Optimization Algorithms Research","score":0.0,"subfield":{"id":"https://openalex.org/subfields/1702","display_name":"Artificial Intelligence"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/topology-optimization","display_name":"topology optimization","score":0.7580000162124634},{"id":"https://openalex.org/keywords/mems-microstructures","display_name":"MEMS microstructures","score":0.8619999885559082},{"id":"https://openalex.org/keywords/fabrication-aware-design","display_name":"fabrication-aware design","score":0.6909999847412109},{"id":"https://openalex.org/keywords/heuristic-optimization","display_name":"heuristic optimization","score":0.8339999914169312},{"id":"https://openalex.org/keywords/surrogate-modeling","display_name":"surrogate models","score":0.6320000290870667},{"id":"https://openalex.org/keywords/electrothermal-simulation","display_name":"electro-thermal simulation","score":0.5989999771118164},{"id":"https://openalex.org/keywords/microheaters","display_name":"microheaters","score":0.6200000047683716},{"id":"https://openalex.org/keywords/micro-springs","display_name":"micro-springs","score":0.609000027179718},{"id":"https://openalex.org/keywords/infrared-thermography","display_name":"infrared thermography","score":0.5770000219345093},{"id":"https://openalex.org/keywords/von-mises-stress","display_name":"von Mises stress","score":0.7419999837875366}],"concepts":[{"id":"https://openalex.org/C189216461","wikidata":"https://www.wikidata.org/wiki/Q2443456","display_name":"Topology optimization","level":3,"score":0.6567000150680542},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.6161999702453613},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4921000003814697},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.4805000126361847},{"id":"https://openalex.org/C3770464","wikidata":"https://www.wikidata.org/wiki/Q775963","display_name":"Smoothing","level":2,"score":0.46540001034736633},{"id":"https://openalex.org/C2776359362","wikidata":"https://www.wikidata.org/wiki/Q2145286","display_name":"Representation (politics)","level":3,"score":0.45339998602867126},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.4307999908924103},{"id":"https://openalex.org/C173801870","wikidata":"https://www.wikidata.org/wiki/Q201413","display_name":"Heuristic","level":2,"score":0.42730000615119934},{"id":"https://openalex.org/C6899612","wikidata":"https://www.wikidata.org/wiki/Q852911","display_name":"Resistive touchscreen","level":2,"score":0.4212999939918518},{"id":"https://openalex.org/C62354387","wikidata":"https://www.wikidata.org/wiki/Q875399","display_name":"Boundary (topology)","level":2,"score":0.3693999946117401},{"id":"https://openalex.org/C79772673","wikidata":"https://www.wikidata.org/wiki/Q5156643","display_name":"Compliant mechanism","level":3,"score":0.3628000020980835},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.34860000014305115},{"id":"https://openalex.org/C18648836","wikidata":"https://www.wikidata.org/wiki/Q381892","display_name":"Compact space","level":2,"score":0.32850000262260437},{"id":"https://openalex.org/C208081375","wikidata":"https://www.wikidata.org/wiki/Q274502","display_name":"Degrees of freedom (physics and chemistry)","level":2,"score":0.2919999957084656},{"id":"https://openalex.org/C137836250","wikidata":"https://www.wikidata.org/wiki/Q984063","display_name":"Optimization problem","level":2,"score":0.2881999909877777},{"id":"https://openalex.org/C117258860","wikidata":"https://www.wikidata.org/wiki/Q895153","display_name":"Boundary representation","level":3,"score":0.27959999442100525},{"id":"https://openalex.org/C142575187","wikidata":"https://www.wikidata.org/wiki/Q3358290","display_name":"Pyramid (geometry)","level":2,"score":0.2736000120639801},{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.26910001039505005},{"id":"https://openalex.org/C143588538","wikidata":"https://www.wikidata.org/wiki/Q613628","display_name":"Primary mirror","level":3,"score":0.2655999958515167},{"id":"https://openalex.org/C43521106","wikidata":"https://www.wikidata.org/wiki/Q2165493","display_name":"Pipeline (software)","level":2,"score":0.26460000872612},{"id":"https://openalex.org/C2781089630","wikidata":"https://www.wikidata.org/wiki/Q21856745","display_name":"Realization (probability)","level":2,"score":0.2635999917984009},{"id":"https://openalex.org/C2778370241","wikidata":"https://www.wikidata.org/wiki/Q18386598","display_name":"Parametric design","level":3,"score":0.26170000433921814},{"id":"https://openalex.org/C166689943","wikidata":"https://www.wikidata.org/wiki/Q850283","display_name":"Interferometry","level":2,"score":0.2538999915122986},{"id":"https://openalex.org/C135252773","wikidata":"https://www.wikidata.org/wiki/Q1567213","display_name":"Inverse problem","level":2,"score":0.25380000472068787}],"mesh":[],"locations_count":4,"locations":[{"id":"doi:10.1038/s41378-026-01470-3","doi":"https://doi.org/10.1038/s41378-026-01470-3","is_oa":true,"landing_page_url":"https://doi.org/10.1038/s41378-026-01470-3","pdf_url":"https://www.nature.com/articles/s41378-026-01470-3.pdf","source":{"id":"https://openalex.org/S2739050901","display_name":"Microsystems & Nanoengineering","issn_l":"2055-7434","issn":["2055-7434","2096-1030"],"is_oa":true,"is_in_doaj":true,"is_core":true,"listed_in":["cwts-core","doaj","dongbi-b","jufo-2","ki-jl-1","norway-1","oarl","poland-140","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319965","host_organization_name":"Springer Nature","host_organization_lineage":["https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Nature"],"type":"journal"},"license":"cc-by-nc-nd","license_id":"https://openalex.org/licenses/cc-by-nc-nd","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microsystems &amp; Nanoengineering","raw_type":"journal-article"},{"id":"pmh:oai:pubmedcentral.nih.gov:13680617","doi":null,"is_oa":true,"landing_page_url":"https://pmc.ncbi.nlm.nih.gov/articles/PMC13680617/","pdf_url":"https://pmc.ncbi.nlm.nih.gov/articles/PMC13680617/pdf/41378_2026_Article_1470.pdf","source":{"id":"https://openalex.org/S2764455111","display_name":"PubMed Central","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-nc-nd","license_id":"https://openalex.org/licenses/cc-by-nc-nd","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microsyst Nanoeng","raw_type":"Text"},{"id":"pmid:42897129","doi":null,"is_oa":false,"landing_page_url":"https://pubmed.ncbi.nlm.nih.gov/42897129","pdf_url":null,"source":{"id":"https://openalex.org/S4306525036","display_name":"PubMed","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microsystems & nanoengineering","raw_type":"Journal Article"},{"id":"pmh:oai:doaj.org/article:6bf660bd227c4231a14c870545007537","doi":null,"is_oa":false,"landing_page_url":"https://doaj.org/article/6bf660bd227c4231a14c870545007537","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Microsystems & Nanoengineering, Vol 12, Iss 1 (2026)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1038/s41378-026-01470-3","doi":"https://doi.org/10.1038/s41378-026-01470-3","is_oa":true,"landing_page_url":"https://doi.org/10.1038/s41378-026-01470-3","pdf_url":"https://www.nature.com/articles/s41378-026-01470-3.pdf","source":{"id":"https://openalex.org/S2739050901","display_name":"Microsystems & Nanoengineering","issn_l":"2055-7434","issn":["2055-7434","2096-1030"],"is_oa":true,"is_in_doaj":true,"is_core":true,"listed_in":["cwts-core","doaj","dongbi-b","jufo-2","ki-jl-1","norway-1","oarl","poland-140","russia-white-list-1"],"host_organization":"https://openalex.org/P4310319965","host_organization_name":"Springer Nature","host_organization_lineage":["https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Nature"],"type":"journal"},"license":"cc-by-nc-nd","license_id":"https://openalex.org/licenses/cc-by-nc-nd","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microsystems &amp; Nanoengineering","raw_type":"journal-article"},"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.5378999710083008}],"study_designs":[],"awards":[{"id":"https://openalex.org/G764953745","display_name":null,"funder_award_id":"62474040","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W7222930828.pdf","grobid_xml":"https://content.openalex.org/works/W7222930828.grobid-xml"},"referenced_works_count":33,"referenced_works":["https://openalex.org/W814858607","https://openalex.org/W1978036641","https://openalex.org/W2018488200","https://openalex.org/W2019982726","https://openalex.org/W2069401367","https://openalex.org/W2115679587","https://openalex.org/W2126105956","https://openalex.org/W2132941586","https://openalex.org/W2158862486","https://openalex.org/W2167580870","https://openalex.org/W3106486741","https://openalex.org/W3107139496","https://openalex.org/W3114517772","https://openalex.org/W3212624517","https://openalex.org/W4293796968","https://openalex.org/W4298156653","https://openalex.org/W4308480341","https://openalex.org/W4315783969","https://openalex.org/W4319222154","https://openalex.org/W4387385563","https://openalex.org/W4388033884","https://openalex.org/W4389252835","https://openalex.org/W4392251663","https://openalex.org/W4402021690","https://openalex.org/W4402039549","https://openalex.org/W4403891721","https://openalex.org/W4403891731","https://openalex.org/W4406352511","https://openalex.org/W4409704795","https://openalex.org/W4410631731","https://openalex.org/W4411576228","https://openalex.org/W7161790477","https://openalex.org/W7170161323"],"related_works":["https://openalex.org/W578589003","https://openalex.org/W2094343926","https://openalex.org/W2167156298","https://openalex.org/W1899536603","https://openalex.org/W2806471113","https://openalex.org/W2529816824","https://openalex.org/W2261416386","https://openalex.org/W76524912","https://openalex.org/W2553667140","https://openalex.org/W3201101648"],"abstract_inverted_index":{"This":[0,105],"work":[1],"proposes":[2],"a":[3,108,141,151,164,207,241],"vectorized":[4],"generative":[5],"representation":[6,72,239],"for":[7,52,144,154,245],"fabrication-aware":[8],"heuristic":[9,48],"topology":[10,30,88],"optimization":[11,243],"of":[12,66,184,236],"path-defined":[13,246],"MEMS":[14,26,54,167,247],"microstructures,":[15],"addressing":[16],"the":[17,62,67,102,127,171,180,192,234,237],"trade-off":[18],"between":[19],"topological":[20],"freedom":[21,35],"and":[22,36,64,96,119,148,229],"fabrication":[23,129],"feasibility":[24],"in":[25,113],"inverse":[27],"design.":[28],"Pixel-level":[29],"descriptions":[31],"provide":[32],"high":[33],"design":[34,68,80],"often":[37],"require":[38],"additional":[39],"constraints":[40,130],"to":[41,189,202],"suppress":[42],"disconnected":[43],"or":[44],"fabrication-incompatible":[45],"layouts.":[46],"Meanwhile,":[47],"algorithms":[49],"are":[50,131],"attractive":[51],"non-gradient":[53],"optimization,":[55],"yet":[56],"their":[57],"efficiency":[58],"depends":[59],"critically":[60],"on":[61],"compactness":[63],"validity":[65],"representation.":[69],"The":[70],"proposed":[71,238],"addresses":[73],"this":[74],"limitation":[75],"by":[76,216,224],"mapping":[77],"low-dimensional":[78],"continuous":[79,110],"variables":[81],"into":[82,101],"connected,":[83],"fabrication-compatible":[84,242],"physical":[85,251],"layouts,":[86],"with":[87],"evolution,":[89],"boundary":[90],"compatibility,":[91],"linewidth":[92,121],"modulation,":[93],"spacing":[94],"constraints,":[95],"geometric":[97],"smoothing":[98],"embedded":[99],"directly":[100],"generation":[103],"process.":[104],"formulation":[106],"provides":[107],"compact":[109],"search":[111],"space":[112],"which":[114],"path":[115],"topology,":[116],"spatial":[117],"deployment,":[118],"local":[120],"can":[122],"be":[123],"jointly":[124],"explored":[125],"while":[126,191,218],"prescribed":[128],"maintained":[132],"during":[133,161],"decoding.":[134],"Each":[135],"generated":[136],"layout":[137],"is":[138],"exported":[139],"as":[140,150,170,240],"vector":[142],"geometry":[143],"finite-element":[145],"electrothermal":[146],"labeling":[147],"rasterized":[149],"morphology":[152],"image":[153],"surrogate-model":[155],"training,":[156],"enabling":[157],"rapid":[158],"performance":[159],"prediction":[160],"optimization.":[162],"In":[163],"resistive":[165],"thermal":[166],"microheater":[168],"used":[169],"primary":[172],"experimental":[173],"validation":[174],"case,":[175],"infrared":[176],"thermography":[177],"showed":[178],"that":[179],"measured":[181],"temperature":[182],"coefficient":[183],"variation":[185],"decreased":[186,223],"from":[187,200,206],"4.04%":[188],"1.22%,":[190],"\u00b12":[193],"\u00b0C":[194],"effective":[195],"isothermal":[196],"area":[197],"ratio":[198],"increased":[199,215],"34.7%":[201],"95.6%.":[203],"Finite-element":[204],"results":[205,232],"compliant":[208],"micro-spring":[209],"case":[210],"demonstrated":[211],"transferability:":[212],"in-plane":[213],"displacement":[214],"30.6%,":[217],"peak":[219],"von":[220],"Mises":[221],"stress":[222],"16.3%":[225],"under":[226,249],"matched":[227],"footprint":[228],"loading.":[230],"These":[231],"demonstrate":[233],"applicability":[235],"interface":[244],"microstructures":[248],"distinct":[250],"objectives.":[252]},"counts_by_year":[],"updated_date":"2026-10-29T09:56:32.521200","created_date":"2026-10-20T00:00:00"}
