{"id":"https://openalex.org/W7214208676","doi":"https://doi.org/10.48550/arxiv.2609.27618","title":"Thermoreflectance-Based Techniques for Micro- and Nanoscale Thermophysical Property Measurements: Principles, Methods, and Recent Advances","display_name":"Thermoreflectance-Based Techniques for Micro- and Nanoscale Thermophysical Property Measurements: Principles, Methods, and Recent Advances","publication_year":2026,"publication_date":"2026-09-23","ids":{"openalex":"https://openalex.org/W7214208676","doi":"https://doi.org/10.48550/arxiv.2609.27618"},"language":"en","primary_location":{"id":"pmh:oai:arXiv.org:2609.27618","doi":null,"is_oa":true,"landing_page_url":"https://arxiv.org/abs/2609.27618","pdf_url":"https://arxiv.org/pdf/2609.27618","source":{"id":"https://openalex.org/S4306400194","display_name":"arXiv (Cornell University)","issn_l":"2331-8422","issn":["2331-8422"],"is_oa":true,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I205783295","host_organization_name":"Cornell University","host_organization_lineage":["https://openalex.org/I205783295"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"text"},"volume":null,"type":"preprint","is_traditional":true,"indexed_in":["arxiv","datacite"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://arxiv.org/pdf/2609.27618","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5078091245","display_name":"Puqing Jiang","orcid":"https://orcid.org/0000-0002-1942-9259","observed_orcids":["https://orcid.org/0000-0002-1942-9259"]},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jiang, Puqing","raw_affiliation_strings":[". School of Energy and Power Engineering , Huazhong University of Science and Technology , Wuhan 430074 , China;"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":". School of Energy and Power Engineering , Huazhong University of Science and Technology , Wuhan 430074 , China;","institution_ids":["https://openalex.org/I47720641"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5152728436","display_name":"Shanshan Chen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I78988378","display_name":"Renmin University of China","ror":"https://ror.org/041pakw92","country_code":"CN","type":"education","lineage":["https://openalex.org/I78988378"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chen, Shanshan","raw_affiliation_strings":[". School of Physics , Renmin University of China , Beijing 100872 , China;"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":". School of Physics , Renmin University of China , Beijing 100872 , China;","institution_ids":["https://openalex.org/I78988378"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5152595262","display_name":"Xiaobo Li","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Li, Xiaobo","raw_affiliation_strings":[". School of Energy and Power Engineering , Huazhong University of Science and Technology , Wuhan 430074 , China;"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":". School of Energy and Power Engineering , Huazhong University of Science and Technology , Wuhan 430074 , China;","institution_ids":["https://openalex.org/I47720641"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5026432177","display_name":"Ronggui Yang","orcid":"https://orcid.org/0000-0002-3602-6945","observed_orcids":["https://orcid.org/0000-0002-3602-6945","https://orcid.org/0009-0000-2284-3445"]},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yang, Ronggui","raw_affiliation_strings":[". Department of Energy and Resources Engineering , College of Engineering , Peking University , Beijing 100871 , China",". School of Energy and Power Engineering , Huazhong University of Science and Technology , Wuhan 430074 , China;"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":". Department of Energy and Resources Engineering , College of Engineering , Peking University , Beijing 100871 , China","institution_ids":["https://openalex.org/I20231570"]},{"raw_affiliation_string":". School of Energy and Power Engineering , Huazhong University of Science and Technology , Wuhan 430074 , China;","institution_ids":["https://openalex.org/I47720641"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":true,"cited_by_count":0,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9779999852180481,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9779999852180481,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11856","display_name":"Thermography and Photoacoustic Techniques","score":0.020800000056624413,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12442","display_name":"Thermal Radiation and Cooling Technologies","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermoreflectance","display_name":"thermoreflectance","score":0.9710000157356262},{"id":"https://openalex.org/keywords/transient-thermoreflectance","display_name":"transient thermoreflectance","score":0.8830000162124634},{"id":"https://openalex.org/keywords/time-domain-thermoreflectance","display_name":"time-domain thermoreflectance","score":0.9929999709129333},{"id":"https://openalex.org/keywords/frequency-domain-thermoreflectance","display_name":"frequency-domain thermoreflectance","score":0.9990000128746033},{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"thermal conductivity","score":0.7760000228881836},{"id":"https://openalex.org/keywords/interfacial-thermal-conductance","display_name":"interfacial thermal conductance","score":0.9959999918937683},{"id":"https://openalex.org/keywords/volumetric-heat-capacity","display_name":"volumetric heat capacity","score":0.9869999885559082},{"id":"https://openalex.org/keywords/thin-film-thermal-conductivity","display_name":"thin film thermal conductivity","score":0.7540000081062317},{"id":"https://openalex.org/keywords/anisotropic-films","display_name":"anisotropic films","score":0.7379999756813049},{"id":"https://openalex.org/keywords/multilayer-heterostructures","display_name":"multilayer heterostructures","score":0.9789999723434448},{"id":"https://openalex.org/keywords/thermal-diffusion","display_name":"thermal diffusion","score":0.47200000286102295},{"id":"https://openalex.org/keywords/thermal-management-of-electronic-devices","display_name":"thermal management of electronic devices","score":0.6069999933242798},{"id":"https://openalex.org/keywords/low-thermal-conductivity-materials","display_name":"low thermal conductivity materials","score":0.8209999799728394}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7235000133514404},{"id":"https://openalex.org/C46435376","wikidata":"https://www.wikidata.org/wiki/Q1829750","display_name":"Multiphysics","level":3,"score":0.6740999817848206},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.635200023651123},{"id":"https://openalex.org/C45206210","wikidata":"https://www.wikidata.org/wiki/Q2415817","display_name":"Nanoscopic scale","level":2,"score":0.5860000252723694},{"id":"https://openalex.org/C182606246","wikidata":"https://www.wikidata.org/wiki/Q7187926","display_name":"Photothermal therapy","level":2,"score":0.5503000020980835},{"id":"https://openalex.org/C2780841128","wikidata":"https://www.wikidata.org/wiki/Q5073781","display_name":"Characterization (materials science)","level":2,"score":0.5223000049591064},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.5103999972343445},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.45879998803138733},{"id":"https://openalex.org/C108225325","wikidata":"https://www.wikidata.org/wiki/Q11456","display_name":"Semiconductor","level":2,"score":0.44920000433921814},{"id":"https://openalex.org/C2780799671","wikidata":"https://www.wikidata.org/wiki/Q17087362","display_name":"Transient (computer programming)","level":2,"score":0.4359000027179718},{"id":"https://openalex.org/C72293138","wikidata":"https://www.wikidata.org/wiki/Q909741","display_name":"Temperature measurement","level":2,"score":0.41100001335144043},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.40709999203681946},{"id":"https://openalex.org/C85725439","wikidata":"https://www.wikidata.org/wiki/Q466686","display_name":"Anisotropy","level":2,"score":0.34769999980926514},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.3386000096797943},{"id":"https://openalex.org/C102232406","wikidata":"https://www.wikidata.org/wiki/Q7783035","display_name":"Thermal conductivity measurement","level":3,"score":0.3237999975681305},{"id":"https://openalex.org/C31555180","wikidata":"https://www.wikidata.org/wiki/Q3523867","display_name":"Material properties","level":2,"score":0.320499986410141},{"id":"https://openalex.org/C32993116","wikidata":"https://www.wikidata.org/wiki/Q903715","display_name":"Pyrometer","level":3,"score":0.31279999017715454},{"id":"https://openalex.org/C2778755073","wikidata":"https://www.wikidata.org/wiki/Q10858537","display_name":"Scale (ratio)","level":2,"score":0.3095000088214874},{"id":"https://openalex.org/C2985596519","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat flow","level":3,"score":0.29750001430511475},{"id":"https://openalex.org/C189950617","wikidata":"https://www.wikidata.org/wiki/Q937228","display_name":"Property (philosophy)","level":2,"score":0.2955000102519989},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.29510000348091125},{"id":"https://openalex.org/C2777425595","wikidata":"https://www.wikidata.org/wiki/Q7187925","display_name":"Photothermal spectroscopy","level":3,"score":0.2897000014781952},{"id":"https://openalex.org/C50517652","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat transfer","level":2,"score":0.2896000146865845},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2800999879837036},{"id":"https://openalex.org/C205372480","wikidata":"https://www.wikidata.org/wiki/Q210521","display_name":"Image resolution","level":2,"score":0.27000001072883606},{"id":"https://openalex.org/C2986710310","wikidata":"https://www.wikidata.org/wiki/Q11456","display_name":"Electronic materials","level":2,"score":0.2513999938964844}],"mesh":[],"locations_count":2,"locations":[{"id":"pmh:oai:arXiv.org:2609.27618","doi":null,"is_oa":true,"landing_page_url":"https://arxiv.org/abs/2609.27618","pdf_url":"https://arxiv.org/pdf/2609.27618","source":{"id":"https://openalex.org/S4306400194","display_name":"arXiv (Cornell University)","issn_l":"2331-8422","issn":["2331-8422"],"is_oa":true,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I205783295","host_organization_name":"Cornell University","host_organization_lineage":["https://openalex.org/I205783295"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"text"},{"id":"doi:10.48550/arxiv.2609.27618","doi":"https://doi.org/10.48550/arxiv.2609.27618","is_oa":true,"landing_page_url":"https://doi.org/10.48550/arxiv.2609.27618","pdf_url":null,"source":{"id":"https://openalex.org/S4306400194","display_name":"arXiv (Cornell University)","issn_l":"2331-8422","issn":["2331-8422"],"is_oa":true,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I205783295","host_organization_name":"Cornell University","host_organization_lineage":["https://openalex.org/I205783295"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":null,"is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"Preprint"}],"best_oa_location":{"id":"pmh:oai:arXiv.org:2609.27618","doi":null,"is_oa":true,"landing_page_url":"https://arxiv.org/abs/2609.27618","pdf_url":"https://arxiv.org/pdf/2609.27618","source":{"id":"https://openalex.org/S4306400194","display_name":"arXiv (Cornell University)","issn_l":"2331-8422","issn":["2331-8422"],"is_oa":true,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I205783295","host_organization_name":"Cornell University","host_organization_lineage":["https://openalex.org/I205783295"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"text"},"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W7214208676.pdf","grobid_xml":"https://content.openalex.org/works/W7214208676.grobid-xml"},"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2980689262","https://openalex.org/W3091459166","https://openalex.org/W6927262724","https://openalex.org/W7030168944","https://openalex.org/W2987048661","https://openalex.org/W6944284041","https://openalex.org/W2036784309","https://openalex.org/W2076220136","https://openalex.org/W2885379151","https://openalex.org/W7117963700"],"abstract_inverted_index":{"As":[0],"semiconductor":[1],"devices":[2],"shrink":[3],"toward":[4],"the":[5,83,106],"nanoscale,":[6],"heat":[7,38,161],"transport":[8],"and":[9,14,23,36,46,62,65,76,86,105,128,142,159,180],"thermal-energy-storage":[10],"behavior":[11],"in":[12,121],"materials":[13],"interfaces":[15],"become":[16],"increasingly":[17],"dependent":[18],"on":[19],"length":[20],"scale,":[21],"structure,":[22],"interfaces.":[24],"Accurate":[25],"characterization":[26],"of":[27,49,89,123],"thermophysical":[28,78],"properties,":[29],"including":[30,168],"thermal":[31,34,47,154,157],"conductivity,":[32,155],"interfacial":[33,156],"conductance,":[35,158],"volumetric":[37],"capacity,":[39],"is":[40,115],"therefore":[41],"essential":[42],"for":[43,74,135,151],"functional-material":[44],"design":[45],"management":[48],"advanced":[50],"electronic":[51],"devices.":[52],"Photothermal":[53],"thermoreflectance":[54,91,94,97,100,103],"techniques":[55],"provide":[56],"noncontact":[57],"measurements":[58],"with":[59],"high":[60],"spatial":[61],"temporal":[63],"resolution":[64],"a":[66],"broad":[67],"measurement":[68,126],"range,":[69],"making":[70],"them":[71],"important":[72],"tools":[73],"micro-":[75],"nanoscale":[77],"characterization.":[79],"This":[80],"review":[81],"examines":[82],"physical":[84],"principles":[85],"technical":[87],"characteristics":[88],"transient":[90],"(TTR),":[92],"time-domain":[93],"(TDTR),":[95],"frequency-domain":[96],"(FDTR),":[98],"steady-state":[99],"(SSTR),":[101],"spatial-domain":[102],"(SDTR),":[104],"square-pulsed":[107],"source":[108],"(SPS)":[109],"method.":[110],"A":[111],"unified":[112],"heat-diffusion":[113],"framework":[114],"established":[116],"to":[117],"compare":[118],"these":[119],"methods":[120],"terms":[122],"parameter":[124],"sensitivity,":[125],"uncertainty,":[127],"applicability.":[129],"Representative":[130],"applications":[131],"illustrate":[132],"their":[133,148],"suitability":[134],"low-thermal-conductivity":[136],"materials,":[137,141],"anisotropic":[138],"films,":[139],"crystalline":[140],"multilayer":[143],"heterostructures,":[144],"as":[145,147],"well":[146],"complementary":[149],"capabilities":[150],"characterizing":[152],"thin-film":[153],"in-plane/cross-plane":[160],"transport.":[162],"Finally,":[163],"emerging":[164],"directions":[165],"are":[166],"discussed,":[167],"ultrahigh":[169],"spatiotemporal":[170],"resolution,":[171],"multiphysics":[172],"coupling,":[173],"in-line":[174],"industrial":[175],"inspection,":[176],"intelligent":[177],"data":[178],"processing,":[179],"natural-language-driven":[181],"analysis.":[182]},"counts_by_year":[],"updated_date":"2026-10-28T10:33:24.094632","created_date":"2026-09-25T00:00:00"}