{"id":"https://openalex.org/W7203661595","doi":"https://doi.org/10.1002/smll.75261","title":"Mitigating Contact\u2010Constricted Thermal Bottlenecks by Magnetically Programmable hBN Bridge Fillers in Al 2 O 3 /Epoxy Composites","display_name":"Mitigating Contact\u2010Constricted Thermal Bottlenecks by Magnetically Programmable hBN Bridge Fillers in Al 2 O 3 /Epoxy Composites","publication_year":2026,"publication_date":"2026-08-18","ids":{"openalex":"https://openalex.org/W7203661595","doi":"https://doi.org/10.1002/smll.75261","pmid":"https://pubmed.ncbi.nlm.nih.gov/42610494","pmcid":"https://www.ncbi.nlm.nih.gov/pmc/articles/13690618"},"language":"en","primary_location":{"id":"doi:10.1002/smll.75261","doi":"https://doi.org/10.1002/smll.75261","is_oa":true,"landing_page_url":"https://doi.org/10.1002/smll.75261","pdf_url":"https://onlinelibrary.wiley.com/doi/pdfdirect/10.1002/smll.75261","source":{"id":"https://openalex.org/S94619837","display_name":"Small","issn_l":"1613-6810","issn":["1613-6810","1613-6829"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-3","ki-jl-2","medline","norway-2","poland-200","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320595","host_organization_name":"Wiley","host_organization_lineage":["https://openalex.org/P4310320595"],"host_organization_lineage_names":["Wiley"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Small","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref","pubmed"],"open_access":{"is_oa":true,"oa_status":"hybrid","oa_url":"https://onlinelibrary.wiley.com/doi/pdfdirect/10.1002/smll.75261","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5102694203","display_name":"Yeonwook Jeong","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I848706","display_name":"Sungkyunkwan University","ror":"https://ror.org/04q78tk20","country_code":"KR","type":"education","lineage":["https://openalex.org/I848706"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Yeonwook Jeong","raw_affiliation_strings":["Department of Semiconductor Convergence Engineering Sungkyunkwan University  Suwon South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Semiconductor Convergence Engineering Sungkyunkwan University  Suwon South Korea","institution_ids":["https://openalex.org/I848706"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5147414817","display_name":"Sabina Ghorsaine","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I848706","display_name":"Sungkyunkwan University","ror":"https://ror.org/04q78tk20","country_code":"KR","type":"education","lineage":["https://openalex.org/I848706"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sabina Ghorsaine","raw_affiliation_strings":["Department of Semiconductor Convergence Engineering Sungkyunkwan University  Suwon South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Semiconductor Convergence Engineering Sungkyunkwan University  Suwon South Korea","institution_ids":["https://openalex.org/I848706"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5069400746","display_name":"Chan-Jae Lee","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210131650","display_name":"Korea Electronics Technology Institute","ror":"https://ror.org/039k6f508","country_code":"KR","type":"facility","lineage":["https://openalex.org/I2801339556","https://openalex.org/I4210089395","https://openalex.org/I4210131650"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Chan\u2010Jae Lee","raw_affiliation_strings":["Display Research Center Korea Electronics Technology Institute  Seongnam South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Display Research Center Korea Electronics Technology Institute  Seongnam South Korea","institution_ids":["https://openalex.org/I4210131650"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5128341746","display_name":"In Kim","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4399598381","display_name":"Samsung Advanced Institute of Technology (South Korea)","ror":"https://ror.org/04axnyp10","country_code":"KR","type":"company","lineage":["https://openalex.org/I4399598381"]},{"id":"https://openalex.org/I4405259277","display_name":"Samsung Electronics (South Korea)","ror":"https://ror.org/020m7t761","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973","https://openalex.org/I4405259277"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"In Kim","raw_affiliation_strings":["Samsung Electronics Device Solutions Samsung Advanced Institute of Technology  Suwon South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Samsung Electronics Device Solutions Samsung Advanced Institute of Technology  Suwon South Korea","institution_ids":["https://openalex.org/I4399598381","https://openalex.org/I4405259277"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5048622945","display_name":"Mooho Lee","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4399598381","display_name":"Samsung Advanced Institute of Technology (South Korea)","ror":"https://ror.org/04axnyp10","country_code":"KR","type":"company","lineage":["https://openalex.org/I4399598381"]},{"id":"https://openalex.org/I4405259277","display_name":"Samsung Electronics (South Korea)","ror":"https://ror.org/020m7t761","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973","https://openalex.org/I4405259277"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Mooho Lee","raw_affiliation_strings":["Samsung Electronics Device Solutions Samsung Advanced Institute of Technology  Suwon South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Samsung Electronics Device Solutions Samsung Advanced Institute of Technology  Suwon South Korea","institution_ids":["https://openalex.org/I4399598381","https://openalex.org/I4405259277"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022271522","display_name":"Hyejeong Lee","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4399598381","display_name":"Samsung Advanced Institute of Technology (South Korea)","ror":"https://ror.org/04axnyp10","country_code":"KR","type":"company","lineage":["https://openalex.org/I4399598381"]},{"id":"https://openalex.org/I4405259277","display_name":"Samsung Electronics (South Korea)","ror":"https://ror.org/020m7t761","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973","https://openalex.org/I4405259277"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hyejeong Lee","raw_affiliation_strings":["Samsung Electronics Device Solutions Samsung Advanced Institute of Technology  Suwon South Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Samsung Electronics Device Solutions Samsung Advanced Institute of Technology  Suwon South Korea","institution_ids":["https://openalex.org/I4399598381","https://openalex.org/I4405259277"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026935761","display_name":"\uae40\uae30\ub0a8","orcid":"https://orcid.org/0009-0001-9856-858X","observed_orcids":["https://orcid.org/0009-0001-9856-858X"]},"institutions":[{"id":"https://openalex.org/I848706","display_name":"Sungkyunkwan University","ror":"https://ror.org/04q78tk20","country_code":"KR","type":"education","lineage":["https://openalex.org/I848706"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Ginam Kim","raw_affiliation_strings":["Department of Semiconductor Convergence Engineering Sungkyunkwan University  Suwon South Korea"],"raw_orcid":"https://orcid.org/0009-0001-9856-858X","affiliations":[{"raw_affiliation_string":"Department of Semiconductor Convergence Engineering Sungkyunkwan University  Suwon South Korea","institution_ids":["https://openalex.org/I848706"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5004712180","display_name":"Jong\u2010Woong Kim","orcid":"https://orcid.org/0000-0003-4010-056X","observed_orcids":["https://orcid.org/0000-0003-4010-056X","https://orcid.org/0000-0003-0057-1893"]},"institutions":[{"id":"https://openalex.org/I848706","display_name":"Sungkyunkwan University","ror":"https://ror.org/04q78tk20","country_code":"KR","type":"education","lineage":["https://openalex.org/I848706"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Jong\u2010Woong Kim","raw_affiliation_strings":["Department of Semiconductor Convergence Engineering Sungkyunkwan University  Suwon South Korea"],"raw_orcid":"https://orcid.org/0000-0003-4010-056X","affiliations":[{"raw_affiliation_string":"Department of Semiconductor Convergence Engineering Sungkyunkwan University  Suwon South Korea","institution_ids":["https://openalex.org/I848706"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5004712180","https://openalex.org/A5026935761"],"corresponding_institution_ids":["https://openalex.org/I848706"],"apc_list":{"value":5790,"currency":"USD","value_usd":5790},"apc_paid":{"value":5790,"currency":"USD","value_usd":5790},"fwci":0.0,"has_fulltext":true,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"22","issue":"59","first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10511","display_name":"High voltage insulation and dielectric phenomena","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13116","display_name":"Heat Transfer and Numerical Methods","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermally-conductive-polymer-composites","display_name":"thermally conductive polymer composites","score":0.972000002861023},{"id":"https://openalex.org/keywords/hexagonal-boron-nitride","display_name":"hexagonal boron nitride","score":0.7720000147819519},{"id":"https://openalex.org/keywords/magnetic-alignment","display_name":"magnetic field alignment","score":0.6930000185966492},{"id":"https://openalex.org/keywords/alumina-filler","display_name":"alumina filler","score":0.7429999709129333},{"id":"https://openalex.org/keywords/epoxy-composites","display_name":"epoxy composites","score":0.8349999785423279},{"id":"https://openalex.org/keywords/through-plane-thermal-conductivity","display_name":"through-plane thermal conductivity","score":0.8309999704360962},{"id":"https://openalex.org/keywords/electrical-resistivity","display_name":"electrical resistivity","score":0.6880000233650208},{"id":"https://openalex.org/keywords/dielectric-properties","display_name":"dielectric properties","score":0.8100000023841858},{"id":"https://openalex.org/keywords/electronic-packaging-thermal-management","display_name":"electronic packaging thermal management","score":0.9430000185966492}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8824999928474426},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.7846999764442444},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.7662000060081482},{"id":"https://openalex.org/C104779481","wikidata":"https://www.wikidata.org/wiki/Q50707","display_name":"Composite number","level":2,"score":0.6621999740600586},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.5992000102996826},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5712000131607056},{"id":"https://openalex.org/C2780243435","wikidata":"https://www.wikidata.org/wiki/Q410193","display_name":"Boron nitride","level":2,"score":0.5461000204086304},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.5236999988555908},{"id":"https://openalex.org/C64839514","wikidata":"https://www.wikidata.org/wiki/Q918306","display_name":"Thermal insulation","level":3,"score":0.5091000199317932},{"id":"https://openalex.org/C166595027","wikidata":"https://www.wikidata.org/wiki/Q143983","display_name":"Epoxy","level":2,"score":0.4959999918937683},{"id":"https://openalex.org/C159188206","wikidata":"https://www.wikidata.org/wiki/Q1478382","display_name":"Heat flux","level":3,"score":0.39969998598098755},{"id":"https://openalex.org/C172100665","wikidata":"https://www.wikidata.org/wiki/Q7465774","display_name":"Thermal conduction","level":2,"score":0.382999986410141},{"id":"https://openalex.org/C69990965","wikidata":"https://www.wikidata.org/wiki/Q65402698","display_name":"Electrical resistivity and conductivity","level":2,"score":0.37779998779296875},{"id":"https://openalex.org/C45058047","wikidata":"https://www.wikidata.org/wiki/Q4119687","display_name":"Thermal contact conductance","level":4,"score":0.36000001430511475},{"id":"https://openalex.org/C6899612","wikidata":"https://www.wikidata.org/wiki/Q852911","display_name":"Resistive touchscreen","level":2,"score":0.34709998965263367},{"id":"https://openalex.org/C2778223994","wikidata":"https://www.wikidata.org/wiki/Q905592","display_name":"Filler (materials)","level":2,"score":0.34139999747276306},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.33959999680519104},{"id":"https://openalex.org/C91066073","wikidata":"https://www.wikidata.org/wiki/Q1417868","display_name":"Dielectric loss","level":3,"score":0.3352000117301941},{"id":"https://openalex.org/C20556612","wikidata":"https://www.wikidata.org/wiki/Q4469374","display_name":"Volume (thermodynamics)","level":2,"score":0.3230000138282776},{"id":"https://openalex.org/C74575197","wikidata":"https://www.wikidata.org/wiki/Q9941","display_name":"Non-blocking I/O","level":3,"score":0.3197999894618988},{"id":"https://openalex.org/C57863236","wikidata":"https://www.wikidata.org/wiki/Q1130571","display_name":"Doping","level":2,"score":0.2865000069141388},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.2831999957561493},{"id":"https://openalex.org/C186937647","wikidata":"https://www.wikidata.org/wiki/Q1796959","display_name":"Heat sink","level":2,"score":0.2791000008583069},{"id":"https://openalex.org/C200990466","wikidata":"https://www.wikidata.org/wiki/Q271707","display_name":"Rheology","level":2,"score":0.2775000035762787},{"id":"https://openalex.org/C521977710","wikidata":"https://www.wikidata.org/wiki/Q81163","display_name":"Polymer","level":2,"score":0.2630999982357025},{"id":"https://openalex.org/C194760766","wikidata":"https://www.wikidata.org/wiki/Q410851","display_name":"Nitride","level":3,"score":0.26170000433921814},{"id":"https://openalex.org/C501308230","wikidata":"https://www.wikidata.org/wiki/Q618","display_name":"Boron","level":2,"score":0.2612000107765198},{"id":"https://openalex.org/C157479481","wikidata":"https://www.wikidata.org/wiki/Q177831","display_name":"Magnetic flux","level":3,"score":0.257099986076355},{"id":"https://openalex.org/C142014798","wikidata":"https://www.wikidata.org/wiki/Q7783037","display_name":"Thermal contact","level":3,"score":0.2565999925136566}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1002/smll.75261","doi":"https://doi.org/10.1002/smll.75261","is_oa":true,"landing_page_url":"https://doi.org/10.1002/smll.75261","pdf_url":"https://onlinelibrary.wiley.com/doi/pdfdirect/10.1002/smll.75261","source":{"id":"https://openalex.org/S94619837","display_name":"Small","issn_l":"1613-6810","issn":["1613-6810","1613-6829"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-3","ki-jl-2","medline","norway-2","poland-200","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320595","host_organization_name":"Wiley","host_organization_lineage":["https://openalex.org/P4310320595"],"host_organization_lineage_names":["Wiley"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Small","raw_type":"journal-article"},{"id":"pmh:oai:pubmedcentral.nih.gov:13690618","doi":null,"is_oa":true,"landing_page_url":"https://pmc.ncbi.nlm.nih.gov/articles/PMC13690618/","pdf_url":"https://pmc.ncbi.nlm.nih.gov/articles/PMC13690618/pdf/SMLL-22-e75261.pdf","source":{"id":"https://openalex.org/S2764455111","display_name":"PubMed Central","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Small","raw_type":"Text"},{"id":"pmid:42610494","doi":null,"is_oa":false,"landing_page_url":"https://pubmed.ncbi.nlm.nih.gov/42610494","pdf_url":null,"source":{"id":"https://openalex.org/S4306525036","display_name":"PubMed","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I1299303238","host_organization_name":"National Institutes of Health","host_organization_lineage":["https://openalex.org/I1299303238"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Small (Weinheim an der Bergstrasse, Germany)","raw_type":"Journal Article"}],"best_oa_location":{"id":"doi:10.1002/smll.75261","doi":"https://doi.org/10.1002/smll.75261","is_oa":true,"landing_page_url":"https://doi.org/10.1002/smll.75261","pdf_url":"https://onlinelibrary.wiley.com/doi/pdfdirect/10.1002/smll.75261","source":{"id":"https://openalex.org/S94619837","display_name":"Small","issn_l":"1613-6810","issn":["1613-6810","1613-6829"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-3","ki-jl-2","medline","norway-2","poland-200","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320595","host_organization_name":"Wiley","host_organization_lineage":["https://openalex.org/P4310320595"],"host_organization_lineage_names":["Wiley"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Small","raw_type":"journal-article"},"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.651199996471405,"display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[{"id":"https://openalex.org/G1631555443","display_name":null,"funder_award_id":"RS-2026-25542986","funder_id":"https://openalex.org/F4320328359","funder_display_name":"Ministry of Science and ICT, South Korea"}],"funders":[{"id":"https://openalex.org/F4320315121","display_name":"Samsung Advanced Institute of Technology","ror":"https://ror.org/04axnyp10"},{"id":"https://openalex.org/F4320320671","display_name":"National Research Foundation","ror":"https://ror.org/05s0g1g46"},{"id":"https://openalex.org/F4320322120","display_name":"National Research Foundation of Korea","ror":"https://ror.org/013aysd81"},{"id":"https://openalex.org/F4320328359","display_name":"Ministry of Science and ICT, South Korea","ror":"https://ror.org/01wpjm123"},{"id":"https://openalex.org/F4320332195","display_name":"Samsung","ror":"https://ror.org/04w3jy968"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W7203661595.pdf","grobid_xml":"https://content.openalex.org/works/W7203661595.grobid-xml"},"referenced_works_count":77,"referenced_works":["https://openalex.org/W1925499295","https://openalex.org/W1991494207","https://openalex.org/W1999396445","https://openalex.org/W2040108995","https://openalex.org/W2319155157","https://openalex.org/W2471219268","https://openalex.org/W2510069246","https://openalex.org/W2567727594","https://openalex.org/W2589044671","https://openalex.org/W2601793997","https://openalex.org/W2789969194","https://openalex.org/W2790253064","https://openalex.org/W2884176621","https://openalex.org/W2906454442","https://openalex.org/W2995949883","https://openalex.org/W3008581557","https://openalex.org/W3010786543","https://openalex.org/W3114428776","https://openalex.org/W3122195676","https://openalex.org/W3148213177","https://openalex.org/W3163639760","https://openalex.org/W3166240002","https://openalex.org/W3168592110","https://openalex.org/W3169804600","https://openalex.org/W3188626394","https://openalex.org/W3206054910","https://openalex.org/W4206731623","https://openalex.org/W4220962024","https://openalex.org/W4220993618","https://openalex.org/W4280624869","https://openalex.org/W4292448834","https://openalex.org/W4306317946","https://openalex.org/W4317612192","https://openalex.org/W4323871093","https://openalex.org/W4327702738","https://openalex.org/W4361270073","https://openalex.org/W4382405278","https://openalex.org/W4384824165","https://openalex.org/W4385337146","https://openalex.org/W4386318736","https://openalex.org/W4386423252","https://openalex.org/W4386568123","https://openalex.org/W4390883909","https://openalex.org/W4394603419","https://openalex.org/W4396980446","https://openalex.org/W4399220623","https://openalex.org/W4399613879","https://openalex.org/W4400328599","https://openalex.org/W4401056137","https://openalex.org/W4401586339","https://openalex.org/W4403155257","https://openalex.org/W4403706213","https://openalex.org/W4404443097","https://openalex.org/W4405428101","https://openalex.org/W4405542607","https://openalex.org/W4405763099","https://openalex.org/W4406080245","https://openalex.org/W4406264648","https://openalex.org/W4408965844","https://openalex.org/W4409524295","https://openalex.org/W4409710896","https://openalex.org/W4411022691","https://openalex.org/W4411201735","https://openalex.org/W4413755229","https://openalex.org/W4414222869","https://openalex.org/W4414297875","https://openalex.org/W4414473706","https://openalex.org/W4416426567","https://openalex.org/W4416460581","https://openalex.org/W4417415347","https://openalex.org/W7123358948","https://openalex.org/W7125602414","https://openalex.org/W7128598727","https://openalex.org/W7135040405","https://openalex.org/W7135245586","https://openalex.org/W7143363893","https://openalex.org/W7168133430"],"related_works":["https://openalex.org/W3214028037","https://openalex.org/W7084503694","https://openalex.org/W4390238449","https://openalex.org/W3200823027","https://openalex.org/W4322492479","https://openalex.org/W4382405278","https://openalex.org/W4294795968","https://openalex.org/W4401560401","https://openalex.org/W2092888011","https://openalex.org/W7161385331"],"abstract_inverted_index":{"ABSTRACT":[0],"Thermally":[1],"conductive":[2],"polymer":[3],"composites":[4,226],"often":[5],"suffer":[6],"from":[7],"limited":[8],"heat":[9,169,209],"transport":[10],"due":[11],"to":[12,229],"contact":[13],"constriction":[14],"in":[15,34,223],"spherical":[16,42],"particulate":[17],"networks.":[18],"To":[19],"address":[20],"this":[21,40],"challenge,":[22],"we":[23],"report":[24],"a":[25,49,94,128,214],"magnetically":[26,71],"programmable":[27],"bridge\u2010filler":[28],"architecture":[29,162],"that":[30,75,145,158],"enhances":[31],"thermal":[32,130,165,205,221],"pathways":[33],"electrically":[35,224],"insulating":[36,225],"epoxy":[37],"systems.":[38],"In":[39],"design,":[41],"Al":[43,103,149,198],"2":[44,104,150,199],"O":[45,57,65,105,109,151,200],"3":[46,56,64,106,108,152,201],"serves":[47],"as":[48,70],"process\u2010friendly":[50],"primary":[51],"filler":[52,97],"framework,":[53],"while":[54,203],"Fe":[55],"4":[58,66,110],"\u2010functionalized":[59],"hexagonal":[60],"boron":[61],"nitride":[62],"(hBN@Fe":[63],")":[67],"flakes":[68],"act":[69],"addressable":[72],"bridge":[73],"fillers":[74],"connect":[76],"neighboring":[77],"alumina":[78],"particles":[79],"and":[80,122,190,194],"can":[81],"be":[82],"oriented":[83],"along":[84],"the":[85,102,115,147,159,197],"through\u2010plane":[86,129],"direction":[87],"under":[88],"an":[89],"external":[90],"magnetic":[91],"field.":[92],"At":[93],"fixed":[95],"total":[96],"loading":[98],"of":[99,112,132,146],"40":[100],"vol%,":[101],":hBN@Fe":[107],"ratio":[111],"8:2":[113],"provides":[114],"most":[116],"effective":[117],"balance":[118],"between":[119],"bridge\u2010network":[120],"formation":[121],"rheological":[123],"freedom":[124],"for":[125,218],"alignment,":[126],"yielding":[127],"conductivity":[131],"2.02":[133],"W":[134],"m":[135],"\u2212":[136,139],"1":[137,140,186],"K":[138],",":[141],"72.8%":[142],"higher":[143],"than":[144,196],"corresponding":[148],"\u2010only":[153],"composite.":[154],"Finite\u2010element":[155],"modeling":[156],"reveals":[157],"hybrid":[160],"aligned":[161],"alleviates":[163],"point\u2010contact\u2010dominated":[164],"bottlenecks":[166],"by":[167],"redistributing":[168],"flux":[170],"through":[171],"more":[172],"continuous":[173],"bridge\u2010mediated":[174],"pathways.":[175],"The":[176],"optimized":[177],"composite":[178],"retains":[179],"high":[180],"volume":[181],"resistivity":[182],"(4.4":[183],"\u00d7":[184],"10":[185],"5":[187],"\u03a9":[188],"cm)":[189],"lower":[191],"dielectric":[192],"constant":[193],"loss":[195],"composite,":[202],"package\u2010level":[204],"tests":[206],"confirm":[207],"faster":[208],"transfer.":[210],"These":[211],"results":[212],"establish":[213],"generalizable":[215],"design":[216],"principle":[217],"directionally":[219],"efficient":[220],"management":[222],"with":[227],"relevance":[228],"advanced":[230],"electronic":[231],"packaging.":[232]},"counts_by_year":[],"updated_date":"2026-11-04T10:54:05.112534","created_date":"2026-08-19T00:00:00"}