{"id":"https://openalex.org/W7203583797","doi":"https://doi.org/10.1002/pola.70283","title":"Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging","display_name":"Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging","publication_year":2026,"publication_date":"2026-08-16","ids":{"openalex":"https://openalex.org/W7203583797","doi":"https://doi.org/10.1002/pola.70283"},"language":"en","primary_location":{"id":"doi:10.1002/pola.70283","doi":"https://doi.org/10.1002/pola.70283","is_oa":false,"landing_page_url":"https://doi.org/10.1002/pola.70283","pdf_url":null,"source":{"id":"https://openalex.org/S4210188590","display_name":"Journal of Polymer Science","issn_l":"2642-4150","issn":["2642-4150","2642-4169"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-20","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320595","host_organization_name":"Wiley","host_organization_lineage":["https://openalex.org/P4310320595"],"host_organization_lineage_names":["Wiley"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Polymer Science","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Ryan Giang","orcid":"https://orcid.org/0009-0008-0327-0467","observed_orcids":["https://orcid.org/0009-0008-0327-0467"]},"institutions":[{"id":"https://openalex.org/I1321296531","display_name":"National Institute of Standards and Technology","ror":"https://ror.org/05xpvk416","country_code":"US","type":"government","lineage":["https://openalex.org/I1321296531","https://openalex.org/I1343035065"]},{"id":"https://openalex.org/I36258959","display_name":"University of California San Diego","ror":"https://ror.org/0168r3w48","country_code":"US","type":"education","lineage":["https://openalex.org/I36258959"]},{"id":"https://openalex.org/I4210147263","display_name":"Material Measurement Laboratory","ror":"https://ror.org/04a0y3b96","country_code":"US","type":"government","lineage":["https://openalex.org/I1321296531","https://openalex.org/I1343035065","https://openalex.org/I4210147263"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ryan Giang","raw_affiliation_strings":["Department of Chemical and Nano Engineering University of California San Diego  La Jolla California USA","Material Measurement Laboratory National Institute of Standards and Technology  Gaithersburg Maryland USA"],"raw_orcid":"https://orcid.org/0009-0008-0327-0467","affiliations":[{"raw_affiliation_string":"Department of Chemical and Nano Engineering University of California San Diego  La Jolla California USA","institution_ids":["https://openalex.org/I36258959"]},{"raw_affiliation_string":"Material Measurement Laboratory National Institute of Standards and Technology  Gaithersburg Maryland USA","institution_ids":["https://openalex.org/I1321296531","https://openalex.org/I4210147263"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013025198","display_name":"Ran Tao","orcid":"https://orcid.org/0000-0002-5208-7895","observed_orcids":["https://orcid.org/0000-0002-5208-7895"]},"institutions":[{"id":"https://openalex.org/I1321296531","display_name":"National Institute of Standards and Technology","ror":"https://ror.org/05xpvk416","country_code":"US","type":"government","lineage":["https://openalex.org/I1321296531","https://openalex.org/I1343035065"]},{"id":"https://openalex.org/I137902535","display_name":"North Carolina State University","ror":"https://ror.org/04tj63d06","country_code":"US","type":"education","lineage":["https://openalex.org/I137902535"]},{"id":"https://openalex.org/I4210147263","display_name":"Material Measurement Laboratory","ror":"https://ror.org/04a0y3b96","country_code":"US","type":"government","lineage":["https://openalex.org/I1321296531","https://openalex.org/I1343035065","https://openalex.org/I4210147263"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Ran Tao","raw_affiliation_strings":["Department of Chemical and Biomolecular Engineering North Carolina State University  Raleigh North Carolina USA","Material Measurement Laboratory National Institute of Standards and Technology  Gaithersburg Maryland USA"],"raw_orcid":"https://orcid.org/0000-0002-5208-7895","affiliations":[{"raw_affiliation_string":"Department of Chemical and Biomolecular Engineering North Carolina State University  Raleigh North Carolina USA","institution_ids":["https://openalex.org/I137902535"]},{"raw_affiliation_string":"Material Measurement Laboratory National Institute of Standards and Technology  Gaithersburg Maryland USA","institution_ids":["https://openalex.org/I1321296531","https://openalex.org/I4210147263"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087815414","display_name":"Elena Moukhina","orcid":"https://orcid.org/0000-0003-2672-2792","observed_orcids":["https://orcid.org/0000-0003-2672-2792"]},"institutions":[{"id":"https://openalex.org/I4210097244","display_name":"Netzsch (Germany)","ror":"https://ror.org/00dmed338","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210097244"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Elena Moukhina","raw_affiliation_strings":["NETZSCH\u2010Ger\u00e4tebau GmbH  Selb Germany"],"raw_orcid":"https://orcid.org/0000-0003-2672-2792","affiliations":[{"raw_affiliation_string":"NETZSCH\u2010Ger\u00e4tebau GmbH  Selb Germany","institution_ids":["https://openalex.org/I4210097244"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064343412","display_name":"Amanda L. Forster","orcid":"https://orcid.org/0000-0001-7397-4429","observed_orcids":["https://orcid.org/0000-0001-7397-4429"]},"institutions":[{"id":"https://openalex.org/I1321296531","display_name":"National Institute of Standards and Technology","ror":"https://ror.org/05xpvk416","country_code":"US","type":"government","lineage":["https://openalex.org/I1321296531","https://openalex.org/I1343035065"]},{"id":"https://openalex.org/I4210147263","display_name":"Material Measurement Laboratory","ror":"https://ror.org/04a0y3b96","country_code":"US","type":"government","lineage":["https://openalex.org/I1321296531","https://openalex.org/I1343035065","https://openalex.org/I4210147263"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Amanda L. Forster","raw_affiliation_strings":["Material Measurement Laboratory National Institute of Standards and Technology  Gaithersburg Maryland USA"],"raw_orcid":"https://orcid.org/0000-0001-7397-4429","affiliations":[{"raw_affiliation_string":"Material Measurement Laboratory National Institute of Standards and Technology  Gaithersburg Maryland USA","institution_ids":["https://openalex.org/I1321296531","https://openalex.org/I4210147263"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103099770","display_name":"Tae Joon Cho","orcid":"https://orcid.org/0000-0001-9467-0491","observed_orcids":["https://orcid.org/0000-0001-9467-0491"]},"institutions":[{"id":"https://openalex.org/I1321296531","display_name":"National Institute of Standards and Technology","ror":"https://ror.org/05xpvk416","country_code":"US","type":"government","lineage":["https://openalex.org/I1321296531","https://openalex.org/I1343035065"]},{"id":"https://openalex.org/I4210147263","display_name":"Material Measurement Laboratory","ror":"https://ror.org/04a0y3b96","country_code":"US","type":"government","lineage":["https://openalex.org/I1321296531","https://openalex.org/I1343035065","https://openalex.org/I4210147263"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Tae Joon Cho","raw_affiliation_strings":["Material Measurement Laboratory National Institute of Standards and Technology  Gaithersburg Maryland USA"],"raw_orcid":"https://orcid.org/0000-0001-9467-0491","affiliations":[{"raw_affiliation_string":"Material Measurement Laboratory National Institute of Standards and Technology  Gaithersburg Maryland USA","institution_ids":["https://openalex.org/I1321296531","https://openalex.org/I4210147263"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067658984","display_name":"Polette J. Centellas","orcid":"https://orcid.org/0000-0003-3248-3409","observed_orcids":["https://orcid.org/0000-0003-3248-3409"]},"institutions":[{"id":"https://openalex.org/I1321296531","display_name":"National Institute of Standards and Technology","ror":"https://ror.org/05xpvk416","country_code":"US","type":"government","lineage":["https://openalex.org/I1321296531","https://openalex.org/I1343035065"]},{"id":"https://openalex.org/I4210147263","display_name":"Material Measurement Laboratory","ror":"https://ror.org/04a0y3b96","country_code":"US","type":"government","lineage":["https://openalex.org/I1321296531","https://openalex.org/I1343035065","https://openalex.org/I4210147263"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Polette J. Centellas","raw_affiliation_strings":["Material Measurement Laboratory National Institute of Standards and Technology  Gaithersburg Maryland USA"],"raw_orcid":"https://orcid.org/0000-0003-3248-3409","affiliations":[{"raw_affiliation_string":"Material Measurement Laboratory National Institute of Standards and Technology  Gaithersburg Maryland USA","institution_ids":["https://openalex.org/I1321296531","https://openalex.org/I4210147263"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5076774722","display_name":"Stian K. Romberg","orcid":"https://orcid.org/0000-0003-1026-2023","observed_orcids":["https://orcid.org/0000-0003-1026-2023"]},"institutions":[{"id":"https://openalex.org/I1321296531","display_name":"National Institute of Standards and Technology","ror":"https://ror.org/05xpvk416","country_code":"US","type":"government","lineage":["https://openalex.org/I1321296531","https://openalex.org/I1343035065"]},{"id":"https://openalex.org/I4210147263","display_name":"Material Measurement Laboratory","ror":"https://ror.org/04a0y3b96","country_code":"US","type":"government","lineage":["https://openalex.org/I1321296531","https://openalex.org/I1343035065","https://openalex.org/I4210147263"]},{"id":"https://openalex.org/I75027704","display_name":"University of Tennessee at Knoxville","ror":"https://ror.org/020f3ap87","country_code":"US","type":"education","lineage":["https://openalex.org/I75027704"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Stian K. Romberg","raw_affiliation_strings":["Department of Mechanical and Aerospace Engineering University of Tennessee  Knoxville Tennessee USA","Material Measurement Laboratory National Institute of Standards and Technology  Gaithersburg Maryland USA"],"raw_orcid":"https://orcid.org/0000-0003-1026-2023","affiliations":[{"raw_affiliation_string":"Department of Mechanical and Aerospace Engineering University of Tennessee  Knoxville Tennessee USA","institution_ids":["https://openalex.org/I75027704"]},{"raw_affiliation_string":"Material Measurement Laboratory National Institute of Standards and Technology  Gaithersburg Maryland USA","institution_ids":["https://openalex.org/I1321296531","https://openalex.org/I4210147263"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088380621","display_name":"Zois Tsinas","orcid":"https://orcid.org/0000-0001-7712-9257","observed_orcids":["https://orcid.org/0000-0001-7712-9257"]},"institutions":[{"id":"https://openalex.org/I1321296531","display_name":"National Institute of Standards and Technology","ror":"https://ror.org/05xpvk416","country_code":"US","type":"government","lineage":["https://openalex.org/I1321296531","https://openalex.org/I1343035065"]},{"id":"https://openalex.org/I4210097074","display_name":"Theiss Research","ror":"https://ror.org/00scjnx30","country_code":"US","type":"nonprofit","lineage":["https://openalex.org/I4210097074"]},{"id":"https://openalex.org/I4210147263","display_name":"Material Measurement Laboratory","ror":"https://ror.org/04a0y3b96","country_code":"US","type":"government","lineage":["https://openalex.org/I1321296531","https://openalex.org/I1343035065","https://openalex.org/I4210147263"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Zois Tsinas","raw_affiliation_strings":["Material Measurement Laboratory National Institute of Standards and Technology  Gaithersburg Maryland USA","Theiss Research  La Jolla California USA"],"raw_orcid":"https://orcid.org/0000-0001-7712-9257","affiliations":[{"raw_affiliation_string":"Material Measurement Laboratory National Institute of Standards and Technology  Gaithersburg Maryland USA","institution_ids":["https://openalex.org/I1321296531","https://openalex.org/I4210147263"]},{"raw_affiliation_string":"Theiss Research  La Jolla California USA","institution_ids":["https://openalex.org/I4210097074"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5070415003","display_name":"Christopher L. Soles","orcid":"https://orcid.org/0000-0002-1963-6039","observed_orcids":["https://orcid.org/0000-0002-1963-6039"]},"institutions":[{"id":"https://openalex.org/I1321296531","display_name":"National Institute of Standards and Technology","ror":"https://ror.org/05xpvk416","country_code":"US","type":"government","lineage":["https://openalex.org/I1321296531","https://openalex.org/I1343035065"]},{"id":"https://openalex.org/I4210147263","display_name":"Material Measurement Laboratory","ror":"https://ror.org/04a0y3b96","country_code":"US","type":"government","lineage":["https://openalex.org/I1321296531","https://openalex.org/I1343035065","https://openalex.org/I4210147263"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Christopher L. Soles","raw_affiliation_strings":["Material Measurement Laboratory National Institute of Standards and Technology  Gaithersburg Maryland USA"],"raw_orcid":"https://orcid.org/0000-0002-1963-6039","affiliations":[{"raw_affiliation_string":"Material Measurement Laboratory National Institute of Standards and Technology  Gaithersburg Maryland USA","institution_ids":["https://openalex.org/I1321296531","https://openalex.org/I4210147263"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5013025198"],"corresponding_institution_ids":["https://openalex.org/I1321296531","https://openalex.org/I137902535","https://openalex.org/I4210147263"],"apc_list":{"value":4380,"currency":"USD","value_usd":4380},"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11145","display_name":"Epoxy Resin Curing Processes","score":0.9628999829292297,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11145","display_name":"Epoxy Resin Curing Processes","score":0.9628999829292297,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.022600000724196434,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12358","display_name":"Thermal and Kinetic Analysis","score":0.007000000216066837,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/epoxy-underfill","display_name":"epoxy underfill","score":0.9980000257492065},{"id":"https://openalex.org/keywords/cure-kinetics","display_name":"curing kinetics","score":0.9599999785423279},{"id":"https://openalex.org/keywords/thermal-durability","display_name":"thermal durability","score":0.8429999947547913},{"id":"https://openalex.org/keywords/isoconversional-methods","display_name":"model-free kinetics","score":0.8920000195503235},{"id":"https://openalex.org/keywords/activation-energy","display_name":"activation energy","score":0.7960000038146973},{"id":"https://openalex.org/keywords/vitrification","display_name":"vitrification","score":0.8220000267028809},{"id":"https://openalex.org/keywords/cryomilling","display_name":"cryomilling","score":0.7360000014305115},{"id":"https://openalex.org/keywords/thermal-degradation","display_name":"thermal degradation","score":0.8230000138282776},{"id":"https://openalex.org/keywords/mass-loss","display_name":"mass loss","score":0.5519999861717224},{"id":"https://openalex.org/keywords/thermosetting-resins","display_name":"thermosetting resins","score":0.652999997138977}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8406999707221985},{"id":"https://openalex.org/C166595027","wikidata":"https://www.wikidata.org/wiki/Q143983","display_name":"Epoxy","level":2,"score":0.7968000173568726},{"id":"https://openalex.org/C39519442","wikidata":"https://www.wikidata.org/wiki/Q904893","display_name":"Differential scanning calorimetry","level":2,"score":0.6622999906539917},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.6302000284194946},{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.5918999910354614},{"id":"https://openalex.org/C60100273","wikidata":"https://www.wikidata.org/wiki/Q902806","display_name":"Thermogravimetric analysis","level":2,"score":0.5633999705314636},{"id":"https://openalex.org/C69357855","wikidata":"https://www.wikidata.org/wiki/Q163214","display_name":"Diffusion","level":2,"score":0.5076000094413757},{"id":"https://openalex.org/C59061564","wikidata":"https://www.wikidata.org/wiki/Q7783071","display_name":"Thermal stability","level":2,"score":0.4648999869823456},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.4602999985218048},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.4377000033855438},{"id":"https://openalex.org/C122865956","wikidata":"https://www.wikidata.org/wiki/Q825643","display_name":"Glass transition","level":3,"score":0.39800000190734863},{"id":"https://openalex.org/C129446986","wikidata":"https://www.wikidata.org/wiki/Q542419","display_name":"Thermal analysis","level":3,"score":0.39250001311302185},{"id":"https://openalex.org/C2778022349","wikidata":"https://www.wikidata.org/wiki/Q1072553","display_name":"Vitrification","level":2,"score":0.33959999680519104},{"id":"https://openalex.org/C95121573","wikidata":"https://www.wikidata.org/wiki/Q190474","display_name":"Activation energy","level":2,"score":0.33730000257492065},{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.3073999881744385},{"id":"https://openalex.org/C2779679103","wikidata":"https://www.wikidata.org/wiki/Q5251805","display_name":"Degradation (telecommunications)","level":2,"score":0.29739999771118164},{"id":"https://openalex.org/C115952470","wikidata":"https://www.wikidata.org/wiki/Q332172","display_name":"Process optimization","level":2,"score":0.2824999988079071},{"id":"https://openalex.org/C148898269","wikidata":"https://www.wikidata.org/wiki/Q1108792","display_name":"Kinetics","level":2,"score":0.2815999984741211},{"id":"https://openalex.org/C157090170","wikidata":"https://www.wikidata.org/wiki/Q167876","display_name":"Thermomechanical analysis","level":3,"score":0.27079999446868896},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.2590000033378601},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.2590000033378601},{"id":"https://openalex.org/C2987253815","wikidata":"https://www.wikidata.org/wiki/Q41804911","display_name":"Plastic packaging","level":2,"score":0.25600001215934753}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1002/pola.70283","doi":"https://doi.org/10.1002/pola.70283","is_oa":false,"landing_page_url":"https://doi.org/10.1002/pola.70283","pdf_url":null,"source":{"id":"https://openalex.org/S4210188590","display_name":"Journal of Polymer Science","issn_l":"2642-4150","issn":["2642-4150","2642-4169"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-20","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320595","host_organization_name":"Wiley","host_organization_lineage":["https://openalex.org/P4310320595"],"host_organization_lineage_names":["Wiley"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Polymer Science","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[{"id":"https://openalex.org/G2535221767","display_name":"PURPOSE: THIS PURPOSE OF THIS PROPOSAL IS TO MAKE FUNDAMENTAL MEASUREMENTS OF CURE KINETICS, CHEMORHEOLOGY AND VISCOELASTIC PROPERTIES, AS WELL AS CURE SHRINKAGE MEASUREMENTS AND MODELING OF REPRESENTATIVE MODEL MATERIALS (RGTMS) TO BETTER CAPTURE THE BEHAVIOR OF THESE ADVANCED SYSTEMS FOR NEXT GENERATION CHIP DESIGNS.ACTIVITIES TO BE PERFORMED: THE RESEARCHERS WILL DESIGN EXPERIMENTS AND MODEL THE PROPERTIES THAT OCCUR DURING CURING TO STUDY THE CURE KINETICS. THE RESEARCHERS WILL DEVELOP NEW METROLOGICAL TOOLS AND METHODS, MATERIAL PROPERTY MODELS, OPEN-SOURCE MATERIALS DATA, AND RESEARCH GRADE TEST MATERIALS (RGTMS).EXPECTED OUTCOMES: THE IMPROVEMENTS WILL HELP PROVIDE A A COMMON MEASUREMENT PLATFORM OF REPRESENTATIVE MODEL MATERIALS FOR THE SEMICONDUCTOR INDUSTRY.INTENDED BENEFICIARIES: RESEARCHERS AND MANUFACTURERS WILL BENEFIT FROM THE ENHANCE PREDICTIVE MODELING AND INFORM ENGINEERING DESIGN PRACTICES IN THE INDUSTRY, THEREBY IMPROVING THE DESIGN, RELIABILITY, AND PERFORMANCE OF NEXT-GENERATION MICROELECTRONICS.SUBRECIPIENT ACTIVITIES: THE RECIPIENT DOES NOT INTEND TO SUBAWARD FUNDS.","funder_award_id":"70NANB24H283","funder_id":"https://openalex.org/F4320332178","funder_display_name":"National Institute of Standards and Technology"}],"funders":[{"id":"https://openalex.org/F4320332178","display_name":"National Institute of Standards and Technology","ror":"https://ror.org/05xpvk416"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":50,"referenced_works":["https://openalex.org/W1517515566","https://openalex.org/W1966556627","https://openalex.org/W1981254931","https://openalex.org/W1982904463","https://openalex.org/W1983658016","https://openalex.org/W2003266908","https://openalex.org/W2008854263","https://openalex.org/W2012257367","https://openalex.org/W2012373271","https://openalex.org/W2013228217","https://openalex.org/W2015660204","https://openalex.org/W2018398940","https://openalex.org/W2038028311","https://openalex.org/W2045903149","https://openalex.org/W2046928551","https://openalex.org/W2052748112","https://openalex.org/W2063431185","https://openalex.org/W2065110762","https://openalex.org/W2066065671","https://openalex.org/W2066364335","https://openalex.org/W2083985834","https://openalex.org/W2084777440","https://openalex.org/W2101962685","https://openalex.org/W2102384177","https://openalex.org/W2104851094","https://openalex.org/W2111211744","https://openalex.org/W2147589936","https://openalex.org/W2152536148","https://openalex.org/W2156370397","https://openalex.org/W2462402469","https://openalex.org/W2568193472","https://openalex.org/W2781646558","https://openalex.org/W3025544282","https://openalex.org/W3164040422","https://openalex.org/W3185601987","https://openalex.org/W4211121654","https://openalex.org/W4246903949","https://openalex.org/W4255114564","https://openalex.org/W4255278216","https://openalex.org/W4281769371","https://openalex.org/W4281817958","https://openalex.org/W4289705217","https://openalex.org/W4385525478","https://openalex.org/W4399703119","https://openalex.org/W4404558206","https://openalex.org/W4409173880","https://openalex.org/W4411688376","https://openalex.org/W4411689031","https://openalex.org/W4413755229","https://openalex.org/W4414314663"],"related_works":["https://openalex.org/W2062343450","https://openalex.org/W1974037417","https://openalex.org/W1968174054","https://openalex.org/W4414314663","https://openalex.org/W1855928151","https://openalex.org/W2009592048","https://openalex.org/W2055413960","https://openalex.org/W2893099369","https://openalex.org/W583161982","https://openalex.org/W2141028195"],"abstract_inverted_index":{"ABSTRACT":[0],"Epoxy":[1],"underfill":[2,65],"materials":[3],"are":[4],"critical":[5],"to":[6,125],"advanced":[7],"semiconductor":[8],"packaging":[9],"by":[10,33],"enhancing":[11],"mechanical":[12],"integrity,":[13],"redistributing":[14],"thermomechanical":[15],"stresses,":[16],"and":[17,23,38,50,57,76,91,101,122,191],"improving":[18],"solder\u2010joint":[19],"reliability":[20,52],"in":[21,112],"flip\u2010chip":[22],"other":[24],"fine\u2010pitch":[25],"interconnect":[26],"architectures.":[27],"Their":[28],"performance":[29],"is":[30],"strongly":[31],"influenced":[32],"cure":[34,55,99,127,133,181],"evolution":[35,128,182],"during":[36,41],"processing":[37],"thermal":[39,58,162,185,194],"stability":[40],"service,":[42],"making":[43],"quantitative":[44,177],"evaluation":[45],"important":[46],"for":[47,179,196],"process":[48],"optimization":[49],"long\u2010term":[51],"assessment.":[53],"The":[54],"kinetics":[56],"degradation":[59],"behavior":[60,100],"of":[61,118,160],"a":[62,130,156,166,176],"highly\u2010filled":[63,197],"epoxy":[64],"were":[66],"investigated":[67],"using":[68],"differential":[69],"scanning":[70],"calorimetry":[71],"(DSC),":[72],"thermogravimetric":[73],"analysis":[74,81],"(TGA),":[75],"diffusion\u2010incorporated":[77],"kinetic":[78],"modeling.":[79],"Isoconversional":[80],"showed":[82],"that":[83],"the":[84,113,151,173],"apparent":[85],"activation":[86],"energy":[87],"varied":[88],"with":[89],"conversion":[90,119],"increased":[92],"sharply":[93],"at":[94],"high":[95],"conversion,":[96],"indicating":[97],"multi\u2010step":[98],"diffusion":[102,110,189],"control.":[103],"A":[104],"two\u2010step":[105],"modified":[106],"Kamal\u2013Sourour":[107],"model":[108],"incorporating":[109],"control":[111],"second":[114],"step":[115],"improved":[116,141],"prediction":[117],"after":[120],"vitrification":[121],"was":[123],"used":[124],"predict":[126],"under":[129,170,183],"designed":[131],"oven":[132],"schedule,":[134],"which":[135],"achieved":[136],"nearly":[137],"complete":[138],"cure.":[139],"Cryomilling":[140],"TGA":[142],"reproducibility":[143],"without":[144],"causing":[145],"detectable":[146],"chemical":[147],"changes.":[148],"Analysis":[149],"following":[150],"ASTM":[152],"E1641/E1877":[153],"protocols":[154],"revealed":[155],"strong":[157],"temperature":[158],"dependence":[159],"estimated":[161],"endurance":[163,195],"based":[164],"on":[165],"5%":[167],"mass\u2010loss":[168],"criterion":[169],"nitrogen.":[171],"Together,":[172],"results":[174],"provide":[175],"framework":[178],"predicting":[180],"practical":[184],"schedules,":[186],"evaluating":[187],"late\u2010stage":[188],"effects,":[190],"estimating":[192],"degradation\u2010based":[193],"industrial":[198],"thermosets.":[199]},"counts_by_year":[],"updated_date":"2026-11-10T11:39:43.021295","created_date":"2026-08-17T00:00:00"}