{"id":"https://openalex.org/W7167347994","doi":"https://doi.org/10.1016/j.mssp.2026.110958","title":"Optimizing indium bump bonding yield for Micro-LEDs with 8 \u03bcm pixel pitch towards mass production","display_name":"Optimizing indium bump bonding yield for Micro-LEDs with 8 \u03bcm pixel pitch towards mass production","publication_year":2026,"publication_date":"2026-07-04","ids":{"openalex":"https://openalex.org/W7167347994","doi":"https://doi.org/10.1016/j.mssp.2026.110958"},"language":"en","primary_location":{"id":"doi:10.1016/j.mssp.2026.110958","doi":"https://doi.org/10.1016/j.mssp.2026.110958","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.mssp.2026.110958","pdf_url":null,"source":{"id":"https://openalex.org/S82126420","display_name":"Materials Science in Semiconductor Processing","issn_l":"1369-8001","issn":["1369-8001","1873-4081"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","ki-jl-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Materials Science in Semiconductor Processing","raw_type":"journal-article"},"volume":null,"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5052326360","display_name":"Yuchen Lu","orcid":"https://orcid.org/0000-0001-5404-0233","observed_orcids":["https://orcid.org/0000-0001-5404-0233"]},"institutions":[{"id":"https://openalex.org/I80947539","display_name":"Fuzhou University","ror":"https://ror.org/011xvna82","country_code":"CN","type":"education","lineage":["https://openalex.org/I80947539"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuchen Lu","raw_affiliation_strings":["National and Local United Engineering Laboratory of Flat Panel Display Technology, College of Physics and Information Engineering, Fuzhou University, Fuzhou, 350100, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National and Local United Engineering Laboratory of Flat Panel Display Technology, College of Physics and Information Engineering, Fuzhou University, Fuzhou, 350100, China","institution_ids":["https://openalex.org/I80947539"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5050799958","display_name":"Tianxi Yang","orcid":"https://orcid.org/0000-0003-4197-9262","observed_orcids":["https://orcid.org/0000-0003-4197-9262"]},"institutions":[{"id":"https://openalex.org/I4405272605","display_name":"Fujian Science and Technology Innovation Laboratory for Optoelectronic Information of China","ror":"https://ror.org/04dtz2k95","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4405272605"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Tianxi Yang","raw_affiliation_strings":["Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China","institution_ids":["https://openalex.org/I4405272605"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103956164","display_name":"Yijian Zhou","orcid":"https://orcid.org/0009-0004-5150-7060","observed_orcids":["https://orcid.org/0009-0004-5150-7060"]},"institutions":[{"id":"https://openalex.org/I80947539","display_name":"Fuzhou University","ror":"https://ror.org/011xvna82","country_code":"CN","type":"education","lineage":["https://openalex.org/I80947539"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yijian Zhou","raw_affiliation_strings":["National and Local United Engineering Laboratory of Flat Panel Display Technology, College of Physics and Information Engineering, Fuzhou University, Fuzhou, 350100, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National and Local United Engineering Laboratory of Flat Panel Display Technology, College of Physics and Information Engineering, Fuzhou University, Fuzhou, 350100, China","institution_ids":["https://openalex.org/I80947539"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100421479","display_name":"Yang Li","orcid":"https://orcid.org/0000-0002-3308-3610","observed_orcids":["https://orcid.org/0000-0002-3308-3610","https://orcid.org/0000-0002-2955-0298"]},"institutions":[{"id":"https://openalex.org/I80947539","display_name":"Fuzhou University","ror":"https://ror.org/011xvna82","country_code":"CN","type":"education","lineage":["https://openalex.org/I80947539"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yang Li","raw_affiliation_strings":["National and Local United Engineering Laboratory of Flat Panel Display Technology, College of Physics and Information Engineering, Fuzhou University, Fuzhou, 350100, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National and Local United Engineering Laboratory of Flat Panel Display Technology, College of Physics and Information Engineering, Fuzhou University, Fuzhou, 350100, China","institution_ids":["https://openalex.org/I80947539"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100364754","display_name":"Jin Li","orcid":"https://orcid.org/0000-0001-6385-9320","observed_orcids":["https://orcid.org/0000-0001-6385-9320","https://orcid.org/0009-0007-9044-5829"]},"institutions":[{"id":"https://openalex.org/I80947539","display_name":"Fuzhou University","ror":"https://ror.org/011xvna82","country_code":"CN","type":"education","lineage":["https://openalex.org/I80947539"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jin Li","raw_affiliation_strings":["National and Local United Engineering Laboratory of Flat Panel Display Technology, College of Physics and Information Engineering, Fuzhou University, Fuzhou, 350100, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National and Local United Engineering Laboratory of Flat Panel Display Technology, College of Physics and Information Engineering, Fuzhou University, Fuzhou, 350100, China","institution_ids":["https://openalex.org/I80947539"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5010690177","display_name":"Qun Yan","orcid":"https://orcid.org/0009-0006-3681-020X","observed_orcids":["https://orcid.org/0009-0006-3681-020X"]},"institutions":[{"id":"https://openalex.org/I4405272605","display_name":"Fujian Science and Technology Innovation Laboratory for Optoelectronic Information of China","ror":"https://ror.org/04dtz2k95","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4405272605"]},{"id":"https://openalex.org/I80947539","display_name":"Fuzhou University","ror":"https://ror.org/011xvna82","country_code":"CN","type":"education","lineage":["https://openalex.org/I80947539"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Qun Yan","raw_affiliation_strings":["Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China","National and Local United Engineering Laboratory of Flat Panel Display Technology, College of Physics and Information Engineering, Fuzhou University, Fuzhou, 350100, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China","institution_ids":["https://openalex.org/I4405272605"]},{"raw_affiliation_string":"National and Local United Engineering Laboratory of Flat Panel Display Technology, College of Physics and Information Engineering, Fuzhou University, Fuzhou, 350100, China","institution_ids":["https://openalex.org/I80947539"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5027853785","display_name":"Jie Sun","orcid":"https://orcid.org/0000-0002-6479-7771","observed_orcids":["https://orcid.org/0000-0002-6479-7771","https://orcid.org/0009-0003-5018-8451","https://orcid.org/0000-0002-0161-9986","https://orcid.org/0000-0001-8350-8712"]},"institutions":[{"id":"https://openalex.org/I4405272605","display_name":"Fujian Science and Technology Innovation Laboratory for Optoelectronic Information of China","ror":"https://ror.org/04dtz2k95","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4405272605"]},{"id":"https://openalex.org/I80947539","display_name":"Fuzhou University","ror":"https://ror.org/011xvna82","country_code":"CN","type":"education","lineage":["https://openalex.org/I80947539"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Jie Sun","raw_affiliation_strings":["Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China","National and Local United Engineering Laboratory of Flat Panel Display Technology, College of Physics and Information Engineering, Fuzhou University, Fuzhou, 350100, China"],"raw_orcid":"https://orcid.org/0000-0002-6479-7771","affiliations":[{"raw_affiliation_string":"Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou, 350100, China","institution_ids":["https://openalex.org/I4405272605"]},{"raw_affiliation_string":"National and Local United Engineering Laboratory of Flat Panel Display Technology, College of Physics and Information Engineering, Fuzhou University, Fuzhou, 350100, China","institution_ids":["https://openalex.org/I80947539"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5027853785","https://openalex.org/A5050799958"],"corresponding_institution_ids":["https://openalex.org/I4405272605","https://openalex.org/I80947539"],"apc_list":{"value":3540,"currency":"USD","value_usd":3540},"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.43686636,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"215","issue":null,"first_page":"110958","last_page":"110958"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10099","display_name":"GaN-based semiconductor devices and materials","score":0.5859000086784363,"subfield":{"id":"https://openalex.org/subfields/3104","display_name":"Condensed Matter Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10099","display_name":"GaN-based semiconductor devices and materials","score":0.5859000086784363,"subfield":{"id":"https://openalex.org/subfields/3104","display_name":"Condensed Matter Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.2296999990940094,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.05790000036358833,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/micro-leds","display_name":"micro-LEDs","score":0.8349999785423279},{"id":"https://openalex.org/keywords/indium-bump-bonding","display_name":"indium bump bonding","score":0.9919999837875366},{"id":"https://openalex.org/keywords/bonding-yield","display_name":"bonding yield","score":0.9279999732971191},{"id":"https://openalex.org/keywords/near-eye-displays","display_name":"near-eye displays","score":0.9290000200271606},{"id":"https://openalex.org/keywords/wafer-dicing","display_name":"wafer dicing","score":0.878000020980835},{"id":"https://openalex.org/keywords/mass-production","display_name":"mass production","score":0.6259999871253967}],"concepts":[{"id":"https://openalex.org/C105487726","wikidata":"https://www.wikidata.org/wiki/Q622938","display_name":"Photolithography","level":2,"score":0.817799985408783},{"id":"https://openalex.org/C134406635","wikidata":"https://www.wikidata.org/wiki/Q1439684","display_name":"Photoresist","level":3,"score":0.8090999722480774},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7865999937057495},{"id":"https://openalex.org/C543292547","wikidata":"https://www.wikidata.org/wiki/Q1094","display_name":"Indium","level":2,"score":0.7153000235557556},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.671999990940094},{"id":"https://openalex.org/C134121241","wikidata":"https://www.wikidata.org/wiki/Q899301","display_name":"Yield (engineering)","level":2,"score":0.5569999814033508},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5444999933242798},{"id":"https://openalex.org/C162307627","wikidata":"https://www.wikidata.org/wiki/Q204833","display_name":"Enhanced Data Rates for GSM Evolution","level":2,"score":0.5436999797821045},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.503600001335144},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.42170000076293945},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.4122999906539917},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.40639999508857727},{"id":"https://openalex.org/C160633673","wikidata":"https://www.wikidata.org/wiki/Q355198","display_name":"Pixel","level":2,"score":0.3813000023365021},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.36169999837875366},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.36160001158714294},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.35040000081062317},{"id":"https://openalex.org/C61441594","wikidata":"https://www.wikidata.org/wiki/Q132814","display_name":"Evaporation","level":2,"score":0.34599998593330383},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.337799996137619},{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.33219999074935913},{"id":"https://openalex.org/C2777441419","wikidata":"https://www.wikidata.org/wiki/Q16969460","display_name":"Process window","level":3,"score":0.3246999979019165},{"id":"https://openalex.org/C2781448156","wikidata":"https://www.wikidata.org/wiki/Q1570182","display_name":"Coating","level":2,"score":0.32330000400543213},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.31380000710487366},{"id":"https://openalex.org/C2779133538","wikidata":"https://www.wikidata.org/wiki/Q677010","display_name":"Wafer bonding","level":3,"score":0.3093999922275543},{"id":"https://openalex.org/C111335779","wikidata":"https://www.wikidata.org/wiki/Q3454686","display_name":"Reduction (mathematics)","level":2,"score":0.3041999936103821},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.2874999940395355},{"id":"https://openalex.org/C82558694","wikidata":"https://www.wikidata.org/wiki/Q1545619","display_name":"Aspect ratio (aeronautics)","level":2,"score":0.28439998626708984},{"id":"https://openalex.org/C32737372","wikidata":"https://www.wikidata.org/wiki/Q417718","display_name":"Indium tin oxide","level":3,"score":0.28299999237060547},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.271699994802475},{"id":"https://openalex.org/C2776326872","wikidata":"https://www.wikidata.org/wiki/Q1192335","display_name":"Shadow mask","level":2,"score":0.27070000767707825},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.2646999955177307},{"id":"https://openalex.org/C2776303044","wikidata":"https://www.wikidata.org/wiki/Q5463579","display_name":"Flying height","level":3,"score":0.257099986076355}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.mssp.2026.110958","doi":"https://doi.org/10.1016/j.mssp.2026.110958","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.mssp.2026.110958","pdf_url":null,"source":{"id":"https://openalex.org/S82126420","display_name":"Materials Science in Semiconductor Processing","issn_l":"1369-8001","issn":["1369-8001","1873-4081"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","ki-jl-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Materials Science in Semiconductor Processing","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"sustainable_development_goals_aurora":[],"study_designs":[],"awards":[{"id":"https://openalex.org/G5647781277","display_name":null,"funder_award_id":"12474066","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320326713","display_name":"Wuhan Municipal Science and Technology Bureau","ror":"https://ror.org/016s74507"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W1994605157","https://openalex.org/W2017550361","https://openalex.org/W2039339427","https://openalex.org/W2098437817","https://openalex.org/W2143594870","https://openalex.org/W3044292537","https://openalex.org/W3089866673","https://openalex.org/W3159515951","https://openalex.org/W4296229906","https://openalex.org/W4313021682","https://openalex.org/W4318819815","https://openalex.org/W4319334175","https://openalex.org/W4392973809","https://openalex.org/W4407636646"],"related_works":[],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2026-10-16T09:59:22.235173","created_date":"2026-07-05T00:00:00"}