{"id":"https://openalex.org/W7166328301","doi":"https://doi.org/10.1007/s11664-026-12972-1","title":"Comprehensive Evaluation of Microstructure\u2013Property Relationships in Al-Added Sn-Zn Eutectic Solder Alloys from Thermal, Electrical, and Mechanical Perspectives","display_name":"Comprehensive Evaluation of Microstructure\u2013Property Relationships in Al-Added Sn-Zn Eutectic Solder Alloys from Thermal, Electrical, and Mechanical Perspectives","publication_year":2026,"publication_date":"2026-06-27","ids":{"openalex":"https://openalex.org/W7166328301","doi":"https://doi.org/10.1007/s11664-026-12972-1"},"language":"en","primary_location":{"id":"doi:10.1007/s11664-026-12972-1","doi":"https://doi.org/10.1007/s11664-026-12972-1","is_oa":true,"landing_page_url":"https://doi.org/10.1007/s11664-026-12972-1","pdf_url":"https://link.springer.com/content/pdf/10.1007/s11664-026-12972-1.pdf","source":{"id":"https://openalex.org/S127985767","display_name":"Journal of Electronic Materials","issn_l":"0361-5235","issn":["0361-5235","0381-5235","1543-186X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Electronic Materials","raw_type":"journal-article"},"volume":null,"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"hybrid","oa_url":"https://link.springer.com/content/pdf/10.1007/s11664-026-12972-1.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5033984687","display_name":"\u00dcmit Bayram","orcid":"https://orcid.org/0000-0001-8760-8024","observed_orcids":["https://orcid.org/0000-0001-8760-8024"]},"institutions":[{"id":"https://openalex.org/I87673952","display_name":"Erciyes University","ror":"https://ror.org/047g8vk19","country_code":"TR","type":"education","lineage":["https://openalex.org/I87673952"]},{"id":"https://openalex.org/I95293974","display_name":"Abdullah G\u00fcl University","ror":"https://ror.org/00zdyy359","country_code":"TR","type":"education","lineage":["https://openalex.org/I95293974"]}],"countries":["TR"],"is_corresponding":true,"raw_author_name":"\u00dcmit Bayram","raw_affiliation_strings":["Central Research Facility (AGU\u2013CRF), Abdullah G\u00fcl University, 38080, Kayseri, Turkey","Erciyes University Nanotechnology Application and Research Center (ERNAM), 38039, Kayseri, Turkey"],"raw_orcid":"https://orcid.org/0000-0001-8760-8024","affiliations":[{"raw_affiliation_string":"Central Research Facility (AGU\u2013CRF), Abdullah G\u00fcl University, 38080, Kayseri, Turkey","institution_ids":["https://openalex.org/I95293974"]},{"raw_affiliation_string":"Erciyes University Nanotechnology Application and Research Center (ERNAM), 38039, Kayseri, Turkey","institution_ids":["https://openalex.org/I87673952"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5027669618","display_name":"Mevl\u00fct \u015eahin","orcid":"https://orcid.org/0000-0002-6659-3756","observed_orcids":["https://orcid.org/0000-0002-6659-3756"]},"institutions":[{"id":"https://openalex.org/I198265615","display_name":"Ni\u011fde \u00d6mer Halisdemir \u00dcniversitesi","ror":"https://ror.org/03ejnre35","country_code":"TR","type":"education","lineage":["https://openalex.org/I198265615"]}],"countries":["TR"],"is_corresponding":false,"raw_author_name":"Mevl\u00fct \u015eahin","raw_affiliation_strings":["Ni\u011fde Technical Vocational School of Sciences, Department of Electronics and Automation, Ni\u011fde \u00d6mer Halisdemir University, Ni\u011fde, Turkey"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Ni\u011fde Technical Vocational School of Sciences, Department of Electronics and Automation, Ni\u011fde \u00d6mer Halisdemir University, Ni\u011fde, Turkey","institution_ids":["https://openalex.org/I198265615"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5033984687"],"corresponding_institution_ids":["https://openalex.org/I87673952","https://openalex.org/I95293974"],"apc_list":{"value":3390,"currency":"USD","value_usd":3390},"apc_paid":{"value":3390,"currency":"USD","value_usd":3390},"fwci":0.0,"has_fulltext":true,"cited_by_count":0,"citation_normalized_percentile":{"value":0.40336806,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"55","issue":"9","first_page":"7552","last_page":"7564"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14128","display_name":"Metallurgical and Alloy Processes","score":0.0003000000142492354,"subfield":{"id":"https://openalex.org/subfields/2500","display_name":"General Materials Science"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/aluminum-addition","display_name":"aluminum addition","score":0.8140000104904175},{"id":"https://openalex.org/keywords/lead-free-solder","display_name":"lead-free solder","score":0.6919999718666077},{"id":"https://openalex.org/keywords/microstructure-property-relationship","display_name":"microstructure-property relationship","score":0.9509999752044678},{"id":"https://openalex.org/keywords/dendritic-microstructure","display_name":"dendritic microstructure","score":0.8730000257492065},{"id":"https://openalex.org/keywords/mechanical-properties","display_name":"mechanical properties","score":0.8040000200271606},{"id":"https://openalex.org/keywords/electrical-resistivity","display_name":"electrical resistivity","score":0.8019999861717224},{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"thermal conductivity","score":0.9990000128746033},{"id":"https://openalex.org/keywords/thermophysical-properties","display_name":"thermophysical properties","score":0.9129999876022339},{"id":"https://openalex.org/keywords/heat-of-fusion","display_name":"heat of fusion","score":0.9399999976158142},{"id":"https://openalex.org/keywords/specific-heat-capacity","display_name":"specific heat","score":0.621999979019165},{"id":"https://openalex.org/keywords/vickers-hardness","display_name":"Vickers hardness","score":0.7210000157356262},{"id":"https://openalex.org/keywords/ductility","display_name":"ductility","score":0.6510000228881836},{"id":"https://openalex.org/keywords/wiedemann-franz-law","display_name":"Wiedemann-Franz law","score":0.902999997138977}],"concepts":[{"id":"https://openalex.org/C18168003","wikidata":"https://www.wikidata.org/wiki/Q628595","display_name":"Eutectic system","level":3,"score":0.7868000268936157},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.7010999917984009},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6996999979019165},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.6798999905586243},{"id":"https://openalex.org/C2776631189","wikidata":"https://www.wikidata.org/wiki/Q1128169","display_name":"Metallography","level":3,"score":0.2915000021457672},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.27079999446868896},{"id":"https://openalex.org/C27501479","wikidata":"https://www.wikidata.org/wiki/Q428069","display_name":"Intermetallic","level":3,"score":0.26179999113082886},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.2578999996185303},{"id":"https://openalex.org/C18762648","wikidata":"https://www.wikidata.org/wiki/Q42213","display_name":"Work (physics)","level":2,"score":0.24480000138282776},{"id":"https://openalex.org/C2988617437","wikidata":"https://www.wikidata.org/wiki/Q6627318","display_name":"Materials testing","level":2,"score":0.23749999701976776}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1007/s11664-026-12972-1","doi":"https://doi.org/10.1007/s11664-026-12972-1","is_oa":true,"landing_page_url":"https://doi.org/10.1007/s11664-026-12972-1","pdf_url":"https://link.springer.com/content/pdf/10.1007/s11664-026-12972-1.pdf","source":{"id":"https://openalex.org/S127985767","display_name":"Journal of Electronic Materials","issn_l":"0361-5235","issn":["0361-5235","0381-5235","1543-186X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Electronic Materials","raw_type":"journal-article"},{"id":"pmh:3be558cd-9139-4c44-a96b-e3bce817f72f","doi":null,"is_oa":true,"landing_page_url":"https://avesis.erciyes.edu.tr/publication/details/3be558cd-9139-4c44-a96b-e3bce817f72f/oai","pdf_url":null,"source":{"id":"https://openalex.org/S7407055139","display_name":"Erciyes University - AVESIS","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"other-oa","license_id":"https://openalex.org/licenses/other-oa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"info:eu-repo/semantics/article"}],"best_oa_location":{"id":"doi:10.1007/s11664-026-12972-1","doi":"https://doi.org/10.1007/s11664-026-12972-1","is_oa":true,"landing_page_url":"https://doi.org/10.1007/s11664-026-12972-1","pdf_url":"https://link.springer.com/content/pdf/10.1007/s11664-026-12972-1.pdf","source":{"id":"https://openalex.org/S127985767","display_name":"Journal of Electronic Materials","issn_l":"0361-5235","issn":["0361-5235","0381-5235","1543-186X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Electronic Materials","raw_type":"journal-article"},"sustainable_development_goals":[],"sustainable_development_goals_aurora":[],"study_designs":[],"awards":[{"id":"https://openalex.org/G113508535","display_name":null,"funder_award_id":"FMT 2025/3-BAGEP-Y","funder_id":"https://openalex.org/F4320326530","funder_display_name":"\u00d6mer Halisdemir \u00dcniversitesi"}],"funders":[{"id":"https://openalex.org/F4320322626","display_name":"T\u00fcrkiye Bilimsel ve Teknolojik Ara\u015ft\u0131rma Kurumu","ror":"https://ror.org/04w9kkr77"},{"id":"https://openalex.org/F4320326530","display_name":"\u00d6mer Halisdemir \u00dcniversitesi","ror":null}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W7166328301.pdf","grobid_xml":"https://content.openalex.org/works/W7166328301.grobid-xml"},"referenced_works_count":45,"referenced_works":["https://openalex.org/W39614659","https://openalex.org/W1510001042","https://openalex.org/W1542196968","https://openalex.org/W1974355242","https://openalex.org/W1977703211","https://openalex.org/W1989737343","https://openalex.org/W1999148669","https://openalex.org/W2002550303","https://openalex.org/W2008320420","https://openalex.org/W2018876392","https://openalex.org/W2038485030","https://openalex.org/W2046971650","https://openalex.org/W2052534747","https://openalex.org/W2063215426","https://openalex.org/W2065318472","https://openalex.org/W2088159358","https://openalex.org/W2097990856","https://openalex.org/W2099537633","https://openalex.org/W2104581200","https://openalex.org/W2138996629","https://openalex.org/W2152677897","https://openalex.org/W2155727422","https://openalex.org/W2394576334","https://openalex.org/W2397779012","https://openalex.org/W2669373982","https://openalex.org/W2770382006","https://openalex.org/W2783830797","https://openalex.org/W2905502512","https://openalex.org/W2948042944","https://openalex.org/W2948132450","https://openalex.org/W2982119742","https://openalex.org/W2984613855","https://openalex.org/W3031411987","https://openalex.org/W3089200145","https://openalex.org/W3092032686","https://openalex.org/W3097702907","https://openalex.org/W3132814944","https://openalex.org/W3173912447","https://openalex.org/W3185525538","https://openalex.org/W4200190999","https://openalex.org/W4306392745","https://openalex.org/W4321436122","https://openalex.org/W4360608617","https://openalex.org/W4391304381","https://openalex.org/W4402621317"],"related_works":[],"abstract_inverted_index":{"(Sn-8.8Zn)-XAl":[0,245],"(X":[1],"=":[2,180],"0,":[3],"0.5,":[4],"1.0,":[5],"2.5,":[6],"5.0":[7],"wt.%)":[8],"solder":[9],"alloys":[10,28,82,144,246],"were":[11,29,99,112,145,238],"produced":[12],"using":[13,184,215],"a":[14,57,102,204],"vacuum":[15],"muffle":[16],"furnace.":[17],"The":[18,77,106,126],"microstructural":[19],"images,":[20,56],"chemical":[21],"compositions,":[22],"and":[23,47,74,95,109,130,138,229],"phase":[24],"structures":[25,72],"of":[26,80,104,142,163],"the":[27,64,81,115,119,123,131,136,143,160,164,185,216,236],"characterized":[30],"by":[31,147,203],"field":[32,38],"emission":[33,39],"scanning":[34,40,149],"electron":[35,41],"microscopy":[36],"(FESEM),":[37],"microscopy\u2013energy":[42],"dispersive":[43],"x-ray":[44,48],"spectroscopy":[45],"(FESEM\u2013EDX),":[46],"diffraction":[49],"(XRD)":[50],"analyses,":[51],"respectively.":[52],"According":[53],"to":[54,197,225,250],"FESEM":[55],"fully":[58],"eutectic":[59,165],"microstructure":[60],"was":[61,154],"observed":[62],"in":[63,159,168,194],"Sn-8.8Zn":[65],"alloy.":[66],"With":[67],"increasing":[68,230],"Al":[69,161,200],"content,":[70,201],"dendritic":[71],"formed":[73],"became":[75],"denser.":[76],"mechanical":[78],"properties":[79],"(ultimate":[83],"tensile":[84,87],"strength":[85,89,93,108],"\u03c3UT,":[86],"yield":[88,92],"\u03c3TY,":[90],"compressive":[91],"\u03c3CY,":[94],"Vickers":[96],"hardness":[97,110],"HV)":[98],"measured":[100,146,170,183],"as":[101],"function":[103],"composition.":[105],"highest":[107,124],"values":[111,177,213],"obtained":[113],"for":[114],"(Sn-8.8Zn)-2.5Al":[116],"alloy,":[117],"whereas":[118],"(Sn-8.8Zn)-5.0Al":[120],"alloy":[121,166],"exhibited":[122,219],"ductility.":[125],"melting":[127],"enthalpies":[128],"(\u0394H)":[129],"specific":[132],"heat":[133],"differences":[134],"between":[135],"solid":[137],"liquid":[139],"phases":[140],"(\u0394CP)":[141],"differential":[148],"calorimetry":[150],"(DSC)":[151],"analysis.":[152],"It":[153],"determined":[155],"that":[156,244],"an":[157,192,220],"increase":[158,193],"content":[162],"resulted":[167],"higher":[169],"thermophysical":[171],"properties.":[172],"Finally,":[173],"electrical":[174],"resistivity":[175,195],"(\u03c1)":[176],"at":[178],"T":[179],"300":[181],"K,":[182],"standard":[186],"four\u2013point":[187],"probe":[188],"method":[189],"(FPPM),":[190],"revealed":[191],"up":[196,224],"1.0":[198,226],"wt.%":[199,227],"followed":[202],"decrease":[205],"beyond":[206],"this":[207],"value.":[208],"In":[209],"contrast,":[210],"thermal":[211],"conductivity":[212],"calculated":[214],"Wiedemann\u2013Franz":[217],"law":[218],"opposite":[221],"trend,":[222],"decreasing":[223],"Al,":[228],"thereafter.":[231],"Based":[232],"on":[233],"microstructure\u2013property":[234],"relationships,":[235],"results":[237],"compared":[239],"with":[240],"previous":[241],"studies,":[242],"highlighting":[243],"represent":[247],"promising":[248],"alternatives":[249],"lead-free":[251],"solders.":[252]},"counts_by_year":[],"updated_date":"2026-09-11T09:22:31.653822","created_date":"2026-06-28T00:00:00"}