{"id":"https://openalex.org/W7166169013","doi":"https://doi.org/10.4071/001c.161494","title":"New Methods for Mechanical Mating Characterization of Surface Mount Technology Card to Board Interconnections","display_name":"New Methods for Mechanical Mating Characterization of Surface Mount Technology Card to Board Interconnections","publication_year":2026,"publication_date":"2026-04-29","ids":{"openalex":"https://openalex.org/W7166169013","doi":"https://doi.org/10.4071/001c.161494"},"language":"en","primary_location":{"id":"doi:10.4071/001c.161494","doi":"https://doi.org/10.4071/001c.161494","is_oa":true,"landing_page_url":"https://doi.org/10.4071/001c.161494","pdf_url":"https://imapsource.org/article/161494.pdf","source":{"id":"https://openalex.org/S4210197219","display_name":"IMAPSource Proceedings","issn_l":"2380-4505","issn":["2380-4505"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IMAPSource Proceedings","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://imapsource.org/article/161494.pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5086261914","display_name":"John Torok","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"John G. Torok","raw_affiliation_strings":["IBM Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corporation","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074492376","display_name":"William L. Brodsky","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"William L. Brodsky","raw_affiliation_strings":["IBM Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corporation","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5070832839","display_name":"Shawn Canfield","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Shawn Canfield","raw_affiliation_strings":["IBM Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corporation","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023401289","display_name":"Hien P. Dang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Hien P. Dang","raw_affiliation_strings":["IBM Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corporation","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":null,"display_name":"David L. Edwards","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"David L. Edwards","raw_affiliation_strings":["IBM Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corporation","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5050462808","display_name":"Mark K. Hoffmeyer","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mark K. Hoffmeyer","raw_affiliation_strings":["IBM Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corporation","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5123296119","display_name":"Vijay Khanna","orcid":"https://orcid.org/0009-0004-8984-9314","observed_orcids":["https://orcid.org/0009-0004-8984-9314"]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Vijay Khanna","raw_affiliation_strings":["IBM Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corporation","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5139401937","display_name":"Eric J McKeever","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Eric J McKeever","raw_affiliation_strings":["IBM Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corporation","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Arvind K. Sinha","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Arvind K. Sinha","raw_affiliation_strings":["IBM Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corporation","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5076774031","display_name":"Sri M. Sri-Jayantha","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sri Sri-Jayantha","raw_affiliation_strings":["IBM Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM Corporation","institution_ids":["https://openalex.org/I1341412227"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I1341412227"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":true,"cited_by_count":0,"citation_normalized_percentile":{"value":0.32642189,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"2009","issue":"Symposium","first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12371","display_name":"Electrical Contact Performance and Analysis","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/surface-mount-technology","display_name":"surface mount technology","score":0.9739999771118164},{"id":"https://openalex.org/keywords/solder-joint-reliability","display_name":"solder joint reliability","score":0.597000002861023},{"id":"https://openalex.org/keywords/high-density-packaging","display_name":"high-density packaging","score":0.5440000295639038}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.8199999928474426},{"id":"https://openalex.org/C2776584680","wikidata":"https://www.wikidata.org/wiki/Q191042","display_name":"Surface-mount technology","level":3,"score":0.7946000099182129},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.6718999743461609},{"id":"https://openalex.org/C110925319","wikidata":"https://www.wikidata.org/wiki/Q12855","display_name":"Cable gland","level":2,"score":0.6482999920845032},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.5325000286102295},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.4156999886035919},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3928999900817871},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.387800008058548},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.3862000107765198},{"id":"https://openalex.org/C2780841128","wikidata":"https://www.wikidata.org/wiki/Q5073781","display_name":"Characterization (materials science)","level":2,"score":0.38280001282691956},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.37040001153945923},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.36800000071525574},{"id":"https://openalex.org/C514575182","wikidata":"https://www.wikidata.org/wiki/Q228395","display_name":"Mating","level":2,"score":0.36399999260902405},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3224000036716461},{"id":"https://openalex.org/C2778755073","wikidata":"https://www.wikidata.org/wiki/Q10858537","display_name":"Scale (ratio)","level":2,"score":0.3018999993801117},{"id":"https://openalex.org/C168167062","wikidata":"https://www.wikidata.org/wiki/Q1117970","display_name":"Component (thermodynamics)","level":2,"score":0.3010999858379364},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.3000999987125397},{"id":"https://openalex.org/C26517878","wikidata":"https://www.wikidata.org/wiki/Q228039","display_name":"Key (lock)","level":2,"score":0.28679999709129333},{"id":"https://openalex.org/C198082294","wikidata":"https://www.wikidata.org/wiki/Q3399648","display_name":"Position (finance)","level":2,"score":0.28450000286102295},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.2827000021934509},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.28110000491142273},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2806999981403351},{"id":"https://openalex.org/C3018963415","wikidata":"https://www.wikidata.org/wiki/Q16878425","display_name":"On board","level":2,"score":0.2793000042438507},{"id":"https://openalex.org/C115333844","wikidata":"https://www.wikidata.org/wiki/Q7463524","display_name":"Corrugated fiberboard","level":2,"score":0.2750999927520752},{"id":"https://openalex.org/C2778091609","wikidata":"https://www.wikidata.org/wiki/Q14713","display_name":"Mount","level":2,"score":0.273499995470047},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.267300009727478},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.25220000743865967},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.2500999867916107}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.4071/001c.161494","doi":"https://doi.org/10.4071/001c.161494","is_oa":true,"landing_page_url":"https://doi.org/10.4071/001c.161494","pdf_url":"https://imapsource.org/article/161494.pdf","source":{"id":"https://openalex.org/S4210197219","display_name":"IMAPSource Proceedings","issn_l":"2380-4505","issn":["2380-4505"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IMAPSource Proceedings","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.4071/001c.161494","doi":"https://doi.org/10.4071/001c.161494","is_oa":true,"landing_page_url":"https://doi.org/10.4071/001c.161494","pdf_url":"https://imapsource.org/article/161494.pdf","source":{"id":"https://openalex.org/S4210197219","display_name":"IMAPSource Proceedings","issn_l":"2380-4505","issn":["2380-4505"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IMAPSource Proceedings","raw_type":"journal-article"},"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W7166169013.pdf","grobid_xml":"https://content.openalex.org/works/W7166169013.grobid-xml"},"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W1935564773","https://openalex.org/W2120843824","https://openalex.org/W4234430384","https://openalex.org/W4416876949","https://openalex.org/W1678868874","https://openalex.org/W2157845392","https://openalex.org/W1986415085","https://openalex.org/W2526655070","https://openalex.org/W4285730403","https://openalex.org/W2271349665"],"abstract_inverted_index":{"Large":[0],"scale":[1],"system":[2],"packaging":[3],"density":[4],"requirements":[5],"continue":[6],"to":[7,14,33,54,59,79,103,116],"place":[8],"increased":[9],"demand":[10],"on":[11],"improving":[12],"card":[13,32],"board":[15,34],"interconnections":[16],"in":[17,86],"the":[18,84,90,94,122],"areas":[19],"of":[20,93],"electrical":[21],"performance":[22],"as":[23,25,65,67,125,127],"well":[24,66,126],"physical":[26,91],"density.":[27],"To":[28],"address":[29],"these":[30],"needs,":[31],"assemblies":[35],"with":[36,51],"new":[37,52,75],"high":[38],"density,":[39],"surface":[40],"mount":[41],"technology":[42],"(SMT)":[43],"waferized":[44],"interconnect":[45],"systems":[46],"have":[47],"been":[48],"developed,":[49],"along":[50],"methods":[53],"assess":[55],"their":[56],"mating":[57,64,111,123],"characteristics":[58],"ensure":[60],"both":[61],"sufficient":[62],"initial":[63],"long-term":[68],"connection":[69],"reliability.":[70],"Applying":[71],"existing":[72],"measurement":[73],"devices,":[74],"methodologies":[76],"are":[77,101],"presented":[78],"record":[80],"interconnection":[81,95],"alignment":[82],"and":[83,98,109],"stress":[85,131],"solder":[87,106,119],"connections.":[88],"Exploiting":[89],"construction":[92],"system,":[96],"analytical":[97],"experimental":[99],"techniques":[100],"detailed":[102],"reveal":[104],"how":[105],"attach":[107],"strength":[108],"connector":[110],"strains":[112,120],"can":[113],"be":[114],"coupled":[115],"predict":[117],"SMT":[118],"during":[121,128],"cycle":[124],"package":[129],"environmental":[130],"testing.":[132]},"counts_by_year":[],"updated_date":"2026-09-29T14:09:16.559479","created_date":"2026-06-27T00:00:00"}