{"id":"https://openalex.org/W7135273115","doi":null,"title":"Mesure de la conductivit\u00e9 thermique de mat\u00e9riaux en films minces par la m\u00e9thode 3-om\u00e9ga et caract\u00e9risation des r\u00e9sistances thermiques interfaciales substrat/film.","display_name":"Mesure de la conductivit\u00e9 thermique de mat\u00e9riaux en films minces par la m\u00e9thode 3-om\u00e9ga et caract\u00e9risation des r\u00e9sistances thermiques interfaciales substrat/film.","publication_year":2021,"publication_date":"2021-10-23","ids":{"openalex":"https://openalex.org/W7135273115"},"language":"fr","primary_location":{"id":"pmh:oai:dspace.univ-tlemcen.dz:112/18527","doi":null,"is_oa":true,"landing_page_url":"https://dspace.univ-tlemcen.dz/handle/112/18527","pdf_url":"https://dspace.univ-tlemcen.dz/bitstreams/6b5b114d-61a3-4dcc-8b95-db5350d0ff12/download","source":{"id":"https://openalex.org/S4406922607","display_name":"D\u00e9p\u00f4t Institutionnel de lUniversit\u00e9 de Tlemcen","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"Thesis"},"volume":null,"type":"dissertation","is_traditional":true,"indexed_in":[],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://dspace.univ-tlemcen.dz/bitstreams/6b5b114d-61a3-4dcc-8b95-db5350d0ff12/download","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5044806438","display_name":"Amine Abdelkader Guermoudi","orcid":"https://orcid.org/0000-0002-4671-3327","observed_orcids":["https://orcid.org/0000-0002-4671-3327"]},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Guermoudi, Amine Abdelkader","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":["https://openalex.org/A5044806438"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":true,"cited_by_count":0,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13116","display_name":"Heat Transfer and Numerical Methods","score":0.0003000000142492354,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11856","display_name":"Thermography and Photoacoustic Techniques","score":0.0003000000142492354,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"thermal conductivity","score":0.8759999871253967},{"id":"https://openalex.org/keywords/thin-films","display_name":"thin films","score":0.9919999837875366},{"id":"https://openalex.org/keywords/3omega-method","display_name":"3\u03c9 method","score":0.9129999876022339},{"id":"https://openalex.org/keywords/interfacial-thermal-resistance","display_name":"interfacial thermal resistance","score":0.9919999837875366},{"id":"https://openalex.org/keywords/film-substrate-interface","display_name":"film-substrate interface","score":0.9409999847412109},{"id":"https://openalex.org/keywords/third-harmonic-voltage","display_name":"third harmonic voltage","score":0.6520000100135803},{"id":"https://openalex.org/keywords/finite-element-analysis","display_name":"finite element analysis","score":0.671999990940094},{"id":"https://openalex.org/keywords/comsol-multiphysics","display_name":"COMSOL Multiphysics","score":0.746999979019165},{"id":"https://openalex.org/keywords/microelectronics-thermal-management","display_name":"microelectronics thermal management","score":0.5230000019073486}],"concepts":[{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.7257000207901001},{"id":"https://openalex.org/C102232406","wikidata":"https://www.wikidata.org/wiki/Q7783035","display_name":"Thermal conductivity measurement","level":3,"score":0.6367999911308289},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6227999925613403},{"id":"https://openalex.org/C46435376","wikidata":"https://www.wikidata.org/wiki/Q1829750","display_name":"Multiphysics","level":3,"score":0.6105999946594238},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5367000102996826},{"id":"https://openalex.org/C72293138","wikidata":"https://www.wikidata.org/wiki/Q909741","display_name":"Temperature measurement","level":2,"score":0.5189999938011169},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.4684999883174896},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.45590001344680786},{"id":"https://openalex.org/C172100665","wikidata":"https://www.wikidata.org/wiki/Q7465774","display_name":"Thermal conduction","level":2,"score":0.4426000118255615},{"id":"https://openalex.org/C89394759","wikidata":"https://www.wikidata.org/wiki/Q192593","display_name":"Thermal radiation","level":2,"score":0.4007999897003174},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.39660000801086426},{"id":"https://openalex.org/C18762648","wikidata":"https://www.wikidata.org/wiki/Q42213","display_name":"Work (physics)","level":2,"score":0.3765000104904175},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3635999858379364},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.34549999237060547},{"id":"https://openalex.org/C71928083","wikidata":"https://www.wikidata.org/wiki/Q1530469","display_name":"Measuring principle","level":2,"score":0.32910001277923584},{"id":"https://openalex.org/C2778182573","wikidata":"https://www.wikidata.org/wiki/Q7784286","display_name":"Thin layers","level":2,"score":0.31869998574256897},{"id":"https://openalex.org/C45058047","wikidata":"https://www.wikidata.org/wiki/Q4119687","display_name":"Thermal contact conductance","level":4,"score":0.31679999828338623},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.31679999828338623},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3118000030517578},{"id":"https://openalex.org/C62646347","wikidata":"https://www.wikidata.org/wiki/Q2041172","display_name":"Measuring instrument","level":2,"score":0.2994000017642975},{"id":"https://openalex.org/C129446986","wikidata":"https://www.wikidata.org/wiki/Q542419","display_name":"Thermal analysis","level":3,"score":0.2953000068664551},{"id":"https://openalex.org/C19619285","wikidata":"https://www.wikidata.org/wiki/Q196372","display_name":"Observational error","level":2,"score":0.29409998655319214},{"id":"https://openalex.org/C137109543","wikidata":"https://www.wikidata.org/wiki/Q554388","display_name":"Temperature gradient","level":2,"score":0.28780001401901245},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.27810001373291016},{"id":"https://openalex.org/C137209882","wikidata":"https://www.wikidata.org/wiki/Q1403517","display_name":"Measurement uncertainty","level":2,"score":0.2660999894142151},{"id":"https://openalex.org/C3019891514","wikidata":"https://www.wikidata.org/wiki/Q7784286","display_name":"Thin layer","level":3,"score":0.26089999079704285},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.257999986410141},{"id":"https://openalex.org/C57879066","wikidata":"https://www.wikidata.org/wiki/Q41217","display_name":"Mechanics","level":1,"score":0.25360000133514404}],"mesh":[],"locations_count":1,"locations":[{"id":"pmh:oai:dspace.univ-tlemcen.dz:112/18527","doi":null,"is_oa":true,"landing_page_url":"https://dspace.univ-tlemcen.dz/handle/112/18527","pdf_url":"https://dspace.univ-tlemcen.dz/bitstreams/6b5b114d-61a3-4dcc-8b95-db5350d0ff12/download","source":{"id":"https://openalex.org/S4406922607","display_name":"D\u00e9p\u00f4t Institutionnel de lUniversit\u00e9 de Tlemcen","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"Thesis"}],"best_oa_location":{"id":"pmh:oai:dspace.univ-tlemcen.dz:112/18527","doi":null,"is_oa":true,"landing_page_url":"https://dspace.univ-tlemcen.dz/handle/112/18527","pdf_url":"https://dspace.univ-tlemcen.dz/bitstreams/6b5b114d-61a3-4dcc-8b95-db5350d0ff12/download","source":{"id":"https://openalex.org/S4406922607","display_name":"D\u00e9p\u00f4t Institutionnel de lUniversit\u00e9 de Tlemcen","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"Thesis"},"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W7135273115.pdf","grobid_xml":"https://content.openalex.org/works/W7135273115.grobid-xml"},"referenced_works_count":46,"referenced_works":["https://openalex.org/W1562661071","https://openalex.org/W1649895848","https://openalex.org/W1970244918","https://openalex.org/W1971919723","https://openalex.org/W1977314389","https://openalex.org/W1978925083","https://openalex.org/W1980949591","https://openalex.org/W2001109630","https://openalex.org/W2008472422","https://openalex.org/W2014809163","https://openalex.org/W2017832059","https://openalex.org/W2019297315","https://openalex.org/W2026220795","https://openalex.org/W2031139927","https://openalex.org/W2033832447","https://openalex.org/W2036188548","https://openalex.org/W2036717939","https://openalex.org/W2037484969","https://openalex.org/W2037888290","https://openalex.org/W2039334850","https://openalex.org/W2052807145","https://openalex.org/W2056835101","https://openalex.org/W2059708800","https://openalex.org/W2064709391","https://openalex.org/W2087483303","https://openalex.org/W2089595166","https://openalex.org/W2093012347","https://openalex.org/W2094525723","https://openalex.org/W2113042005","https://openalex.org/W2126096410","https://openalex.org/W2130212525","https://openalex.org/W2160756577","https://openalex.org/W2163532909","https://openalex.org/W2265934523","https://openalex.org/W2315242813","https://openalex.org/W2473814611","https://openalex.org/W2512211031","https://openalex.org/W2580441427","https://openalex.org/W2734784500","https://openalex.org/W2744398595","https://openalex.org/W2817636548","https://openalex.org/W2890427706","https://openalex.org/W3023982010","https://openalex.org/W3042126721","https://openalex.org/W3112015320","https://openalex.org/W4214567297"],"related_works":["https://openalex.org/W4255057945","https://openalex.org/W2027075999","https://openalex.org/W1975239984","https://openalex.org/W2279494838","https://openalex.org/W4388062831","https://openalex.org/W2373405600","https://openalex.org/W2020873853","https://openalex.org/W4381379982","https://openalex.org/W2248446292","https://openalex.org/W2069027715"],"abstract_inverted_index":{"The":[0,174,274],"deposition":[1],"of":[2,17,31,35,42,51,57,71,104,134,137,160,168,194,202,276,287,307,311,326,342,346],"materials":[3,263,312,348],"in":[4,11,40,221,313,339],"thin":[5,36,95,314,350],"layers":[6,315],"arouses":[7],"a":[8,161,179,183,216,242,327],"great":[9],"interest":[10],"the":[12,32,49,55,63,69,77,81,85,90,94,101,109,122,150,155,166,169,192,195,200,203,222,233,248,261,265,277,284,305,308,317,324,336,340,343],"industrial":[13],"and":[14,25,39,84,88,97,141,182,239,256,291,316],"academic":[15],"sectors":[16],"various":[18],"fields":[19],"such":[20],"as":[21,178],"for":[22,47,304],"example":[23],"micro":[24],"nanoelectronics.":[26],"In":[27,67],"this":[28,116],"context,":[29],"knowledge":[30],"thermal":[33,43,74,105,146,209,254,258,309,344],"properties":[34],"film":[37,271],"materials,":[38],"particular":[41],"conductivity,":[44],"is":[45,187,213,227],"essential":[46],"optimizing":[48],"performance":[50],"many":[52],"devices.":[53],"Nevertheless,":[54],"measurement":[56,110,212,218],"these":[58,321],"parameters":[59],"remains":[60],"difficult":[61],"given":[62],"small":[64],"dimensions":[65],"involved.":[66],"particular,":[68],"existence":[70,325],"an":[72],"interfacial":[73,257,318],"resistance":[75],"on":[76,89,121,165],"one":[78],"hand":[79,92],"between":[80,93],"deposited":[82,164],"layer":[83,96],"host":[86],"material":[87],"other":[91],"temperature":[98,184],"sensor":[99],"makes":[100,331],"rigorous":[102],"extraction":[103],"conductivity":[106,255,310,345],"delicate.":[107],"Among":[108],"methods":[111],"likely":[112],"to":[113,115,171,190,205,208,252,334],"respond":[114],"problem,":[117],"our":[118],"choice":[119],"fell":[120],"3-omega":[123],"(3\u03c9)":[124],"differential":[125],"technique,":[126],"which":[127],"was":[128],"introduced":[129],"by":[130,145,157,229,236,241,294],"DG":[131,237],"Cahill,":[132],"because":[133],"its":[135,139],"simplicity":[136],"use,":[138],"precision":[140],"low":[142],"heat":[143],"loss":[144],"radiation":[147],"caused":[148],"during":[149],"measurement.":[151],"This":[152,211,224],"method":[153],"requires":[154],"deposition,":[156],"optical":[158],"photolithography,":[159],"metal":[162],"line":[163,175],"surface":[167],"sample":[170,266],"be":[172],"characterized.":[173],"acts":[176],"simultaneously":[177],"heating":[180],"element":[181,268],"sensor.":[185],"It":[186],"then":[188],"necessary":[189],"acquire":[191],"voltage":[193],"3rd":[196],"harmonic":[197],"(V_3\u03c9:":[198],"hence":[199],"name":[201],"method)":[204],"go":[206],"back":[207],"conductivity.":[210],"done":[214],"using":[215,232,247],"dedicated":[217],"bench":[219],"developed":[220],"laboratory.":[223],"experimental":[225,278],"work":[226],"accompanied":[228],"modeling":[230],"studies":[231],"formalism":[234],"proposed":[235],"Cahill":[238,290],"also":[240],"Finite":[243],"Element":[244],"Approach":[245],"(FEM)":[246],"Comsol":[249],"Multiphysics":[250],"software,":[251],"estimate":[253],"resistance.":[259,319],"Between":[260],"different":[262],"constituting":[264],"(heating":[267],"/":[269,272],"film,":[270],"substrate).":[273],"comparison":[275],"results":[279],"with":[280],"those":[281],"resulting":[282],"from":[283],"analytical":[285],"model":[286],"D.":[288],"G.":[289],"numerical":[292],"simulations":[293],"FEM":[295],"shows":[296],"that":[297],"we":[298],"have":[299],"two":[300,322],"efficient":[301],"complementary":[302],"tools":[303],"determination":[306,341],"Besides":[320],"tools,":[323],"reliable":[328],"measuring":[329],"device":[330],"it":[332],"possible":[333],"note":[335],"expertise":[337],"acquired":[338],"solid":[347],"or":[349],"films.":[351]},"counts_by_year":[],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2026-03-14T00:00:00"}