{"id":"https://openalex.org/W7125791950","doi":"https://doi.org/10.4071/001c.151201","title":"High-Throughput Fabrication of Glass Micro-Vias Through a Direct Laser Ablation Process Utilizing a DOE and an Optimized KrF Excimer Laser","display_name":"High-Throughput Fabrication of Glass Micro-Vias Through a Direct Laser Ablation Process Utilizing a DOE and an Optimized KrF Excimer Laser","publication_year":2025,"publication_date":"2025-12-01","ids":{"openalex":"https://openalex.org/W7125791950","doi":"https://doi.org/10.4071/001c.151201"},"language":"en","primary_location":{"id":"doi:10.4071/001c.151201","doi":"https://doi.org/10.4071/001c.151201","is_oa":true,"landing_page_url":"https://doi.org/10.4071/001c.151201","pdf_url":"https://imapsource.org/article/151201.pdf","source":{"id":"https://openalex.org/S4210197219","display_name":"IMAPSource Proceedings","issn_l":"2380-4505","issn":["2380-4505"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IMAPSource Proceedings","raw_type":"journal-article"},"volume":null,"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://imapsource.org/article/151201.pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5037453447","display_name":"Yasufumi Kawasuji","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405265520","display_name":"Gigaphoton Inc (Japan)","ror":"https://ror.org/0525ysz90","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405265520"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yasufumi Kawasuji","raw_affiliation_strings":["Gigaphoton Inc"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Gigaphoton Inc","institution_ids":["https://openalex.org/I4405265520"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112296655","display_name":"Akira Suwa","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405265520","display_name":"Gigaphoton Inc (Japan)","ror":"https://ror.org/0525ysz90","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405265520"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Akira Suwa","raw_affiliation_strings":["Gigaphoton Inc"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Gigaphoton Inc","institution_ids":["https://openalex.org/I4405265520"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5124042342","display_name":"Masanori Teramoto","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405265520","display_name":"Gigaphoton Inc (Japan)","ror":"https://ror.org/0525ysz90","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405265520"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Masanori Teramoto","raw_affiliation_strings":["Gigaphoton Inc"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Gigaphoton Inc","institution_ids":["https://openalex.org/I4405265520"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5123943433","display_name":"Tomonari Tanaka","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405265520","display_name":"Gigaphoton Inc (Japan)","ror":"https://ror.org/0525ysz90","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405265520"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Tomonari Tanaka","raw_affiliation_strings":["Gigaphoton Inc"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Gigaphoton Inc","institution_ids":["https://openalex.org/I4405265520"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5123916741","display_name":"Jun-Ro Yoon","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1338503839","display_name":"Corning (United States)","ror":"https://ror.org/02tfv4t78","country_code":"US","type":"company","lineage":["https://openalex.org/I1338503839"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jun-Ro Yoon","raw_affiliation_strings":["Corning Incorporated"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Corning Incorporated","institution_ids":["https://openalex.org/I1338503839"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5030860897","display_name":"Robert A. Schaut","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1338503839","display_name":"Corning (United States)","ror":"https://ror.org/02tfv4t78","country_code":"US","type":"company","lineage":["https://openalex.org/I1338503839"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Robert Schaut","raw_affiliation_strings":["Corning Incorporated"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Corning Incorporated","institution_ids":["https://openalex.org/I1338503839"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":true,"cited_by_count":0,"citation_normalized_percentile":{"value":0.38742814,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"2025","issue":"DPC","first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10732","display_name":"Laser Material Processing Techniques","score":0.9613999724388123,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10732","display_name":"Laser Material Processing Techniques","score":0.9613999724388123,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.03610000014305115,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.000699999975040555,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/through-glass-via","display_name":"through glass via","score":0.9269999861717224},{"id":"https://openalex.org/keywords/krf-laser","display_name":"KrF excimer laser","score":0.9100000262260437},{"id":"https://openalex.org/keywords/diffractive-optical-elements","display_name":"diffractive optical elements","score":0.921999990940094},{"id":"https://openalex.org/keywords/glass-substrates","display_name":"glass substrates","score":0.40400001406669617},{"id":"https://openalex.org/keywords/high-density-wiring","display_name":"high-density wiring","score":0.5899999737739563},{"id":"https://openalex.org/keywords/advanced-packaging","display_name":"advanced packaging","score":0.621999979019165},{"id":"https://openalex.org/keywords/metallization","display_name":"metallization","score":0.49300000071525574}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.805899977684021},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.7031000256538391},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5728999972343445},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.5105000138282776},{"id":"https://openalex.org/C2780477314","wikidata":"https://www.wikidata.org/wiki/Q241056","display_name":"Excimer laser","level":3,"score":0.46149998903274536},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.4487000107765198},{"id":"https://openalex.org/C138113353","wikidata":"https://www.wikidata.org/wiki/Q611639","display_name":"Polishing","level":2,"score":0.44429999589920044},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.4207000136375427},{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.4146000146865845},{"id":"https://openalex.org/C2779188808","wikidata":"https://www.wikidata.org/wiki/Q1806547","display_name":"Laser ablation","level":3,"score":0.38929998874664307},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.37790000438690186},{"id":"https://openalex.org/C82558694","wikidata":"https://www.wikidata.org/wiki/Q1545619","display_name":"Aspect ratio (aeronautics)","level":2,"score":0.3686999976634979},{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.36719998717308044},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.32690000534057617},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3151000142097473},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.3091999888420105},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.304500013589859},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.3043999969959259},{"id":"https://openalex.org/C107430045","wikidata":"https://www.wikidata.org/wiki/Q1364409","display_name":"Inertial confinement fusion","level":3,"score":0.29429998993873596},{"id":"https://openalex.org/C2778902805","wikidata":"https://www.wikidata.org/wiki/Q322177","display_name":"Ablation","level":2,"score":0.2847999930381775},{"id":"https://openalex.org/C200649887","wikidata":"https://www.wikidata.org/wiki/Q17154544","display_name":"Laser power scaling","level":3,"score":0.2743000090122223},{"id":"https://openalex.org/C74561354","wikidata":"https://www.wikidata.org/wiki/Q901723","display_name":"Excimer","level":3,"score":0.27390000224113464},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.26100000739097595},{"id":"https://openalex.org/C2164484","wikidata":"https://www.wikidata.org/wiki/Q5170150","display_name":"Core (optical fiber)","level":2,"score":0.2572000026702881}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.4071/001c.151201","doi":"https://doi.org/10.4071/001c.151201","is_oa":true,"landing_page_url":"https://doi.org/10.4071/001c.151201","pdf_url":"https://imapsource.org/article/151201.pdf","source":{"id":"https://openalex.org/S4210197219","display_name":"IMAPSource Proceedings","issn_l":"2380-4505","issn":["2380-4505"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IMAPSource Proceedings","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.4071/001c.151201","doi":"https://doi.org/10.4071/001c.151201","is_oa":true,"landing_page_url":"https://doi.org/10.4071/001c.151201","pdf_url":"https://imapsource.org/article/151201.pdf","source":{"id":"https://openalex.org/S4210197219","display_name":"IMAPSource Proceedings","issn_l":"2380-4505","issn":["2380-4505"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IMAPSource Proceedings","raw_type":"journal-article"},"sustainable_development_goals":[{"score":0.7207000255584717,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"sustainable_development_goals_aurora":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W7125791950.pdf","grobid_xml":"https://content.openalex.org/works/W7125791950.grobid-xml"},"referenced_works_count":0,"referenced_works":[],"related_works":[],"abstract_inverted_index":{"Artificial":[0],"intelligence":[1],"(AI)":[2],"and":[3,12,29,44,65,88,91,100,132,170,205],"high-performance":[4],"computing":[5,10],"(HPC)":[6],"are":[7,229],"demanding":[8],"unprecedent":[9],"power":[11],"the":[13,23,125,143,182,213,220],"advanced":[14],"packaging":[15],"has":[16,35,69],"been":[17,36,70],"seeking":[18],"new":[19],"materials":[20],"to":[21,52,127,145,174,184,218],"continue":[22],"scaling":[24],"in":[25,129,157],"performance,":[26],"power,":[27],"area,":[28],"cost":[30],"(PPAC).":[31],"The":[32,47],"silicon":[33],"interposer":[34],"challenged":[37],"by":[38,41,60],"its":[39,54,80],"scalability":[40,173],"300mm":[42],"wafer":[43],"reticle":[45],"size.":[46,176],"organic-core":[48],"substrate":[49,75],"is":[50,216],"suffering":[51],"increase":[53],"body":[55],"size":[56],"with":[57],"high-density":[58,103],"wiring":[59],"a":[61,73,107,199,206],"lack":[62],"of":[63,79,85,140,189,222],"stiffness":[64],"surface":[66],"roughness.":[67],"Glass":[68],"investigated":[71],"as":[72],"promising":[74],"core":[76],"material":[77],"because":[78],"tunable":[81],"properties":[82],"(e.g.,":[83],"coefficient":[84],"temperature":[86],"expansion":[87],"modulus,":[89],"etc.)":[90],"panel":[92,175],"scalable":[93],"manufacturing":[94],"technologies.":[95],"Additionally,":[96,226],"their":[97],"high":[98,147,164,186,192],"rigidity":[99],"smoothness":[101],"enable":[102],"wiring.":[104],"We":[105],"present":[106],"micro-via":[108],"fabrication":[109],"technology":[110],"using":[111,198],"KrF":[112],"excimer":[113,201],"laser":[114,202],"direct":[115],"ablation":[116],"drilling.":[117],"This":[118],"method":[119],"offers":[120],"several":[121],"advantages,":[122],"including:":[123],"1)":[124],"ability":[126,183],"process":[128],"both":[130],"organic":[131],"inorganic":[133],"materials,":[134],"2)":[135],"no":[136],"need":[137],"or":[138],"reduction":[139],"etching,":[141],"3)":[142],"capability":[144],"fabricate":[146],"aspect":[148,154,193],"ratio":[149,194],"Through-Glass-Via":[150],"(TGV)":[151],"(diameter:":[152],"<20microns,":[153],"ratio:":[155],">50)":[156],"thick":[158],"glass":[159],"exceeding":[160],"1":[161],"mm,":[162],"4)":[163],"productivity":[165,187],"through":[166],"specially":[167],"designed":[168],"optics,":[169],"5)":[171],"easy":[172],"In":[177],"this":[178],"study,":[179],"we":[180],"demonstrated":[181],"achieve":[185],"processing":[188],"over":[190],"1000":[191],"TGVs":[195],"per":[196],"second":[197],"single":[200],"light":[203],"source":[204],"DOE":[207],"(Diffractive":[208],"Optical":[209],"Element).":[210],"By":[211],"exchanging":[212],"DOE,":[214],"it":[215],"possible":[217],"change":[219],"number":[221],"holes":[223],"processed":[224],"simultaneously.":[225],"metallization":[227],"tests":[228],"currently":[230],"being":[231],"conducted.":[232]},"counts_by_year":[],"updated_date":"2026-10-12T09:40:04.860316","created_date":"2026-01-28T00:00:00"}