{"id":"https://openalex.org/W70155277","doi":"https://doi.org/10.1007/978-94-011-1082-2_25","title":"Thermal characterization and design for high performance multichip module type laminate","display_name":"Thermal characterization and design for high performance multichip module type laminate","publication_year":1994,"publication_date":"1994-01-01","ids":{"openalex":"https://openalex.org/W70155277","doi":"https://doi.org/10.1007/978-94-011-1082-2_25","mag":"70155277"},"language":"en","primary_location":{"id":"doi:10.1007/978-94-011-1082-2_25","doi":"https://doi.org/10.1007/978-94-011-1082-2_25","is_oa":false,"landing_page_url":"https://doi.org/10.1007/978-94-011-1082-2_25","pdf_url":null,"source":{"id":"https://openalex.org/S4306463937","display_name":"Springer eBooks","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319965","host_organization_name":"Springer Nature","host_organization_lineage":["https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Nature"],"type":"ebook platform"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Thermal Management of Electronic Systems","raw_type":"book-chapter"},"volume":{"id":"https://openalex.org/W2610872596","display_name":"Thermal Management of Electronic Systems"},"type":"book-chapter","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5044666729","display_name":"Erik Lauwers","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"E. Lauwers","raw_affiliation_strings":["ALCATEL BELL Research Center, Antwerp, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ALCATEL BELL Research Center, Antwerp, Belgium","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004965408","display_name":"Ann Ackaert","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"A. Ackaert","raw_affiliation_strings":["ALCATEL BELL Research Center, Antwerp, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ALCATEL BELL Research Center, Antwerp, Belgium","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5077434675","display_name":"K. Allaert","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"K. Allaert","raw_affiliation_strings":["ALCATEL BELL Research Center, Antwerp, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ALCATEL BELL Research Center, Antwerp, Belgium","institution_ids":[]}]},{"author_position":"middle","author":{"id":null,"display_name":"W. Temmerman","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"W. Temmerman","raw_affiliation_strings":["ALCATEL BELL Switching Hardware, Antwerp, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ALCATEL BELL Switching Hardware, Antwerp, Belgium","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5009522660","display_name":"W. Nelemans","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"W. Nelemans","raw_affiliation_strings":["ALCATEL BELL Switching Hardware, Antwerp, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ALCATEL BELL Switching Hardware, Antwerp, Belgium","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5048405838","display_name":"Tim Goossens","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"T. Goossens","raw_affiliation_strings":["ALCATEL BELL Switching Hardware, Antwerp, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ALCATEL BELL Switching Hardware, Antwerp, Belgium","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.0502424,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"277","last_page":"286"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.4912000000476837,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.4912000000476837,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.16580000519752502,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13116","display_name":"Heat Transfer and Numerical Methods","score":0.16410000622272491,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/multichip-modules","display_name":"multichip modules","score":0.8080000281333923},{"id":"https://openalex.org/keywords/mcm-l","display_name":"MCM-L","score":0.878000020980835},{"id":"https://openalex.org/keywords/thermal-management","display_name":"thermal management","score":0.871999979019165},{"id":"https://openalex.org/keywords/heat-spreader","display_name":"heat spreader","score":0.7990000247955322},{"id":"https://openalex.org/keywords/thermal-vias","display_name":"thermal vias","score":0.8980000019073486},{"id":"https://openalex.org/keywords/thermal-wells","display_name":"thermal wells","score":0.8880000114440918},{"id":"https://openalex.org/keywords/heat-sinks","display_name":"heat sinks","score":0.9359999895095825},{"id":"https://openalex.org/keywords/power-dissipation","display_name":"power dissipation","score":0.8460000157356262},{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"electronic packaging","score":0.4519999921321869}],"concepts":[{"id":"https://openalex.org/C48632124","wikidata":"https://www.wikidata.org/wiki/Q617088","display_name":"Heat spreader","level":3,"score":0.7589014768600464},{"id":"https://openalex.org/C186937647","wikidata":"https://www.wikidata.org/wiki/Q1796959","display_name":"Heat sink","level":2,"score":0.733702540397644},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6748390197753906},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6139183044433594},{"id":"https://openalex.org/C172100665","wikidata":"https://www.wikidata.org/wiki/Q7465774","display_name":"Thermal conduction","level":2,"score":0.5612530708312988},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5584744215011597},{"id":"https://openalex.org/C50517652","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat transfer","level":2,"score":0.5374693274497986},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.5370921492576599},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.5290942192077637},{"id":"https://openalex.org/C200657195","wikidata":"https://www.wikidata.org/wiki/Q868947","display_name":"Thermal grease","level":3,"score":0.49945950508117676},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.4640030264854431},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.44416093826293945},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.43342190980911255},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.4309949576854706},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.4088667035102844},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.403778076171875},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.2916189432144165},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.267532616853714},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.23853996396064758},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2103525698184967},{"id":"https://openalex.org/C57879066","wikidata":"https://www.wikidata.org/wiki/Q41217","display_name":"Mechanics","level":1,"score":0.1485641598701477},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.11159354448318481},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0763196051120758},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/978-94-011-1082-2_25","doi":"https://doi.org/10.1007/978-94-011-1082-2_25","is_oa":false,"landing_page_url":"https://doi.org/10.1007/978-94-011-1082-2_25","pdf_url":null,"source":{"id":"https://openalex.org/S4306463937","display_name":"Springer eBooks","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319965","host_organization_name":"Springer Nature","host_organization_lineage":["https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Nature"],"type":"ebook platform"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Thermal Management of Electronic Systems","raw_type":"book-chapter"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W1633660959","https://openalex.org/W2017795603","https://openalex.org/W2097830620"],"related_works":["https://openalex.org/W2371748129","https://openalex.org/W2137705108","https://openalex.org/W1953640532","https://openalex.org/W2020385907","https://openalex.org/W2169873564","https://openalex.org/W1848003096","https://openalex.org/W7067773164","https://openalex.org/W4242967419","https://openalex.org/W2006648350","https://openalex.org/W2134860081"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":1}],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2016-06-24T00:00:00"}