{"id":"https://openalex.org/W67803060","doi":"https://doi.org/10.1007/978-0-387-68422-2_9","title":"Lead-Free Board Surface Finishes","display_name":"Lead-Free Board Surface Finishes","publication_year":2007,"publication_date":"2007-01-01","ids":{"openalex":"https://openalex.org/W67803060","doi":"https://doi.org/10.1007/978-0-387-68422-2_9","mag":"67803060"},"language":"en","primary_location":{"id":"doi:10.1007/978-0-387-68422-2_9","doi":"https://doi.org/10.1007/978-0-387-68422-2_9","is_oa":false,"landing_page_url":"https://doi.org/10.1007/978-0-387-68422-2_9","pdf_url":null,"source":{"id":"https://openalex.org/S4306463937","display_name":"Springer eBooks","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319965","host_organization_name":"Springer Nature","host_organization_lineage":["https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Nature"],"type":"ebook platform"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Lead-Free Soldering","raw_type":"book-chapter"},"volume":{"id":"https://openalex.org/W2485452590","display_name":"Lead-Free Soldering"},"type":"book-chapter","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5026646969","display_name":"Hugh Roberts","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I57135942","display_name":"Atotech (United States)","ror":"https://ror.org/02bskft61","country_code":"US","type":"company","lineage":["https://openalex.org/I4210098619","https://openalex.org/I57135942"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Hugh Roberts","raw_affiliation_strings":["Atotech USA Inc., 1750 Overview Drive, 29730, Rock Hill, SC, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Atotech USA Inc., 1750 Overview Drive, 29730, Rock Hill, SC, USA","institution_ids":["https://openalex.org/I57135942"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5067124393","display_name":"Kuldip Johal","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I57135942","display_name":"Atotech (United States)","ror":"https://ror.org/02bskft61","country_code":"US","type":"company","lineage":["https://openalex.org/I4210098619","https://openalex.org/I57135942"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kuldip Johal","raw_affiliation_strings":["Atotech USA Inc., 1750 Overview Drive, 29730, Rock Hill, SC, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Atotech USA Inc., 1750 Overview Drive, 29730, Rock Hill, SC, USA","institution_ids":["https://openalex.org/I57135942"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I57135942"],"apc_list":null,"apc_paid":null,"fwci":0.5116,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.83245643,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":87,"max":93},"biblio":{"volume":null,"issue":null,"first_page":"221","last_page":"269"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.00039999998989515007,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10310","display_name":"Corrosion Behavior and Inhibition","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/printed-circuit-boards","display_name":"printed circuit boards","score":0.9470000267028809},{"id":"https://openalex.org/keywords/lead-free-solder","display_name":"lead-free solder","score":0.7559999823570251},{"id":"https://openalex.org/keywords/solder-bonding","display_name":"solder bonding","score":0.367000013589859},{"id":"https://openalex.org/keywords/reflow-cycles","display_name":"reflow cycles","score":0.8050000071525574}],"concepts":[{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.8323261141777039},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.7054278254508972},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.6728468537330627},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5311709046363831},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.48883503675460815},{"id":"https://openalex.org/C2777093003","wikidata":"https://www.wikidata.org/wiki/Q6508345","display_name":"Lead (geology)","level":2,"score":0.475331574678421},{"id":"https://openalex.org/C2776584680","wikidata":"https://www.wikidata.org/wiki/Q191042","display_name":"Surface-mount technology","level":3,"score":0.4514245092868805},{"id":"https://openalex.org/C71039073","wikidata":"https://www.wikidata.org/wiki/Q3439090","display_name":"Surface finish","level":2,"score":0.44916611909866333},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.4177263081073761},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.4112327992916107},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3550384044647217},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.29404371976852417},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.18544620275497437},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.14915642142295837},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.05236580967903137},{"id":"https://openalex.org/C28413391","wikidata":"https://www.wikidata.org/wiki/Q785542","display_name":"Capillary number","level":3,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C196806460","wikidata":"https://www.wikidata.org/wiki/Q188603","display_name":"Capillary action","level":2,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C114793014","wikidata":"https://www.wikidata.org/wiki/Q52109","display_name":"Geomorphology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/978-0-387-68422-2_9","doi":"https://doi.org/10.1007/978-0-387-68422-2_9","is_oa":false,"landing_page_url":"https://doi.org/10.1007/978-0-387-68422-2_9","pdf_url":null,"source":{"id":"https://openalex.org/S4306463937","display_name":"Springer eBooks","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319965","host_organization_name":"Springer Nature","host_organization_lineage":["https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Nature"],"type":"ebook platform"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Lead-Free Soldering","raw_type":"book-chapter"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W1996625493","https://openalex.org/W2022578879","https://openalex.org/W2042273585","https://openalex.org/W2126717966","https://openalex.org/W2170798770","https://openalex.org/W2185709272","https://openalex.org/W2255642659","https://openalex.org/W4285719527"],"related_works":["https://openalex.org/W2062877309","https://openalex.org/W2125014995","https://openalex.org/W1964807967","https://openalex.org/W1553104612","https://openalex.org/W2138471711","https://openalex.org/W4246653456","https://openalex.org/W3153918630","https://openalex.org/W2033581613","https://openalex.org/W2269753143","https://openalex.org/W2105557244"],"abstract_inverted_index":null,"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-10-10T09:11:00.788812","created_date":"2016-06-24T00:00:00"}