{"id":"https://openalex.org/W63245074","doi":"https://doi.org/10.1007/978-1-4613-9850-9_27","title":"Thermal Conductivity of Microsphere Cryogenic Insulation","display_name":"Thermal Conductivity of Microsphere Cryogenic Insulation","publication_year":1977,"publication_date":"1977-01-01","ids":{"openalex":"https://openalex.org/W63245074","doi":"https://doi.org/10.1007/978-1-4613-9850-9_27","mag":"63245074"},"language":"en","primary_location":{"id":"doi:10.1007/978-1-4613-9850-9_27","doi":"https://doi.org/10.1007/978-1-4613-9850-9_27","is_oa":false,"landing_page_url":"https://doi.org/10.1007/978-1-4613-9850-9_27","pdf_url":null,"source":{"id":"https://openalex.org/S4306463937","display_name":"Springer eBooks","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319965","host_organization_name":"Springer Nature","host_organization_lineage":["https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Nature"],"type":"ebook platform"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advances in Cryogenic Engineering","raw_type":"book-chapter"},"volume":{"id":"https://openalex.org/W4293397839","display_name":"Advances in Cryogenic Engineering"},"type":"book-chapter","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5053728921","display_name":"A. L. Nayak","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I95457486","display_name":"University of California, Berkeley","ror":"https://ror.org/01an7q238","country_code":"US","type":"education","lineage":["https://openalex.org/I95457486"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. L. Nayak","raw_affiliation_strings":["University of California, Berkeley, California, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of California, Berkeley, California, USA","institution_ids":["https://openalex.org/I95457486"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5028325614","display_name":"C. L. Tien","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I95457486","display_name":"University of California, Berkeley","ror":"https://ror.org/01an7q238","country_code":"US","type":"education","lineage":["https://openalex.org/I95457486"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"C. L. Tien","raw_affiliation_strings":["University of California, Berkeley, California, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of California, Berkeley, California, USA","institution_ids":["https://openalex.org/I95457486"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I95457486"],"apc_list":null,"apc_paid":null,"fwci":4.4578,"has_fulltext":false,"cited_by_count":16,"citation_normalized_percentile":{"value":0.92391304,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":88,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"251","last_page":"262"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T13200","display_name":"Spacecraft and Cryogenic Technologies","score":0.8833000063896179,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T13200","display_name":"Spacecraft and Cryogenic Technologies","score":0.8833000063896179,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12063","display_name":"Heat and Mass Transfer in Porous Media","score":0.02449999935925007,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12195","display_name":"Aerogels and thermal insulation","score":0.019500000402331352,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"thermal conductivity","score":0.9390000104904175},{"id":"https://openalex.org/keywords/cryogenic-insulation","display_name":"cryogenic insulation","score":0.8479999899864197},{"id":"https://openalex.org/keywords/microspheres","display_name":"microspheres","score":0.9319999814033508},{"id":"https://openalex.org/keywords/analytical-prediction","display_name":"analytical prediction","score":0.7879999876022339},{"id":"https://openalex.org/keywords/insulation-performance","display_name":"insulation performance","score":0.5699999928474426}],"concepts":[{"id":"https://openalex.org/C189942447","wikidata":"https://www.wikidata.org/wiki/Q61186","display_name":"Microsphere","level":2,"score":0.8366774320602417},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.8182909488677979},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6456923484802246},{"id":"https://openalex.org/C64839514","wikidata":"https://www.wikidata.org/wiki/Q918306","display_name":"Thermal insulation","level":3,"score":0.5941941738128662},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.4680563807487488},{"id":"https://openalex.org/C131540310","wikidata":"https://www.wikidata.org/wiki/Q907564","display_name":"Conductivity","level":2,"score":0.44950827956199646},{"id":"https://openalex.org/C50517652","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat transfer","level":2,"score":0.44288545846939087},{"id":"https://openalex.org/C206394296","wikidata":"https://www.wikidata.org/wiki/Q5567119","display_name":"Glass microsphere","level":3,"score":0.4255378544330597},{"id":"https://openalex.org/C116915560","wikidata":"https://www.wikidata.org/wiki/Q83504","display_name":"Nuclear engineering","level":1,"score":0.389814168214798},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3232012987136841},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.26012635231018066},{"id":"https://openalex.org/C42360764","wikidata":"https://www.wikidata.org/wiki/Q83588","display_name":"Chemical engineering","level":1,"score":0.17834323644638062},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.16795343160629272},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.13092929124832153},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.10476654767990112},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.05622214078903198},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/978-1-4613-9850-9_27","doi":"https://doi.org/10.1007/978-1-4613-9850-9_27","is_oa":false,"landing_page_url":"https://doi.org/10.1007/978-1-4613-9850-9_27","pdf_url":null,"source":{"id":"https://openalex.org/S4306463937","display_name":"Springer eBooks","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319965","host_organization_name":"Springer Nature","host_organization_lineage":["https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Nature"],"type":"ebook platform"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Advances in Cryogenic Engineering","raw_type":"book-chapter"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":21,"referenced_works":["https://openalex.org/W585539812","https://openalex.org/W1535438844","https://openalex.org/W1972253980","https://openalex.org/W2003932517","https://openalex.org/W2016128458","https://openalex.org/W2031498913","https://openalex.org/W2047549232","https://openalex.org/W2072179497","https://openalex.org/W2146188096","https://openalex.org/W2165429632","https://openalex.org/W2913499647","https://openalex.org/W2946678122","https://openalex.org/W4212857284","https://openalex.org/W4240136850","https://openalex.org/W4255325196","https://openalex.org/W4301023011","https://openalex.org/W4301327624","https://openalex.org/W6603374957","https://openalex.org/W6634905672","https://openalex.org/W6814272401","https://openalex.org/W6831847361"],"related_works":["https://openalex.org/W2015488549","https://openalex.org/W628507945","https://openalex.org/W2024646352","https://openalex.org/W33125385","https://openalex.org/W1975122034","https://openalex.org/W1710674302","https://openalex.org/W175989530","https://openalex.org/W164487242","https://openalex.org/W1498682758","https://openalex.org/W2068536902"],"abstract_inverted_index":null,"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2018,"cited_by_count":2},{"year":2016,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2012,"cited_by_count":2}],"updated_date":"2026-10-10T09:11:00.788812","created_date":"2016-06-24T00:00:00"}