{"id":"https://openalex.org/W4416880596","doi":"https://doi.org/10.37665/smyhsbt10329","title":"Advancement of Preform Technology to Reduce QFN Voiding","display_name":"Advancement of Preform Technology to Reduce QFN Voiding","publication_year":2014,"publication_date":"2014-09-01","ids":{"openalex":"https://openalex.org/W4416880596","doi":"https://doi.org/10.37665/smyhsbt10329"},"language":"en","primary_location":{"id":"doi:10.37665/smyhsbt10329","doi":"https://doi.org/10.37665/smyhsbt10329","is_oa":false,"landing_page_url":"https://doi.org/10.37665/smyhsbt10329","pdf_url":null,"source":{"id":"https://openalex.org/S5407054194","display_name":"SMTA International","issn_l":"3067-8889","issn":["3067-8889"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SMTA International","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113856047","display_name":"Tim Jensen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210113846","display_name":"Indium Corporation (United States)","ror":"https://ror.org/01dp84930","country_code":"US","type":"company","lineage":["https://openalex.org/I4210113846"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Tim Jensen","raw_affiliation_strings":["Indium Corporation, Clinton, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Indium Corporation, Clinton, NY, USA","institution_ids":["https://openalex.org/I4210113846"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006829200","display_name":"Seth Homer","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210113846","display_name":"Indium Corporation (United States)","ror":"https://ror.org/01dp84930","country_code":"US","type":"company","lineage":["https://openalex.org/I4210113846"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Seth Homer","raw_affiliation_strings":["Indium Corporation, Clinton, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Indium Corporation, Clinton, NY, USA","institution_ids":["https://openalex.org/I4210113846"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5074921959","display_name":"Greg Wade","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210113846","display_name":"Indium Corporation (United States)","ror":"https://ror.org/01dp84930","country_code":"US","type":"company","lineage":["https://openalex.org/I4210113846"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Greg Wade","raw_affiliation_strings":["Indium Corporation, Clinton, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Indium Corporation, Clinton, NY, USA","institution_ids":["https://openalex.org/I4210113846"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210113846"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"16","issue":"1","first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/qfn-package","display_name":"QFN package","score":0.7540000081062317},{"id":"https://openalex.org/keywords/solder-joint-voiding","display_name":"solder joint voiding","score":0.8510000109672546},{"id":"https://openalex.org/keywords/thermal-pads","display_name":"thermal pads","score":0.5640000104904175},{"id":"https://openalex.org/keywords/solder-paste","display_name":"solder paste","score":0.5},{"id":"https://openalex.org/keywords/surface-mount-assembly","display_name":"surface mount assembly","score":0.6370000243186951}],"concepts":[{"id":"https://openalex.org/C162877825","wikidata":"https://www.wikidata.org/wiki/Q2121809","display_name":"Quad Flat No-leads package","level":4,"score":0.9750000238418579},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.6807000041007996},{"id":"https://openalex.org/C191281628","wikidata":"https://www.wikidata.org/wiki/Q977971","display_name":"Solder paste","level":3,"score":0.41839998960494995},{"id":"https://openalex.org/C18762648","wikidata":"https://www.wikidata.org/wiki/Q42213","display_name":"Work (physics)","level":2,"score":0.36340001225471497},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3628000020980835},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.33649998903274536},{"id":"https://openalex.org/C2779772531","wikidata":"https://www.wikidata.org/wiki/Q19689164","display_name":"Void (composites)","level":2,"score":0.31790000200271606},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.2948000133037567},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.2808000147342682},{"id":"https://openalex.org/C77595967","wikidata":"https://www.wikidata.org/wiki/Q3151013","display_name":"Forensic engineering","level":1,"score":0.2770000100135803},{"id":"https://openalex.org/C132943942","wikidata":"https://www.wikidata.org/wiki/Q2562511","display_name":"Footprint","level":2,"score":0.2750999927520752},{"id":"https://openalex.org/C2987875673","wikidata":"https://www.wikidata.org/wiki/Q187939","display_name":"Manufacturing process","level":2,"score":0.27300000190734863},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.27160000801086426},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.26829999685287476},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.2535000145435333},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.25110000371932983}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.37665/smyhsbt10329","doi":"https://doi.org/10.37665/smyhsbt10329","is_oa":false,"landing_page_url":"https://doi.org/10.37665/smyhsbt10329","pdf_url":null,"source":{"id":"https://openalex.org/S5407054194","display_name":"SMTA International","issn_l":"3067-8889","issn":["3067-8889"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SMTA International","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W4416876668","https://openalex.org/W2261765881","https://openalex.org/W4416877960","https://openalex.org/W2187813497","https://openalex.org/W2161910182","https://openalex.org/W2030673188","https://openalex.org/W4416879849","https://openalex.org/W4308190770","https://openalex.org/W2558355271","https://openalex.org/W2026743471"],"abstract_inverted_index":{"ABSTRACT":[0],"There":[1,92,182],"has":[2,44],"been":[3],"a":[4,24,35,94,172,186,211],"significant":[5,95],"growth":[6],"in":[7,88,152,155],"the":[8,16,39,51,56,59,67,70,108,117,130,163,204,226,231],"use":[9,118,205],"of":[10,26,58,69,72,80,97,119,174,206,234],"low":[11],"stand-off":[12],"QFN":[13,21,33,76,109,180,239],"components":[14],"over":[15,28],"past":[17],"10":[18],"years.":[19],"The":[20,32,78,159],"package":[22],"provides":[23],"number":[25],"advantages":[27],"its":[29],"leaded":[30],"counterparts.":[31],"gives":[34],"smaller":[36],"footprint":[37],"on":[38],"PCB.":[40],"In":[41,166],"addition,":[42],"it":[43],"much":[45],"better":[46],"thermal":[47,64,131],"performance":[48,233],"due":[49],"to":[50,104,126,142,178,189,202,224,229],"large":[52],"solder":[53,90,127],"pad":[54,65],"under":[55,107],"body":[57],"part.":[60],"However,":[61],"this":[62,112,167,235],"soldered":[63],"is":[66,83,93,148,210],"source":[68],"majority":[71],"assembly":[73],"complaints":[74,82],"with":[75,85,242],"parts.":[77,110],"biggest":[79],"these":[81,156,191,217],"associated":[84],"excessive":[86],"voiding":[87,106,164],"those":[89],"joints.":[91],"amount":[96],"published":[98],"work":[99,141,221],"looking":[100],"at":[101],"process":[102,175,236],"optimization":[103],"reduce":[105,179],"Because":[111],"was":[113,121,222],"not":[114,194],"overly":[115,195],"effective,":[116],"preforms":[120,209],"considered":[122],"as":[123,188,201],"an":[124,149],"alternative":[125],"paste":[128],"for":[129,215],"pad.":[132],"This":[133],"approach":[134],"proved":[135],"quite":[136],"effective":[137,213],"but":[138],"required":[139],"more":[140,212],"be":[143,171,185,199],"consistently":[144],"successful.":[145],"Additionally,":[146,219],"there":[147,169],"increased":[150],"interest":[151],"using":[153,238],"vias":[154,160],"ground":[157,240],"pads.":[158],"further":[161],"exacerbate":[162],"challenge.":[165],"paper,":[168],"will":[170,183,198],"review":[173],"improvement":[176],"attempts":[177],"voiding.":[181],"also":[184],"discussion":[187],"why":[190,203],"approaches":[192],"were":[193],"effective.":[196],"Evidence":[197],"shown":[200],"flux-":[207],"coated":[208],"method":[214],"reducing":[216],"voids.":[218],"recent":[220],"done":[223],"optimize":[225],"preform":[227],"design":[228],"maximize":[230],"void":[232],"when":[237],"pads":[241],"vias.":[243]},"counts_by_year":[],"updated_date":"2026-10-28T10:33:24.094632","created_date":"2025-12-01T00:00:00"}