{"id":"https://openalex.org/W4416879656","doi":"https://doi.org/10.37665/wesvnat67623","title":"Product Reliability","display_name":"Product Reliability","publication_year":2024,"publication_date":"2024-05-01","ids":{"openalex":"https://openalex.org/W4416879656","doi":"https://doi.org/10.37665/wesvnat67623"},"language":"en","primary_location":{"id":"doi:10.37665/wesvnat67623","doi":"https://doi.org/10.37665/wesvnat67623","is_oa":false,"landing_page_url":"https://doi.org/10.37665/wesvnat67623","pdf_url":null,"source":{"id":"https://openalex.org/S5407054200","display_name":"On-Demand Webinars","issn_l":"3068-0085","issn":["3068-0085"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"On-Demand Webinars","raw_type":"journal-article"},"volume":null,"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5073665504","display_name":"Jean\u2010Paul Clech","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Jean-Paul Clech","raw_affiliation_strings":["EPSI"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"EPSI","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5109880191","display_name":"Jasbir Bath","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Jasbir Bath","raw_affiliation_strings":["Bath Consultancy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Bath Consultancy","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.15398571,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"17","issue":"1","first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10780","display_name":"Reliability and Maintenance Optimization","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2213","display_name":"Safety, Risk, Reliability and Quality"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/lead-free-solder","display_name":"lead-free solder","score":0.7979999780654907},{"id":"https://openalex.org/keywords/solder-joint-reliability","display_name":"solder joint reliability","score":0.9800000190734863},{"id":"https://openalex.org/keywords/sn-ag-cu-solder","display_name":"Sn-Ag-Cu solder","score":0.9810000061988831},{"id":"https://openalex.org/keywords/printed-circuit-board-assembly","display_name":"printed circuit board assembly","score":0.8299999833106995},{"id":"https://openalex.org/keywords/reflow-soldering","display_name":"reflow soldering","score":0.6259999871253967},{"id":"https://openalex.org/keywords/intermetallic-compounds","display_name":"intermetallic compounds","score":0.906000018119812},{"id":"https://openalex.org/keywords/solder-paste-volume","display_name":"solder paste volume","score":0.8119999766349792},{"id":"https://openalex.org/keywords/solder-alloy-composition","display_name":"solder alloy composition","score":0.8109999895095825},{"id":"https://openalex.org/keywords/low-temperature-solder","display_name":"low-temperature solder","score":0.8100000023841858},{"id":"https://openalex.org/keywords/reliability-testing","display_name":"reliability testing","score":0.5120000243186951},{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"electronic packaging","score":0.546999990940094},{"id":"https://openalex.org/keywords/surface-mount-technology","display_name":"surface mount technology","score":0.6520000100135803}],"concepts":[{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.8575999736785889},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.8051999807357788},{"id":"https://openalex.org/C18555067","wikidata":"https://www.wikidata.org/wiki/Q8375051","display_name":"Joint (building)","level":2,"score":0.6301000118255615},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.5356000065803528},{"id":"https://openalex.org/C90673727","wikidata":"https://www.wikidata.org/wiki/Q901718","display_name":"Product (mathematics)","level":2,"score":0.5306000113487244},{"id":"https://openalex.org/C191281628","wikidata":"https://www.wikidata.org/wiki/Q977971","display_name":"Solder paste","level":3,"score":0.5066999793052673},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.506600022315979},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4837000072002411},{"id":"https://openalex.org/C2778309119","wikidata":"https://www.wikidata.org/wiki/Q5121614","display_name":"Circuit reliability","level":4,"score":0.44029998779296875},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.41519999504089355},{"id":"https://openalex.org/C19351080","wikidata":"https://www.wikidata.org/wiki/Q1395034","display_name":"New product development","level":2,"score":0.40130001306533813},{"id":"https://openalex.org/C2779530757","wikidata":"https://www.wikidata.org/wiki/Q1207505","display_name":"Quality (philosophy)","level":2,"score":0.39980000257492065},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.391400009393692},{"id":"https://openalex.org/C2778413121","wikidata":"https://www.wikidata.org/wiki/Q2136790","display_name":"Reflow soldering","level":3,"score":0.3882000148296356},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.387800008058548},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3695000112056732},{"id":"https://openalex.org/C158379689","wikidata":"https://www.wikidata.org/wiki/Q3533504","display_name":"Accelerated life testing","level":3,"score":0.3336000144481659},{"id":"https://openalex.org/C9652623","wikidata":"https://www.wikidata.org/wiki/Q190109","display_name":"Field (mathematics)","level":2,"score":0.31869998574256897},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.3052999973297119},{"id":"https://openalex.org/C2776584680","wikidata":"https://www.wikidata.org/wiki/Q191042","display_name":"Surface-mount technology","level":3,"score":0.30309998989105225},{"id":"https://openalex.org/C2986741362","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronic product","level":2,"score":0.2883000075817108},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.263700008392334},{"id":"https://openalex.org/C2778306610","wikidata":"https://www.wikidata.org/wiki/Q7189696","display_name":"Physics of failure","level":4,"score":0.2624000012874603},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.2549999952316284},{"id":"https://openalex.org/C156893995","wikidata":"https://www.wikidata.org/wiki/Q5279680","display_name":"Dip soldering","level":4,"score":0.25279998779296875}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.37665/wesvnat67623","doi":"https://doi.org/10.37665/wesvnat67623","is_oa":false,"landing_page_url":"https://doi.org/10.37665/wesvnat67623","pdf_url":null,"source":{"id":"https://openalex.org/S5407054200","display_name":"On-Demand Webinars","issn_l":"3068-0085","issn":["3068-0085"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"On-Demand Webinars","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2349054874","https://openalex.org/W1964192416","https://openalex.org/W1965294826","https://openalex.org/W4232838736","https://openalex.org/W7098026299","https://openalex.org/W4404034005","https://openalex.org/W2944596332","https://openalex.org/W1986471408","https://openalex.org/W2379093368","https://openalex.org/W2540374487"],"abstract_inverted_index":{"ABSTRACT":[0],"OVERVIEW":[1],"Presentation":[2,73,383],"1:":[3],"Lead-Free":[4],"Solder":[5],"Joint":[6],"Reliability:":[7],"Overview":[8],"and":[9,49,107,112,125,160,176,188,201,216,223,234,237,243,256,263,278,295,322,350,363],"Challenges":[10],"Abstract:":[11,81],"This":[12],"talk":[13],"discusses":[14],"the":[15,34,87,140,258,269,282,288,313,325,332,341,344,352,370,375],"current":[16],"state":[17],"of":[18,36,62,95,142,165,251,260,271,328,343,354,372],"affairs":[19],"for":[20,253,318,331],"lead-free":[21,358],"solder":[22,41,96,100,173,205,224],"joint":[23,174,206,225],"reliability":[24,35,92,127,146,177],"in":[25,47,93,149,168,214,231,347,366,374],"circuit":[26],"board":[27],"assemblies.":[28],"Emphasis":[29],"is":[30,139,257,268,323,340,351],"placed":[31],"on":[32,78,357],"how":[33,86],"main":[37],"stream":[38],"SnAgCu":[39],"(SAC)":[40],"assemblies":[42,200],"was":[43,287],"investigated.":[44],"Remaining":[45],"gaps":[46],"assemblers":[48],"designers'":[50],"toolboxes":[51],"are":[52],"also":[53,209],"discussed,":[54],"including":[55],"challenges":[56],"brought":[57],"about":[58],"by":[59],"new":[60],"families":[61],"soldering":[63],"alloys":[64],"such":[65],"as":[66,211],"high":[67],"performance":[68],"or":[69],"low":[70],"temperature":[71],"solders.":[72],"2:":[74],"Assembly":[75,316],"Process":[76],"Role":[77],"Product":[79],"Reliability":[80],"The":[82],"presentation":[83],"will":[84],"discuss":[85],"assembly":[88],"process":[89,104],"affects":[90],"product":[91,217],"terms":[94],"paste":[97],"volume":[98],"used,":[99],"alloy":[101],"composition,":[102],"reflow":[103,109],"(soak":[105],"time":[106,118],"temperature,":[108,117],"ramp":[110],"up":[111],"cool":[113],"down":[114],"rate,":[115],"peak":[116],"over":[119,162,240,319],"liquidous),":[120],"IMC":[121],"(Intermetallic":[122],"Compounds)":[123],"formed":[124],"different":[126],"test":[128],"procedures":[129],"used":[130],"related":[131],"to":[132,195,197,281,379],"industry":[133],"standards.":[134],"SPEAKER":[135],"INFO":[136],"Jean-Paul":[137,228],"Clech":[138],"founder":[141],"EPSI":[143],"Inc.,":[144],"a":[145,249,296],"consulting":[147,277],"firm":[148],"Montclair,":[150],"New-Jersey.":[151],"He":[152,179,208,246,286,308,339,360],"started":[153],"his":[154],"career":[155],"at":[156,299],"AT&T":[157],"Bell":[158],"Labs":[159],"has":[161,180,229,238,247,309,361],"three":[163],"decades":[164],"practical":[166],"experience":[167],"electronic":[169,220],"packaging,":[170],"SMT":[171],"design,":[172],"quality":[175],"assurance.":[178],"developed":[181],"analytical":[182],"techniques,":[183],"design-for-reliability":[184],"rules,":[185],"material":[186],"properties":[187],"life":[189,204],"prediction":[190],"models":[191],"which":[192,275],"he":[193],"brings":[194],"bear":[196],"design":[198],"robust":[199],"solve":[202],"real":[203],"problems.":[207],"serves":[210],"an":[212],"expert-witness":[213],"patent":[215],"litigations":[218],"involving":[219],"packaging":[221],"issues":[222],"field":[226],"failures.":[227],"degrees":[230,365],"materials":[232],"science":[233],"mechanical":[235],"engineering":[236],"published":[239],"sixty":[241],"papers":[242],"book":[244],"chapters.":[245],"been":[248,310],"member":[250],"SMTA":[252,264,333,345],"30+":[254],"years":[255,321],"recipient":[259,342],"several":[261],"IPC":[262],"awards.":[265],"Jasbir":[266],"Bath":[267,272],"Owner":[270],"Consultancy":[273],"LLC,":[274],"provides":[276],"training":[279],"services":[280],"Electronics":[283],"Manufacturing":[284],"Industry.":[285],"Corporate":[289],"Lead":[290],"Engineer":[291],"with":[292,312],"Solectron":[293],"Corporation/Flex":[294],"Technical":[297,329],"Officer":[298],"ITRI":[300],"(International":[301],"Tin":[302,305],"Research":[303],"Institute/":[304],"Technology)":[306],"Ltd.":[307],"involved":[311],"INEMI":[314],"Board":[315],"Roadmap":[317],"10":[320],"currently":[324],"Vice":[326],"President":[327],"Programs":[330],"Silicon":[334],"Valley":[335],"(San":[336],"Jose)":[337],"chapter.":[338],"Excellence":[346],"Leadership":[348],"Award":[349],"editor":[353],"5":[355],"books":[356],"soldering.":[359],"BS":[362],"MS":[364],"Materials":[367],"Science":[368],"from":[369],"University":[371],"Manchester":[373],"U.K.":[376],"Files":[377],"Available":[378],"Download:":[380],"\u2022":[381,385],"Recorded":[382],"(On-Demand)":[384],"Slides":[386],"(PDF)":[387]},"counts_by_year":[],"updated_date":"2026-10-28T10:33:24.094632","created_date":"2025-12-01T00:00:00"}