{"id":"https://openalex.org/W4416877941","doi":"https://doi.org/10.37665/smjtoka39614","title":"Alloy and Process Optimization for Low AG Solders","display_name":"Alloy and Process Optimization for Low AG Solders","publication_year":2013,"publication_date":"2013-10-01","ids":{"openalex":"https://openalex.org/W4416877941","doi":"https://doi.org/10.37665/smjtoka39614"},"language":"en","primary_location":{"id":"doi:10.37665/smjtoka39614","doi":"https://doi.org/10.37665/smjtoka39614","is_oa":false,"landing_page_url":"https://doi.org/10.37665/smjtoka39614","pdf_url":null,"source":{"id":"https://openalex.org/S5407054194","display_name":"SMTA International","issn_l":"3067-8889","issn":["3067-8889"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SMTA International","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113856047","display_name":"Tim Jensen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210113846","display_name":"Indium Corporation (United States)","ror":"https://ror.org/01dp84930","country_code":"US","type":"company","lineage":["https://openalex.org/I4210113846"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Timothy Jensen","raw_affiliation_strings":["Indium Corporation, Clinton, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Indium Corporation, Clinton, NY, USA","institution_ids":["https://openalex.org/I4210113846"]}]},{"author_position":"last","author":{"id":null,"display_name":"Edward Briggs","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210113846","display_name":"Indium Corporation (United States)","ror":"https://ror.org/01dp84930","country_code":"US","type":"company","lineage":["https://openalex.org/I4210113846"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Edward Briggs","raw_affiliation_strings":["Indium Corporation, Clinton, NY, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Indium Corporation, Clinton, NY, USA","institution_ids":["https://openalex.org/I4210113846"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210113846"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"15","issue":"1","first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14128","display_name":"Metallurgical and Alloy Processes","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2500","display_name":"General Materials Science"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/low-silver-solder","display_name":"low silver solder","score":0.7549999952316284},{"id":"https://openalex.org/keywords/lead-free-solder","display_name":"lead-free solder","score":0.6930000185966492},{"id":"https://openalex.org/keywords/sac305","display_name":"SAC305","score":0.9919999837875366},{"id":"https://openalex.org/keywords/electronics-manufacturing","display_name":"electronics manufacturing","score":0.5669999718666077},{"id":"https://openalex.org/keywords/solder-joint-reliability","display_name":"solder joint reliability","score":0.6179999709129333}],"concepts":[{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.7749999761581421},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.647599995136261},{"id":"https://openalex.org/C26993612","wikidata":"https://www.wikidata.org/wiki/Q910154","display_name":"Panacea (medicine)","level":3,"score":0.6183000206947327},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5048999786376953},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.49720001220703125},{"id":"https://openalex.org/C115952470","wikidata":"https://www.wikidata.org/wiki/Q332172","display_name":"Process optimization","level":2,"score":0.48069998621940613},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.43880000710487366},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.42719998955726624},{"id":"https://openalex.org/C18762648","wikidata":"https://www.wikidata.org/wiki/Q42213","display_name":"Work (physics)","level":2,"score":0.40230000019073486},{"id":"https://openalex.org/C90673727","wikidata":"https://www.wikidata.org/wiki/Q901718","display_name":"Product (mathematics)","level":2,"score":0.38999998569488525},{"id":"https://openalex.org/C2987875673","wikidata":"https://www.wikidata.org/wiki/Q187939","display_name":"Manufacturing process","level":2,"score":0.35040000081062317},{"id":"https://openalex.org/C21880701","wikidata":"https://www.wikidata.org/wiki/Q2144042","display_name":"Process engineering","level":1,"score":0.3086000084877014},{"id":"https://openalex.org/C174998907","wikidata":"https://www.wikidata.org/wiki/Q357662","display_name":"Work in process","level":2,"score":0.30730000138282776},{"id":"https://openalex.org/C2985422158","wikidata":"https://www.wikidata.org/wiki/Q518350","display_name":"Copper alloy","level":3,"score":0.29980000853538513},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2921999990940094},{"id":"https://openalex.org/C2986741362","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronic product","level":2,"score":0.2651999890804291},{"id":"https://openalex.org/C175700187","wikidata":"https://www.wikidata.org/wiki/Q187939","display_name":"Manufacturing","level":2,"score":0.25609999895095825},{"id":"https://openalex.org/C19351080","wikidata":"https://www.wikidata.org/wiki/Q1395034","display_name":"New product development","level":2,"score":0.2540999948978424}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.37665/smjtoka39614","doi":"https://doi.org/10.37665/smjtoka39614","is_oa":false,"landing_page_url":"https://doi.org/10.37665/smjtoka39614","pdf_url":null,"source":{"id":"https://openalex.org/S5407054194","display_name":"SMTA International","issn_l":"3067-8889","issn":["3067-8889"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SMTA International","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W4416879044","https://openalex.org/W7095455634","https://openalex.org/W4416885400","https://openalex.org/W3094316402","https://openalex.org/W4416877348","https://openalex.org/W4416880457","https://openalex.org/W4416876616","https://openalex.org/W4416879825","https://openalex.org/W4241147382","https://openalex.org/W4416883761"],"abstract_inverted_index":{"ABSTRACT":[0],"In":[1],"the":[2,6,26,29,54,77,96,104,115,119,122],"early":[3],"2000\u2019s":[4],"as":[5,125,127],"electronics":[7,92],"manufacturing":[8],"industry":[9,30,105],"began":[10],"to":[11,13,87,113],"transition":[12],"Pb-Free,":[14],"there":[15,80],"was":[16],"a":[17,36,65,99],"significant":[18],"amount":[19],"of":[20,28,38,67,98,121],"work":[21],"done":[22],"researching":[23],"alloys.":[24,88],"Ultimately,":[25],"majority":[27],"settled":[31],"on":[32],"SAC305":[33],"which":[34],"has":[35,49],"composition":[37],"96.5%":[39],"Sn,":[40],"3.0%":[41],"Ag,":[42],"and":[43,72,95,118],"0.5%":[44],"Cu.":[45],"While":[46],"this":[47],"alloy":[48,101,116],"been":[50],"successfully":[51],"used":[52],"for":[53,91],"past":[55],"10":[56],"years,":[57],"it":[58,85,110],"isn\u2019t":[59],"without":[60],"its":[61],"challenges.":[62],"There":[63],"are":[64,93],"number":[66],"alternative":[68],"alloys":[69],"being":[70],"developed":[71],"actually":[73],"in":[74],"use":[75],"within":[76],"industry.":[78],"Unfortunately,":[79],"is":[81,107,111],"no":[82],"panacea":[83],"when":[84],"comes":[86],"The":[89],"needs":[90,106],"broad":[94],"likelihood":[97],"single":[100],"meeting":[102],"all":[103],"slim.":[108],"Therefore,":[109],"critical":[112],"understand":[114],"differences":[117],"impact":[120],"assembly":[123],"process":[124],"well":[126],"finished":[128],"product":[129],"reliability.":[130]},"counts_by_year":[],"updated_date":"2026-10-28T10:33:24.094632","created_date":"2025-12-01T00:00:00"}