{"id":"https://openalex.org/W4416877005","doi":"https://doi.org/10.37665/smvtmwj54419","title":"Latest Developments in Surface Finishing of PCBs Using Plasma Deposition","display_name":"Latest Developments in Surface Finishing of PCBs Using Plasma Deposition","publication_year":2010,"publication_date":"2010-10-01","ids":{"openalex":"https://openalex.org/W4416877005","doi":"https://doi.org/10.37665/smvtmwj54419"},"language":"en","primary_location":{"id":"doi:10.37665/smvtmwj54419","doi":"https://doi.org/10.37665/smvtmwj54419","is_oa":false,"landing_page_url":"https://doi.org/10.37665/smvtmwj54419","pdf_url":null,"source":{"id":"https://openalex.org/S5407054194","display_name":"SMTA International","issn_l":"3067-8889","issn":["3067-8889"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SMTA International","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113463641","display_name":"Tim von Werne","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Tim von Werne","raw_affiliation_strings":["Semblant Ltd., Cambridge Technology Centre, Melbourn, United Kingdom"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Semblant Ltd., Cambridge Technology Centre, Melbourn, United Kingdom","institution_ids":[]}]},{"author_position":"middle","author":{"id":null,"display_name":"Andy Brooks","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Andy Brooks","raw_affiliation_strings":["Semblant Ltd., Cambridge Technology Centre, Melbourn, United Kingdom"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Semblant Ltd., Cambridge Technology Centre, Melbourn, United Kingdom","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5060173238","display_name":"Siobhan Woollard","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Siobhan Woollard","raw_affiliation_strings":["Semblant Ltd., Cambridge Technology Centre, Melbourn, United Kingdom"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Semblant Ltd., Cambridge Technology Centre, Melbourn, United Kingdom","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.52084596,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"12","issue":"1","first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.0017999999690800905,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/printed-circuit-boards","display_name":"printed circuit boards","score":0.828000009059906},{"id":"https://openalex.org/keywords/plasma-deposition","display_name":"plasma deposition","score":0.7829999923706055},{"id":"https://openalex.org/keywords/surface-finishing","display_name":"surface finishing","score":0.621999979019165},{"id":"https://openalex.org/keywords/fluoropolymer-coatings","display_name":"fluoropolymer coatings","score":0.9779999852180481},{"id":"https://openalex.org/keywords/corrosion-resistance","display_name":"corrosion resistance","score":0.5640000104904175},{"id":"https://openalex.org/keywords/lead-free-soldering","display_name":"lead-free soldering","score":0.8040000200271606},{"id":"https://openalex.org/keywords/solderability","display_name":"solderability","score":0.9660000205039978},{"id":"https://openalex.org/keywords/intermetallic-compounds","display_name":"intermetallic compounds","score":0.7720000147819519},{"id":"https://openalex.org/keywords/solder-joint-strength","display_name":"solder joint strength","score":0.8119999766349792},{"id":"https://openalex.org/keywords/rf-performance","display_name":"RF performance","score":0.7049999833106995},{"id":"https://openalex.org/keywords/hazardous-waste-minimization","display_name":"hazardous waste reduction","score":0.7789999842643738}],"concepts":[{"id":"https://openalex.org/C2778115343","wikidata":"https://www.wikidata.org/wiki/Q7557224","display_name":"Solderability","level":3,"score":0.8090999722480774},{"id":"https://openalex.org/C2780708225","wikidata":"https://www.wikidata.org/wiki/Q1818706","display_name":"Fluoropolymer","level":3,"score":0.7354999780654907},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7182999849319458},{"id":"https://openalex.org/C2781448156","wikidata":"https://www.wikidata.org/wiki/Q1570182","display_name":"Coating","level":2,"score":0.6960999965667725},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.6934000253677368},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.6776999831199646},{"id":"https://openalex.org/C2777879630","wikidata":"https://www.wikidata.org/wiki/Q2009662","display_name":"Surface finishing","level":2,"score":0.6771000027656555},{"id":"https://openalex.org/C64297162","wikidata":"https://www.wikidata.org/wiki/Q1987070","display_name":"Deposition (geology)","level":3,"score":0.536300003528595},{"id":"https://openalex.org/C107365816","wikidata":"https://www.wikidata.org/wiki/Q114817","display_name":"Surface roughness","level":2,"score":0.5203999876976013},{"id":"https://openalex.org/C71039073","wikidata":"https://www.wikidata.org/wiki/Q3439090","display_name":"Surface finish","level":2,"score":0.4765999913215637},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.45419999957084656},{"id":"https://openalex.org/C20625102","wikidata":"https://www.wikidata.org/wiki/Q137056","display_name":"Corrosion","level":2,"score":0.3806000053882599},{"id":"https://openalex.org/C82706917","wikidata":"https://www.wikidata.org/wiki/Q10251","display_name":"Plasma","level":2,"score":0.37439998984336853},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3716000020503998},{"id":"https://openalex.org/C2776584680","wikidata":"https://www.wikidata.org/wiki/Q191042","display_name":"Surface-mount technology","level":3,"score":0.35499998927116394},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.3456000089645386},{"id":"https://openalex.org/C85344455","wikidata":"https://www.wikidata.org/wiki/Q757518","display_name":"Atmospheric-pressure plasma","level":3,"score":0.3375000059604645},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.3294999897480011},{"id":"https://openalex.org/C186897533","wikidata":"https://www.wikidata.org/wiki/Q898546","display_name":"Stellite","level":3,"score":0.32820001244544983},{"id":"https://openalex.org/C88504338","wikidata":"https://www.wikidata.org/wiki/Q1340805","display_name":"Weldability","level":3,"score":0.3228999972343445},{"id":"https://openalex.org/C163114375","wikidata":"https://www.wikidata.org/wiki/Q11260161","display_name":"Surface engineering","level":2,"score":0.30390000343322754},{"id":"https://openalex.org/C27501479","wikidata":"https://www.wikidata.org/wiki/Q428069","display_name":"Intermetallic","level":3,"score":0.302700012922287},{"id":"https://openalex.org/C134132462","wikidata":"https://www.wikidata.org/wiki/Q45621","display_name":"Ceramic","level":2,"score":0.3019999861717224},{"id":"https://openalex.org/C3017962496","wikidata":"https://www.wikidata.org/wiki/Q5655569","display_name":"Hard metal","level":2,"score":0.30169999599456787},{"id":"https://openalex.org/C60581705","wikidata":"https://www.wikidata.org/wiki/Q7201768","display_name":"Plasma cleaning","level":3,"score":0.29649999737739563},{"id":"https://openalex.org/C156893995","wikidata":"https://www.wikidata.org/wiki/Q5279680","display_name":"Dip soldering","level":4,"score":0.27950000762939453},{"id":"https://openalex.org/C79261456","wikidata":"https://www.wikidata.org/wiki/Q443756","display_name":"Profilometer","level":3,"score":0.26829999685287476},{"id":"https://openalex.org/C2779278059","wikidata":"https://www.wikidata.org/wiki/Q352525","display_name":"Adhesive bonding","level":4,"score":0.26440000534057617},{"id":"https://openalex.org/C40241539","wikidata":"https://www.wikidata.org/wiki/Q428855","display_name":"Base metal","level":3,"score":0.26420000195503235},{"id":"https://openalex.org/C138113353","wikidata":"https://www.wikidata.org/wiki/Q611639","display_name":"Polishing","level":2,"score":0.2517000138759613},{"id":"https://openalex.org/C2777240487","wikidata":"https://www.wikidata.org/wiki/Q3151010","display_name":"Hardfacing","level":3,"score":0.25099998712539673},{"id":"https://openalex.org/C525849907","wikidata":"https://www.wikidata.org/wiki/Q1096","display_name":"Tin","level":2,"score":0.2500999867916107}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.37665/smvtmwj54419","doi":"https://doi.org/10.37665/smvtmwj54419","is_oa":false,"landing_page_url":"https://doi.org/10.37665/smvtmwj54419","pdf_url":null,"source":{"id":"https://openalex.org/S5407054194","display_name":"SMTA International","issn_l":"3067-8889","issn":["3067-8889"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SMTA International","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W1971450603","https://openalex.org/W4416881033","https://openalex.org/W4388952493","https://openalex.org/W2507429334","https://openalex.org/W4416877317","https://openalex.org/W2027256316","https://openalex.org/W2083375239","https://openalex.org/W4292615732","https://openalex.org/W2111338493","https://openalex.org/W4416876608"],"abstract_inverted_index":{"ABSTRACT":[0],"The":[1,28,100,118,133],"use":[2],"of":[3,32,93,96,105,135,149],"plasma":[4,29,43,50,98],"deposition":[5,44],"represents":[6],"a":[7,22,41,47,90],"new":[8],"approach":[9],"to":[10,24,62,114,126,168],"final":[11],"surface":[12,107,170],"finishing":[13],"for":[14,160],"the":[15,63,69,75,150],"PCB":[16],"industry,":[17],"offering":[18],"significant":[19],"benefits":[20],"as":[21],"replacement":[23],"plated":[25],"metal":[26,116],"finishes.":[27,117,171],"finish":[30,108],"consists":[31],"an":[33],"ultra-thin":[34],"fluoropolymer":[35,120],"coating":[36,53,121],"which":[37],"is":[38],"applied":[39],"using":[40],"dry":[42],"process":[45,77],"in":[46],"low":[48],"power":[49],"chamber.":[51],"This":[52],"provides":[54],"unique":[55,119],"chemical":[56],"protection":[57],"and":[58,67,78,112,129,145,157,166],"substantial":[59,83],"corrosion":[60],"resistance":[61],"board":[64],"both":[65],"before":[66],"after":[68],"soldering":[70],"operation,":[71],"while":[72],"greatly":[73],"simplifying":[74],"manufacturing":[76],"reducing":[79],"hazardous":[80],"waste.":[81],"A":[82],"test":[84],"programme":[85],"has":[86,122],"been":[87,123],"undertaken":[88],"investigating":[89],"wide":[91],"range":[92],"performance":[94,104],"characteristics":[95],"this":[97,106],"finish.":[99],"high":[101],"frequency":[102],"RF":[103],"will":[109,138,163],"be":[110,139,164],"presented":[111,140],"contrasted":[113],"existing":[115],"specifically":[124],"developed":[125],"enable":[127],"consistent":[128],"reliable":[130],"Pb-free":[131],"soldering.":[132],"results":[134],"solderability":[136],"testing":[137],"with":[141],"cross":[142],"sectional":[143],"analysis":[144],"intermetallic":[146],"layer":[147],"composition":[148],"resulting":[151],"solder":[152],"joints":[153],"highlighted.":[154],"Joint":[155],"strength":[156],"reliability":[158],"data":[159],"assembled":[161],"boards":[162],"discussed":[165],"compared":[167],"alternative":[169]},"counts_by_year":[],"updated_date":"2026-10-28T10:33:24.094632","created_date":"2025-12-01T00:00:00"}