{"id":"https://openalex.org/W4416633098","doi":"https://doi.org/10.1115/1.4070487","title":"Microscale Oscillating Heat Pipe Model for Prediction of Startup, Oscillation Dynamics, and Dryout","display_name":"Microscale Oscillating Heat Pipe Model for Prediction of Startup, Oscillation Dynamics, and Dryout","publication_year":2025,"publication_date":"2025-11-25","ids":{"openalex":"https://openalex.org/W4416633098","doi":"https://doi.org/10.1115/1.4070487"},"language":"en","primary_location":{"id":"doi:10.1115/1.4070487","doi":"https://doi.org/10.1115/1.4070487","is_oa":false,"landing_page_url":"https://doi.org/10.1115/1.4070487","pdf_url":null,"source":{"id":"https://openalex.org/S4210206986","display_name":"ASME Journal of Heat and Mass Transfer","issn_l":"0022-1481","issn":["0022-1481","1528-8943","2832-8450","2832-8469"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310316053","host_organization_name":"ASM International","host_organization_lineage":["https://openalex.org/P4310316053"],"host_organization_lineage_names":["ASM International"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ASME Journal of Heat and Mass Transfer","raw_type":"journal-article"},"volume":null,"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100500826","display_name":"Qian Qian","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Qian Qian","raw_affiliation_strings":["School of Mechanical Engineering, Purdue University , 585 Purdue Mall , West Lafayette, IN 47907","School of Mechanical Engineering, Purdue University, 585 Purdue Mall, West Lafayette, Indiana 47907, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Purdue University , 585 Purdue Mall , West Lafayette, IN 47907","institution_ids":["https://openalex.org/I219193219"]},{"raw_affiliation_string":"School of Mechanical Engineering, Purdue University, 585 Purdue Mall, West Lafayette, Indiana 47907, USA","institution_ids":["https://openalex.org/I219193219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101691778","display_name":"Zhang Xin","orcid":"https://orcid.org/0000-0001-9052-6169","observed_orcids":["https://orcid.org/0000-0001-9052-6169"]},"institutions":[{"id":"https://openalex.org/I4210114115","display_name":"IBM Research - Thomas J. Watson Research Center","ror":"https://ror.org/0265w5591","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Xin Zhang","raw_affiliation_strings":["IBM T. J. Watson Research Center , 1101 Kitchawan Rd , Yorktown Heights, NY 10598","IBM T. J. Watson Research Center, 1101 Kitchawan Rd, Yorktown Heights, New York 10598, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM T. J. Watson Research Center , 1101 Kitchawan Rd , Yorktown Heights, NY 10598","institution_ids":["https://openalex.org/I4210114115"]},{"raw_affiliation_string":"IBM T. J. Watson Research Center, 1101 Kitchawan Rd, Yorktown Heights, New York 10598, USA","institution_ids":["https://openalex.org/I4210114115"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063620261","display_name":"Shurong Tian","orcid":"https://orcid.org/0000-0003-1991-8607","observed_orcids":["https://orcid.org/0000-0003-1991-8607"]},"institutions":[{"id":"https://openalex.org/I4210114115","display_name":"IBM Research - Thomas J. Watson Research Center","ror":"https://ror.org/0265w5591","country_code":"US","type":"facility","lineage":["https://openalex.org/I1341412227","https://openalex.org/I4210114115"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Shurong Tian","raw_affiliation_strings":["IBM T. J. Watson Research Center , 1101 Kitchawan Rd , Yorktown Heights, NY 10598","IBM T. J. Watson Research Center, 1101 Kitchawan Rd, Yorktown Heights, New York 10598, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IBM T. J. Watson Research Center , 1101 Kitchawan Rd , Yorktown Heights, NY 10598","institution_ids":["https://openalex.org/I4210114115"]},{"raw_affiliation_string":"IBM T. J. Watson Research Center, 1101 Kitchawan Rd, Yorktown Heights, New York 10598, USA","institution_ids":["https://openalex.org/I4210114115"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080315412","display_name":"Md Emadur Rahman","orcid":"https://orcid.org/0000-0002-4316-6284","observed_orcids":["https://orcid.org/0000-0002-4316-6284"]},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Md Emadur Rahman","raw_affiliation_strings":["Purdue University West Lafayette","School of Mechanical Engineering, Purdue University , 585 Purdue Mall , West Lafayette, IN 47907","School of Mechanical Engineering, Purdue University, 585 Purdue Mall, West Lafayette, Indiana 47907, USA"],"raw_orcid":"https://orcid.org/0000-0002-4316-6284","affiliations":[{"raw_affiliation_string":"Purdue University West Lafayette","institution_ids":["https://openalex.org/I219193219"]},{"raw_affiliation_string":"School of Mechanical Engineering, Purdue University , 585 Purdue Mall , West Lafayette, IN 47907","institution_ids":["https://openalex.org/I219193219"]},{"raw_affiliation_string":"School of Mechanical Engineering, Purdue University, 585 Purdue Mall, West Lafayette, Indiana 47907, USA","institution_ids":["https://openalex.org/I219193219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074249013","display_name":"Justin A. Weibel","orcid":"https://orcid.org/0000-0002-2046-406X","observed_orcids":["https://orcid.org/0000-0002-2046-406X"]},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Justin A. Weibel","raw_affiliation_strings":["School of Mechanical Engineering, Purdue University , 585 Purdue Mall , West Lafayette, IN 47907","School of Mechanical Engineering, Purdue University, 585 Purdue Mall, West Lafayette, Indiana 47907, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Purdue University , 585 Purdue Mall , West Lafayette, IN 47907","institution_ids":["https://openalex.org/I219193219"]},{"raw_affiliation_string":"School of Mechanical Engineering, Purdue University, 585 Purdue Mall, West Lafayette, Indiana 47907, USA","institution_ids":["https://openalex.org/I219193219"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5085059674","display_name":"Liang Pan","orcid":"https://orcid.org/0000-0002-6540-3957","observed_orcids":["https://orcid.org/0000-0002-6540-3957"]},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Liang Pan","raw_affiliation_strings":["Purdue University West Lafayette","School of Mechanical Engineering, Purdue University , 585 Purdue Mall , West Lafayette, IN 47907","School of Mechanical Engineering, Purdue University, 585 Purdue Mall, West Lafayette, Indiana 47907, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Purdue University West Lafayette","institution_ids":["https://openalex.org/I219193219"]},{"raw_affiliation_string":"School of Mechanical Engineering, Purdue University , 585 Purdue Mall , West Lafayette, IN 47907","institution_ids":["https://openalex.org/I219193219"]},{"raw_affiliation_string":"School of Mechanical Engineering, Purdue University, 585 Purdue Mall, West Lafayette, Indiana 47907, USA","institution_ids":["https://openalex.org/I219193219"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.20971248,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"148","issue":"3","first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10850","display_name":"Heat Transfer and Boiling Studies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10850","display_name":"Heat Transfer and Boiling Studies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12560","display_name":"Nuclear Engineering Thermal-Hydraulics","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/oscillating-heat-pipe","display_name":"pulsating heat pipe","score":0.8899999856948853},{"id":"https://openalex.org/keywords/two-phase-flow","display_name":"two-phase flow","score":0.5830000042915344},{"id":"https://openalex.org/keywords/dryout","display_name":"dryout","score":0.7110000252723694},{"id":"https://openalex.org/keywords/oscillatory-dynamics","display_name":"oscillatory dynamics","score":0.8769999742507935},{"id":"https://openalex.org/keywords/homogeneous-model","display_name":"homogeneous model","score":0.6890000104904175},{"id":"https://openalex.org/keywords/electronic-cooling","display_name":"electronics cooling","score":0.7360000014305115},{"id":"https://openalex.org/keywords/thermomechanical-instability","display_name":"thermomechanical instability","score":0.746999979019165},{"id":"https://openalex.org/keywords/heat-transfer-enhancement","display_name":"heat transfer enhancement","score":0.8180000185966492},{"id":"https://openalex.org/keywords/one-dimensional-modeling","display_name":"one-dimensional modeling","score":0.460999995470047}],"concepts":[{"id":"https://openalex.org/C179428855","wikidata":"https://www.wikidata.org/wiki/Q1069216","display_name":"Microscale chemistry","level":2,"score":0.9496999979019165},{"id":"https://openalex.org/C57879066","wikidata":"https://www.wikidata.org/wiki/Q41217","display_name":"Mechanics","level":1,"score":0.6966000199317932},{"id":"https://openalex.org/C63662833","wikidata":"https://www.wikidata.org/wiki/Q6839341","display_name":"Microchannel","level":2,"score":0.6924999952316284},{"id":"https://openalex.org/C50517652","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat transfer","level":2,"score":0.6222000122070312},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.554099977016449},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5115000009536743},{"id":"https://openalex.org/C37728375","wikidata":"https://www.wikidata.org/wiki/Q600568","display_name":"Heat pipe","level":3,"score":0.4641999900341034},{"id":"https://openalex.org/C2778439541","wikidata":"https://www.wikidata.org/wiki/Q7106412","display_name":"Oscillation (cell signaling)","level":2,"score":0.461899995803833},{"id":"https://openalex.org/C38349280","wikidata":"https://www.wikidata.org/wiki/Q1434290","display_name":"Flow (mathematics)","level":2,"score":0.39899998903274536},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.38429999351501465},{"id":"https://openalex.org/C66882249","wikidata":"https://www.wikidata.org/wiki/Q169336","display_name":"Homogeneous","level":2,"score":0.3228999972343445},{"id":"https://openalex.org/C2779301550","wikidata":"https://www.wikidata.org/wiki/Q217236","display_name":"Working fluid","level":2,"score":0.3070000112056732},{"id":"https://openalex.org/C129716092","wikidata":"https://www.wikidata.org/wiki/Q912130","display_name":"Internal heating","level":2,"score":0.3066999912261963},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.29809999465942383},{"id":"https://openalex.org/C131321042","wikidata":"https://www.wikidata.org/wiki/Q656685","display_name":"Operating temperature","level":2,"score":0.29789999127388},{"id":"https://openalex.org/C72293138","wikidata":"https://www.wikidata.org/wiki/Q909741","display_name":"Temperature measurement","level":2,"score":0.26190000772476196},{"id":"https://openalex.org/C2779426163","wikidata":"https://www.wikidata.org/wiki/Q17123760","display_name":"Microheater","level":4,"score":0.2599000036716461},{"id":"https://openalex.org/C148043351","wikidata":"https://www.wikidata.org/wiki/Q4456944","display_name":"Current (fluid)","level":2,"score":0.2581000030040741},{"id":"https://openalex.org/C536315585","wikidata":"https://www.wikidata.org/wiki/Q7698332","display_name":"Temperature control","level":2,"score":0.2578999996185303},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.25609999895095825}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1115/1.4070487","doi":"https://doi.org/10.1115/1.4070487","is_oa":false,"landing_page_url":"https://doi.org/10.1115/1.4070487","pdf_url":null,"source":{"id":"https://openalex.org/S4210206986","display_name":"ASME Journal of Heat and Mass Transfer","issn_l":"0022-1481","issn":["0022-1481","1528-8943","2832-8450","2832-8469"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310316053","host_organization_name":"ASM International","host_organization_lineage":["https://openalex.org/P4310316053"],"host_organization_lineage_names":["ASM International"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"ASME Journal of Heat and Mass Transfer","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"sustainable_development_goals_aurora":[],"study_designs":[],"awards":[{"id":"https://openalex.org/G7057073271","display_name":null,"funder_award_id":"Task No. 2878.020","funder_id":"https://openalex.org/F4320306087","funder_display_name":"Semiconductor Research Corporation"}],"funders":[{"id":"https://openalex.org/F4320306087","display_name":"Semiconductor Research Corporation","ror":"https://ror.org/047z4n946"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":39,"referenced_works":["https://openalex.org/W572825303","https://openalex.org/W1978530030","https://openalex.org/W1988990507","https://openalex.org/W1992235294","https://openalex.org/W1998997757","https://openalex.org/W2006846747","https://openalex.org/W2009319608","https://openalex.org/W2011075066","https://openalex.org/W2015727698","https://openalex.org/W2020931823","https://openalex.org/W2023925075","https://openalex.org/W2029491211","https://openalex.org/W2037738277","https://openalex.org/W2039390072","https://openalex.org/W2040997210","https://openalex.org/W2053249455","https://openalex.org/W2070923185","https://openalex.org/W2084691904","https://openalex.org/W2133378830","https://openalex.org/W2145399387","https://openalex.org/W2158890877","https://openalex.org/W2161618319","https://openalex.org/W2223228619","https://openalex.org/W2275816650","https://openalex.org/W2337350261","https://openalex.org/W2549773573","https://openalex.org/W2680613598","https://openalex.org/W2751334361","https://openalex.org/W2767144472","https://openalex.org/W2792351538","https://openalex.org/W2801486403","https://openalex.org/W2903992083","https://openalex.org/W2905422704","https://openalex.org/W2957458682","https://openalex.org/W2999287422","https://openalex.org/W4281858002","https://openalex.org/W4390005211","https://openalex.org/W4399572417","https://openalex.org/W4400498687"],"related_works":[],"abstract_inverted_index":{"Abstract":[0],"Microscale":[1],"oscillating":[2],"heat":[3,158,229,241],"pipes":[4],"(OHPs)":[5],"are":[6,102],"a":[7,202],"promising":[8],"technology":[9],"for":[10,23,204],"thermal":[11,19,152],"management":[12],"of":[13,28,66,73,91,106,116,151,166,209,244],"electronic":[14],"devices,":[15],"offering":[16],"high":[17],"effective":[18],"conductance":[20],"and":[21,43,76,83,95,109,119,145,212,220,246],"scalability":[22],"compact":[24],"integration.":[25],"Predictive":[26],"modeling":[27],"OHPs":[29,132,211,245],"at":[30],"the":[31,98,113,148,164,198,214,217,225,234],"microscale":[32,131,210],"remains":[33],"difficult":[34],"due":[35],"to":[36,60,129,134,239],"extreme":[37],"aspect":[38],"ratios,":[39],"complex":[40],"two-phase":[41,63],"transport,":[42],"transitions":[44,215],"across":[45],"multiple":[46],"operating":[47,142,222],"regimes.":[48,223],"In":[49,156,224],"this":[50],"study,":[51],"an":[52],"efficient":[53],"one-dimensional":[54],"(1D)":[55],"homogeneous":[56,79],"model":[57,126,175,235],"is":[58,127,161],"developed":[59],"simulate":[61],"unsteady":[62],"flow":[64],"dynamics":[65,208],"closed-loop":[67],"microchannel":[68],"OHPs,":[69],"governed":[70],"by":[71,184],"conservation":[72],"mass,":[74],"momentum,":[75],"energy.":[77],"The":[78,125,174],"assumption":[80],"treats":[81],"liquid":[82],"vapor":[84,117],"phases":[85],"as":[86,104],"uniform":[87],"mixtures,":[88],"enabling":[89],"use":[90],"common":[92],"variables\u2014temperature,":[93],"pressure,":[94],"velocity\u2014to":[96],"describe":[97],"flow.":[99],"Thermophysical":[100],"properties":[101],"expressed":[103],"functions":[105],"internal":[107,185],"pressure":[108],"temperature,":[110],"thereby":[111],"capturing":[112],"thermomechanical":[114,186],"cycles":[115],"compression":[118],"expansion":[120],"that":[121],"drive":[122],"OHP":[123],"operation.":[124],"applied":[128],"multiturn":[130],"subjected":[133],"varying":[135],"evaporator-to-condenser":[136],"temperature":[137],"differences.":[138],"Simulations":[139],"capture":[140],"three":[141],"regimes\u2014prestartup,":[143],"oscillation,":[144,219],"dryout\u2014and":[146],"reproduce":[147],"strong":[149],"dependence":[150],"performance":[153],"on":[154],"regime.":[155],"particular,":[157],"transfer":[159,230,242],"enhancement":[160],"observed":[162],"with":[163,170,227],"onset":[165],"oscillatory":[167],"flow,":[168],"consistent":[169],"prior":[171],"experimental":[172],"findings.":[173],"further":[176],"demonstrates":[177],"robustness":[178],"in":[179,250],"predicting":[180],"oscillations":[181],"driven":[182],"solely":[183],"instabilities,":[187],"without":[188],"requiring":[189],"gravity,":[190],"capillarity,":[191],"or":[192],"other":[193],"external":[194],"driving":[195],"forces.":[196],"Overall,":[197],"proposed":[199],"framework":[200],"provides":[201],"tool":[203],"understanding":[205],"coupled":[206],"thermal-fluid":[207],"interpreting":[213],"between":[216],"prestartup,":[218],"dryout":[221],"future,":[226],"calibrated":[228],"parameters":[231],"from":[232],"experiments,":[233],"may":[236],"be":[237],"extended":[238],"accurate":[240],"prediction":[243],"have":[247],"potential":[248],"applications":[249],"design":[251],"optimization.":[252]},"counts_by_year":[],"updated_date":"2026-07-30T17:31:21.811387","created_date":"2025-11-25T00:00:00"}