{"id":"https://openalex.org/W4415501596","doi":"https://doi.org/10.1007/s10854-025-16029-7","title":"Novel accelerated failure mode of eutectic SnBi Solder joints under simultaneous electromigration and temperature cycling test","display_name":"Novel accelerated failure mode of eutectic SnBi Solder joints under simultaneous electromigration and temperature cycling test","publication_year":2025,"publication_date":"2025-10-01","ids":{"openalex":"https://openalex.org/W4415501596","doi":"https://doi.org/10.1007/s10854-025-16029-7"},"language":"en","primary_location":{"id":"doi:10.1007/s10854-025-16029-7","doi":"https://doi.org/10.1007/s10854-025-16029-7","is_oa":true,"landing_page_url":"https://doi.org/10.1007/s10854-025-16029-7","pdf_url":"https://link.springer.com/content/pdf/10.1007/s10854-025-16029-7.pdf","source":{"id":"https://openalex.org/S189509794","display_name":"Journal of Materials Science Materials in Electronics","issn_l":"0957-4522","issn":["0957-4522","1573-482X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Materials Science: Materials in Electronics","raw_type":"journal-article"},"volume":null,"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"hybrid","oa_url":"https://link.springer.com/content/pdf/10.1007/s10854-025-16029-7.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101730065","display_name":"Zesheng Shen","orcid":"https://orcid.org/0000-0002-8751-106X","observed_orcids":["https://orcid.org/0000-0002-8751-106X"]},"institutions":[{"id":"https://openalex.org/I168719708","display_name":"City University of Hong Kong","ror":"https://ror.org/03q8dnn23","country_code":"HK","type":"education","lineage":["https://openalex.org/I168719708"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Zesheng Shen","raw_affiliation_strings":["Department of System Engineering, City University of Hong Kong, Kowloon, Hong Kong SAR, China"],"raw_orcid":"https://orcid.org/0000-0002-8751-106X","affiliations":[{"raw_affiliation_string":"Department of System Engineering, City University of Hong Kong, Kowloon, Hong Kong SAR, China","institution_ids":["https://openalex.org/I168719708"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5066742301","display_name":"Yuxuan An","orcid":"https://orcid.org/0009-0003-0300-1543","observed_orcids":["https://orcid.org/0009-0003-0300-1543","https://orcid.org/0009-0006-8074-9346"]},"institutions":[{"id":"https://openalex.org/I168719708","display_name":"City University of Hong Kong","ror":"https://ror.org/03q8dnn23","country_code":"HK","type":"education","lineage":["https://openalex.org/I168719708"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Yuxuan An","raw_affiliation_strings":["Department of Material Science and Engineering, City University of Hong Kong, Kowloon, Hong Kong SAR, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Material Science and Engineering, City University of Hong Kong, Kowloon, Hong Kong SAR, China","institution_ids":["https://openalex.org/I168719708"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5007064144","display_name":"Yifan Yao","orcid":"https://orcid.org/0000-0003-4960-7471","observed_orcids":["https://orcid.org/0000-0003-4960-7471","https://orcid.org/0000-0001-7510-7492"]},"institutions":[{"id":"https://openalex.org/I168719708","display_name":"City University of Hong Kong","ror":"https://ror.org/03q8dnn23","country_code":"HK","type":"education","lineage":["https://openalex.org/I168719708"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"Yifan Yao","raw_affiliation_strings":["Department of Material Science and Engineering, City University of Hong Kong, Kowloon, Hong Kong SAR, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Material Science and Engineering, City University of Hong Kong, Kowloon, Hong Kong SAR, China","institution_ids":["https://openalex.org/I168719708"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087683685","display_name":"Qinglei Sun","orcid":"https://orcid.org/0000-0002-3860-9749","observed_orcids":["https://orcid.org/0000-0002-3860-9749"]},"institutions":[{"id":"https://openalex.org/I168719708","display_name":"City University of Hong Kong","ror":"https://ror.org/03q8dnn23","country_code":"HK","type":"education","lineage":["https://openalex.org/I168719708"]},{"id":"https://openalex.org/I3124059619","display_name":"China University of Geosciences","ror":"https://ror.org/04gcegc37","country_code":"CN","type":"education","lineage":["https://openalex.org/I3124059619"]}],"countries":["CN","HK"],"is_corresponding":false,"raw_author_name":"Qinglei Sun","raw_affiliation_strings":["Department of Material Science and Engineering, City University of Hong Kong, Kowloon, Hong Kong SAR, China","Gemmological Institute, China University of Geosciences, Wuhan, China","Institute for Advanced Marine Research, China University of Geosciences, Guangzhou, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Material Science and Engineering, City University of Hong Kong, Kowloon, Hong Kong SAR, China","institution_ids":["https://openalex.org/I168719708"]},{"raw_affiliation_string":"Gemmological Institute, China University of Geosciences, Wuhan, China","institution_ids":["https://openalex.org/I3124059619"]},{"raw_affiliation_string":"Institute for Advanced Marine Research, China University of Geosciences, Guangzhou, China","institution_ids":["https://openalex.org/I3124059619"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061216998","display_name":"K. N. Tu","orcid":"https://orcid.org/0000-0002-7781-2707","observed_orcids":["https://orcid.org/0000-0002-7781-2707"]},"institutions":[{"id":"https://openalex.org/I168719708","display_name":"City University of Hong Kong","ror":"https://ror.org/03q8dnn23","country_code":"HK","type":"education","lineage":["https://openalex.org/I168719708"]}],"countries":["HK"],"is_corresponding":false,"raw_author_name":"King-Ning Tu","raw_affiliation_strings":["Department of Electrical Engineering, City University of Hong Kong, Kowloon, Hong Kong SAR, China","Department of Material Science and Engineering, City University of Hong Kong, Kowloon, Hong Kong SAR, China","Department of System Engineering, City University of Hong Kong, Kowloon, Hong Kong SAR, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, City University of Hong Kong, Kowloon, Hong Kong SAR, China","institution_ids":["https://openalex.org/I168719708"]},{"raw_affiliation_string":"Department of Material Science and Engineering, City University of Hong Kong, Kowloon, Hong Kong SAR, China","institution_ids":["https://openalex.org/I168719708"]},{"raw_affiliation_string":"Department of System Engineering, City University of Hong Kong, Kowloon, Hong Kong SAR, China","institution_ids":["https://openalex.org/I168719708"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5044270098","display_name":"Yingxia Liu","orcid":"https://orcid.org/0000-0003-0482-3904","observed_orcids":["https://orcid.org/0000-0003-0482-3904"]},"institutions":[{"id":"https://openalex.org/I168719708","display_name":"City University of Hong Kong","ror":"https://ror.org/03q8dnn23","country_code":"HK","type":"education","lineage":["https://openalex.org/I168719708"]}],"countries":["HK"],"is_corresponding":true,"raw_author_name":"Yingxia Liu","raw_affiliation_strings":["Department of System Engineering, City University of Hong Kong, Kowloon, Hong Kong SAR, China"],"raw_orcid":"https://orcid.org/0000-0003-0482-3904","affiliations":[{"raw_affiliation_string":"Department of System Engineering, City University of Hong Kong, Kowloon, Hong Kong SAR, China","institution_ids":["https://openalex.org/I168719708"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5044270098"],"corresponding_institution_ids":["https://openalex.org/I168719708"],"apc_list":{"value":3990,"currency":"USD","value_usd":3990},"apc_paid":{"value":3990,"currency":"USD","value_usd":3990},"fwci":0.6928,"has_fulltext":true,"cited_by_count":3,"citation_normalized_percentile":{"value":0.66984971,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":97},"biblio":{"volume":"36","issue":"30","first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10780","display_name":"Reliability and Maintenance Optimization","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2213","display_name":"Safety, Risk, Reliability and Quality"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/solder-joint-reliability","display_name":"solder joint reliability","score":0.9300000071525574},{"id":"https://openalex.org/keywords/electromigration","display_name":"electromigration","score":0.9240000247955322},{"id":"https://openalex.org/keywords/thermal-cycling","display_name":"thermal cycling","score":0.9760000109672546},{"id":"https://openalex.org/keywords/phase-separation","display_name":"phase separation","score":0.9010000228881836},{"id":"https://openalex.org/keywords/crack-propagation","display_name":"crack propagation","score":0.8600000143051147},{"id":"https://openalex.org/keywords/metal-fatigue","display_name":"metal fatigue","score":0.9010000228881836},{"id":"https://openalex.org/keywords/ball-grid-array-packaging","display_name":"ball grid array packaging","score":0.8389999866485596}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.9072999954223633},{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.8780999779701233},{"id":"https://openalex.org/C18168003","wikidata":"https://www.wikidata.org/wiki/Q628595","display_name":"Eutectic system","level":3,"score":0.8662999868392944},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.8615999817848206},{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.6833999752998352},{"id":"https://openalex.org/C66283442","wikidata":"https://www.wikidata.org/wiki/Q1389268","display_name":"Failure mode and effects analysis","level":2,"score":0.5993000268936157},{"id":"https://openalex.org/C136478896","wikidata":"https://www.wikidata.org/wiki/Q898288","display_name":"Brittleness","level":2,"score":0.5264999866485596},{"id":"https://openalex.org/C44280652","wikidata":"https://www.wikidata.org/wiki/Q104837","display_name":"Phase (matter)","level":2,"score":0.5188000202178955},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5078999996185303},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.503600001335144},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.4325000047683716},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.42719998955726624},{"id":"https://openalex.org/C89395315","wikidata":"https://www.wikidata.org/wiki/Q181232","display_name":"Anode","level":3,"score":0.376800000667572},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.31299999356269836},{"id":"https://openalex.org/C27501479","wikidata":"https://www.wikidata.org/wiki/Q428069","display_name":"Intermetallic","level":3,"score":0.28610000014305115},{"id":"https://openalex.org/C59085676","wikidata":"https://www.wikidata.org/wiki/Q957852","display_name":"Fracture mechanics","level":2,"score":0.2639000117778778},{"id":"https://openalex.org/C133074676","wikidata":"https://www.wikidata.org/wiki/Q428729","display_name":"Fusible alloy","level":2,"score":0.2621000111103058},{"id":"https://openalex.org/C2985278600","wikidata":"https://www.wikidata.org/wiki/Q65051469","display_name":"Fatigue testing","level":2,"score":0.25440001487731934}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1007/s10854-025-16029-7","doi":"https://doi.org/10.1007/s10854-025-16029-7","is_oa":true,"landing_page_url":"https://doi.org/10.1007/s10854-025-16029-7","pdf_url":"https://link.springer.com/content/pdf/10.1007/s10854-025-16029-7.pdf","source":{"id":"https://openalex.org/S189509794","display_name":"Journal of Materials Science Materials in Electronics","issn_l":"0957-4522","issn":["0957-4522","1573-482X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Materials Science: Materials in Electronics","raw_type":"journal-article"},{"id":"pmh:oai:pure.atira.dk:publications/ea055c2c-d220-453f-ac16-d2e2059cc11a","doi":null,"is_oa":true,"landing_page_url":"https://scholars.cityu.edu.hk/en/publications/ea055c2c-d220-453f-ac16-d2e2059cc11a","pdf_url":null,"source":{"id":"https://openalex.org/S7407055387","display_name":"CityU Scholars","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Shen, Z, An, Y, Yao, Y, Sun, Q, Tu, K-N & Liu, Y 2025, 'Novel accelerated failure mode of eutectic SnBi Solder joints under simultaneous electromigration and temperature cycling test', Journal of Materials Science: Materials in Electronics, vol. 36, no. 30, 1924. https://doi.org/10.1007/s10854-025-16029-7","raw_type":"info:eu-repo/semantics/article"}],"best_oa_location":{"id":"doi:10.1007/s10854-025-16029-7","doi":"https://doi.org/10.1007/s10854-025-16029-7","is_oa":true,"landing_page_url":"https://doi.org/10.1007/s10854-025-16029-7","pdf_url":"https://link.springer.com/content/pdf/10.1007/s10854-025-16029-7.pdf","source":{"id":"https://openalex.org/S189509794","display_name":"Journal of Materials Science Materials in Electronics","issn_l":"0957-4522","issn":["0957-4522","1573-482X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310319900","host_organization_name":"Springer Science+Business Media","host_organization_lineage":["https://openalex.org/P4310319900","https://openalex.org/P4310319965"],"host_organization_lineage_names":["Springer Science+Business Media","Springer Nature"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Materials Science: Materials in Electronics","raw_type":"journal-article"},"sustainable_development_goals":[],"sustainable_development_goals_aurora":[],"study_designs":[],"awards":[{"id":"https://openalex.org/G5452011354","display_name":null,"funder_award_id":"9610566","funder_id":"https://openalex.org/F4320309893","funder_display_name":"City University of Hong Kong"},{"id":"https://openalex.org/G858451075","display_name":null,"funder_award_id":"52302032","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320309893","display_name":"City University of Hong Kong","ror":"https://ror.org/03q8dnn23"},{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4415501596.pdf","grobid_xml":"https://content.openalex.org/works/W4415501596.grobid-xml"},"referenced_works_count":28,"referenced_works":["https://openalex.org/W613046728","https://openalex.org/W961066958","https://openalex.org/W1528217121","https://openalex.org/W1965008260","https://openalex.org/W2025224226","https://openalex.org/W2040276483","https://openalex.org/W2054614211","https://openalex.org/W2065624114","https://openalex.org/W2104900200","https://openalex.org/W2107723531","https://openalex.org/W2395743341","https://openalex.org/W2504702943","https://openalex.org/W2897604751","https://openalex.org/W2898306026","https://openalex.org/W2915914877","https://openalex.org/W2947233477","https://openalex.org/W3047755488","https://openalex.org/W3047816976","https://openalex.org/W3096570714","https://openalex.org/W3135013873","https://openalex.org/W3162823098","https://openalex.org/W3198008533","https://openalex.org/W4281771247","https://openalex.org/W4284967180","https://openalex.org/W4297808558","https://openalex.org/W4308462698","https://openalex.org/W4323567825","https://openalex.org/W4399859759"],"related_works":[],"abstract_inverted_index":{"Abstract":[0],"We":[1],"studied":[2],"the":[3,19,33,37,53,57,64,75,92,110,118,127,144,149,159,186],"reliability":[4,160],"of":[5,22,56,63,78,113,161],"eutectic":[6,166],"SnBi":[7,99,167],"solder":[8,58,65,79,100],"joints":[9,66,80],"and":[10,27,42,95,130,182],"discovered":[11],"a":[12,43],"new":[13],"failure":[14,45,97,119],"mode":[15],"that":[16],"resulted":[17],"from":[18],"synergistic":[20],"effect":[21],"simultaneously":[23],"conducted":[24],"electromigration":[25],"(EM)":[26],"temperature":[28,183],"cycling":[29],"(TC)":[30],"tests.":[31,107],"After":[32],"test,":[34],"we":[35,115],"observed":[36],"EM":[38,68,86,104,121],"induced":[39,46,122,151],"phase":[40,55,123,146],"separation":[41],"crack-type":[44],"by":[47,140,148,152],"TC":[48,70,88,106],"stress":[49,150],"which":[50,125],"propagates":[51],"through":[52,179],"Bi-rich":[54,145],"joint.":[59],"The":[60,85],"experimental":[61,76],"result":[62,77],"under":[67,81,169],"+":[69,87],"condition":[71,89],"is":[72,137],"compared":[73,101],"with":[74],"individual":[82],"EM/TC":[83],"conditions.":[84],"results":[90],"in":[91,98,143],"most":[93],"severe":[94],"fast":[96],"to":[102,109,120,177],"only":[103],"or":[105],"Due":[108],"inherent":[111],"brittleness":[112],"Bi,":[114],"could":[116],"attribute":[117],"separation,":[124],"embrittles":[126],"anode":[128],"side":[129],"accelerates":[131],"crack":[132,135],"propagation.":[133],"This":[134],"propagation":[136],"further":[138],"exacerbated":[139],"metal":[141],"fatigue":[142],"caused":[147],"TC.":[153],"Our":[154],"research":[155],"provides":[156],"insights":[157],"into":[158],"advanced":[162],"packaging":[163],"structures":[164,174],"using":[165],"ball-grid-array":[168],"real":[170],"application":[171],"scenarios":[172],"when":[173],"will":[175],"have":[176],"go":[178],"current":[180],"stressing":[181],"variation":[184],"at":[185],"same":[187],"time.":[188]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":1}],"updated_date":"2026-09-24T07:57:37.273135","created_date":"2025-10-24T00:00:00"}