{"id":"https://openalex.org/W4415323638","doi":"https://doi.org/10.31044/1684-2499-2020-0-2-19-23","title":"Influence investigation of chemical composition of aluminum alloys on adhesion strength of soldered titanium structures","display_name":"Influence investigation of chemical composition of aluminum alloys on adhesion strength of soldered titanium structures","publication_year":2020,"publication_date":"2020-01-01","ids":{"openalex":"https://openalex.org/W4415323638","doi":"https://doi.org/10.31044/1684-2499-2020-0-2-19-23"},"language":"en","primary_location":{"id":"doi:10.31044/1684-2499-2020-0-2-19-23","doi":"https://doi.org/10.31044/1684-2499-2020-0-2-19-23","is_oa":false,"landing_page_url":"https://doi.org/10.31044/1684-2499-2020-0-2-19-23","pdf_url":null,"source":{"id":"https://openalex.org/S4210177702","display_name":"Technology of metals","issn_l":"1684-2499","issn":["1684-2499"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["russia-white-list-2"],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Technology of Metals","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5054302367","display_name":"\u0410. \u0418. \u041a\u043e\u0432\u0442\u0443\u043d\u043e\u0432","orcid":"https://orcid.org/0000-0002-7705-7377","observed_orcids":["https://orcid.org/0000-0002-7705-7377"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"A.I. Kovtunov","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021275680","display_name":"\u0422. V. Semistenova","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"T.V. Semistenova","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5014865643","display_name":"S. V. Myamin","orcid":"https://orcid.org/0000-0001-6897-4109","observed_orcids":["https://orcid.org/0000-0001-6897-4109"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"S.V. Myamin","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"last","author":{"id":"https://openalex.org/A5061700203","display_name":"Yu. Yu. Khokhlov","orcid":"https://orcid.org/0000-0002-5276-8957","observed_orcids":["https://orcid.org/0000-0002-5276-8957"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Yu.Yu. Khokhlov","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0861,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.36340878,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":"0","issue":"2","first_page":"19","last_page":"23"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.7627000212669373,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.7627000212669373,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10723","display_name":"Advanced Welding Techniques Analysis","score":0.15729999542236328,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.03150000050663948,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/al-si-alloys","display_name":"Al-Si alloys","score":0.7149999737739563},{"id":"https://openalex.org/keywords/titanium","display_name":"titanium","score":0.746999979019165},{"id":"https://openalex.org/keywords/solder-joints","display_name":"solder joints","score":0.8610000014305115},{"id":"https://openalex.org/keywords/adhesion-strength","display_name":"adhesion strength","score":0.699999988079071},{"id":"https://openalex.org/keywords/wettability","display_name":"wettability","score":0.8100000023841858},{"id":"https://openalex.org/keywords/spreading","display_name":"spreading","score":0.8820000290870667},{"id":"https://openalex.org/keywords/flux-composition","display_name":"flux composition","score":0.9100000262260437},{"id":"https://openalex.org/keywords/transition-layer","display_name":"transition layer","score":0.8050000071525574},{"id":"https://openalex.org/keywords/chemical-composition","display_name":"chemical composition","score":0.5329999923706055}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8100000023841858},{"id":"https://openalex.org/C506065880","wikidata":"https://www.wikidata.org/wiki/Q716","display_name":"Titanium","level":2,"score":0.7573999762535095},{"id":"https://openalex.org/C149849071","wikidata":"https://www.wikidata.org/wiki/Q1263816","display_name":"Chemical composition","level":2,"score":0.6559000015258789},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.6470999717712402},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.6448000073432922},{"id":"https://openalex.org/C513153333","wikidata":"https://www.wikidata.org/wiki/Q663","display_name":"Aluminium","level":2,"score":0.6410999894142151},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5372999906539917},{"id":"https://openalex.org/C84416704","wikidata":"https://www.wikidata.org/wiki/Q188666","display_name":"Adhesion","level":2,"score":0.49959999322891235},{"id":"https://openalex.org/C134514944","wikidata":"https://www.wikidata.org/wiki/Q817136","display_name":"Wetting","level":2,"score":0.47450000047683716},{"id":"https://openalex.org/C18555067","wikidata":"https://www.wikidata.org/wiki/Q8375051","display_name":"Joint (building)","level":2,"score":0.4722000062465668},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.46140000224113464},{"id":"https://openalex.org/C8953137","wikidata":"https://www.wikidata.org/wiki/Q3300719","display_name":"Titanium alloy","level":3,"score":0.4528999924659729},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.4300999939441681},{"id":"https://openalex.org/C86171150","wikidata":"https://www.wikidata.org/wiki/Q13389141","display_name":"Brazing","level":3,"score":0.3878999948501587},{"id":"https://openalex.org/C2781213431","wikidata":"https://www.wikidata.org/wiki/Q419673","display_name":"Titanium hydride","level":3,"score":0.37369999289512634},{"id":"https://openalex.org/C68709404","wikidata":"https://www.wikidata.org/wiki/Q1134475","display_name":"Flux (metallurgy)","level":2,"score":0.3021000027656555},{"id":"https://openalex.org/C57863236","wikidata":"https://www.wikidata.org/wiki/Q1130571","display_name":"Doping","level":2,"score":0.29589998722076416},{"id":"https://openalex.org/C140009343","wikidata":"https://www.wikidata.org/wiki/Q4734460","display_name":"Alonizing","level":3,"score":0.287200003862381},{"id":"https://openalex.org/C2988076202","wikidata":"https://www.wikidata.org/wiki/Q240553","display_name":"Mechanical strength","level":2,"score":0.28540000319480896},{"id":"https://openalex.org/C149912024","wikidata":"https://www.wikidata.org/wiki/Q462188","display_name":"Creep","level":2,"score":0.2802000045776367},{"id":"https://openalex.org/C138999460","wikidata":"https://www.wikidata.org/wiki/Q787619","display_name":"Solid solution","level":2,"score":0.27489998936653137},{"id":"https://openalex.org/C2776631189","wikidata":"https://www.wikidata.org/wiki/Q1128169","display_name":"Metallography","level":3,"score":0.2734000086784363},{"id":"https://openalex.org/C2993308298","wikidata":"https://www.wikidata.org/wiki/Q7834414","display_name":"Transition layer","level":3,"score":0.26339998841285706},{"id":"https://openalex.org/C27501479","wikidata":"https://www.wikidata.org/wiki/Q428069","display_name":"Intermetallic","level":3,"score":0.2632000148296356},{"id":"https://openalex.org/C544153396","wikidata":"https://www.wikidata.org/wiki/Q11426","display_name":"Metal","level":2,"score":0.2558000087738037},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.25189998745918274}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.31044/1684-2499-2020-0-2-19-23","doi":"https://doi.org/10.31044/1684-2499-2020-0-2-19-23","is_oa":false,"landing_page_url":"https://doi.org/10.31044/1684-2499-2020-0-2-19-23","pdf_url":null,"source":{"id":"https://openalex.org/S4210177702","display_name":"Technology of metals","issn_l":"1684-2499","issn":["1684-2499"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["russia-white-list-2"],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Technology of Metals","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W4392313462","https://openalex.org/W2347069931","https://openalex.org/W2289838271","https://openalex.org/W2041235814","https://openalex.org/W4235819595","https://openalex.org/W800785313","https://openalex.org/W2529304614","https://openalex.org/W1968374026","https://openalex.org/W4406709711","https://openalex.org/W4404437867"],"abstract_inverted_index":{"Studies":[0],"of":[1,7,16,19,29,37,44,52],"the":[2,17,35,39,42,45,49,53],"wetting":[3],"and":[4,34,48],"spreading":[5],"processes":[6],"aluminum":[8],"doped":[9],"with":[10],"silicon":[11],"on":[12,41],"titanium":[13,21],"under":[14],"conditions":[15],"formation":[18],"soldered":[20,46],"joints":[22],"have":[23],"been":[24],"carried":[25],"out.":[26],"The":[27],"effect":[28],"flux":[30],"composition,":[31],"melt":[32],"temperature":[33],"degree":[36],"alloying":[38],"solder":[40],"strength":[43],"joint":[47],"chemical":[50],"composition":[51],"transition":[54],"layer":[55],"was":[56],"established.":[57]},"counts_by_year":[{"year":2023,"cited_by_count":1}],"updated_date":"2026-10-28T10:33:24.094632","created_date":"2025-10-19T00:00:00"}