{"id":"https://openalex.org/W4411688564","doi":"https://doi.org/10.1109/ectc51687.2025.00346","title":"Characterization of FOWLP Process Using Temporary Bonding Materials on Carrier with Very Low Die Shift","display_name":"Characterization of FOWLP Process Using Temporary Bonding Materials on Carrier with Very Low Die Shift","publication_year":2025,"publication_date":"2025-05-27","ids":{"openalex":"https://openalex.org/W4411688564","doi":"https://doi.org/10.1109/ectc51687.2025.00346"},"language":"en","primary_location":{"id":"doi:10.1109/ectc51687.2025.00346","doi":"https://doi.org/10.1109/ectc51687.2025.00346","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ectc51687.2025.00346","pdf_url":null,"source":{"id":"https://openalex.org/S4363608088","display_name":"IEEE Electronic Components and Technology Conference (ECTC)","issn_l":"2766-8401","issn":["2766-8401"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE 75th Electronic Components and Technology Conference (ECTC)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Tiffany Tang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Tiffany Tang","raw_affiliation_strings":["imec,Leuven,Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"imec,Leuven,Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5019420703","display_name":"Alice Guerrero","orcid":"https://orcid.org/0009-0000-2177-8581","observed_orcids":["https://orcid.org/0009-0000-2177-8581"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Alice Guerrero","raw_affiliation_strings":["Brewer Science,Leuven,Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Brewer Science,Leuven,Belgium","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012023402","display_name":"Dieter Cuypers","orcid":"https://orcid.org/0000-0003-0550-6273","observed_orcids":["https://orcid.org/0000-0003-0550-6273"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Dieter Cuypers","raw_affiliation_strings":["imec,Leuven,Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"imec,Leuven,Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5118648717","display_name":"Maarten Macours","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Maarten Macours","raw_affiliation_strings":["imec,Leuven,Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"imec,Leuven,Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5099516367","display_name":"Aldrin Vaquilar","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Aldrin Vaquilar","raw_affiliation_strings":["imec,Leuven,Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"imec,Leuven,Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5069840941","display_name":"Pieter Bex","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Pieter Bex","raw_affiliation_strings":["imec,Leuven,Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"imec,Leuven,Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5076569297","display_name":"Koen Kennes","orcid":"https://orcid.org/0000-0002-5987-2167","observed_orcids":["https://orcid.org/0000-0002-5987-2167"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Koen Kennes","raw_affiliation_strings":["imec,Leuven,Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"imec,Leuven,Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031627498","display_name":"Alain Phommahaxay","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Alain Phommahaxay","raw_affiliation_strings":["imec,Leuven,Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"imec,Leuven,Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112402799","display_name":"Gerald Beyer","orcid":"https://orcid.org/0009-0009-6367-3046","observed_orcids":["https://orcid.org/0009-0009-6367-3046"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Gerald Beyer","raw_affiliation_strings":["imec,Leuven,Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"imec,Leuven,Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5051712390","display_name":"Eric Beyne","orcid":"https://orcid.org/0000-0002-3096-050X","observed_orcids":["https://orcid.org/0000-0002-3096-050X"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Eric Beyne","raw_affiliation_strings":["imec,Leuven,Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"imec,Leuven,Belgium","institution_ids":["https://openalex.org/I4210114974"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":5.1768,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.9440617,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"2022","last_page":"2027"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.6352999806404114,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.6352999806404114,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.3594000041484833,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.0003000000142492354,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/epoxy-mold-compound","display_name":"epoxy mold compound","score":0.9340000152587891},{"id":"https://openalex.org/keywords/warpage","display_name":"warpage","score":0.7760000228881836},{"id":"https://openalex.org/keywords/die-shift","display_name":"die shift","score":0.9210000038146973},{"id":"https://openalex.org/keywords/coefficient-of-thermal-expansion","display_name":"coefficient of thermal expansion","score":0.8510000109672546},{"id":"https://openalex.org/keywords/glass-transition-temperature","display_name":"glass transition temperature","score":0.9869999885559082},{"id":"https://openalex.org/keywords/modulus","display_name":"modulus","score":0.6060000061988831},{"id":"https://openalex.org/keywords/thermal-stress","display_name":"thermal stress","score":0.8510000109672546},{"id":"https://openalex.org/keywords/silicon-mold","display_name":"silicon mold","score":0.3370000123977661},{"id":"https://openalex.org/keywords/redistribution-layer","display_name":"redistribution layer","score":0.3700000047683716}],"concepts":[{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.5785646438598633},{"id":"https://openalex.org/C2780841128","wikidata":"https://www.wikidata.org/wiki/Q5073781","display_name":"Characterization (materials science)","level":2,"score":0.5533702373504639},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.535280168056488},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5103215575218201},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3203880190849304},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.1651218831539154},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.08552542328834534}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ectc51687.2025.00346","doi":"https://doi.org/10.1109/ectc51687.2025.00346","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ectc51687.2025.00346","pdf_url":null,"source":{"id":"https://openalex.org/S4363608088","display_name":"IEEE Electronic Components and Technology Conference (ECTC)","issn_l":"2766-8401","issn":["2766-8401"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE 75th Electronic Components and Technology Conference (ECTC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W2743599321","https://openalex.org/W2887528186","https://openalex.org/W2902304258","https://openalex.org/W2904030320","https://openalex.org/W3088640313"],"related_works":["https://openalex.org/W4367623876","https://openalex.org/W4213438078","https://openalex.org/W4416882576","https://openalex.org/W2970313596","https://openalex.org/W1989108175","https://openalex.org/W2807140458","https://openalex.org/W4394596780","https://openalex.org/W3000709813","https://openalex.org/W2137194704","https://openalex.org/W3013789247"],"abstract_inverted_index":{"This":[0],"study":[1],"aims":[2],"to":[3,12,64,68,90,97],"link":[4],"several":[5],"epoxy":[6],"mold":[7,74],"compound":[8],"(EMC)":[9],"material":[10,57],"properties":[11],"warpage":[13,47,71],"and":[14,40,44,48,62],"die-shift":[15,49],"that":[16,94],"are":[17,42,80],"typically":[18],"present":[19],"in":[20,88],"a":[21,52,85],"fanout":[22],"wafer":[23],"level":[24],"packaging":[25],"process":[26,31],"flow":[27],"with":[28,36],"RDL":[29],"last":[30],"conditions.":[32],"Two":[33],"EMC":[34],"compounds":[35],"different":[37],"CTE,":[38],"Tg,":[39],"modulus":[41,83],"evaluated":[43],"compared":[45],"for":[46],"performance":[50],"on":[51,72,75],"next":[53],"generation":[54],"temporary":[55],"bonding":[56],"(TBM).":[58],"A":[59],"low":[60,70],"CTE":[61,100],"high$\\text{T}_{\\mathrm{g}}$seem":[63],"be":[65],"very":[66],"beneficial":[67],"achieve":[69],"blanket":[73],"TBM":[76],"wafers.":[77],"When":[78],"dies":[79],"embedded,":[81],"the":[82,98],"plays":[84],"major":[86],"role":[87],"order":[89],"mitigate":[91],"thermal":[92],"stresses":[93],"occur":[95],"due":[96],"Si-mold":[99],"mismatch":[101],"during":[102],"molding.":[103]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":1}],"updated_date":"2026-10-26T11:51:55.731654","created_date":"2025-10-10T00:00:00"}