{"id":"https://openalex.org/W4406972172","doi":"https://doi.org/10.4071/001c.128331","title":"Application of Picosecond Acoustic Metrology for monitoring Metal Films in Advanced Packaging","display_name":"Application of Picosecond Acoustic Metrology for monitoring Metal Films in Advanced Packaging","publication_year":2025,"publication_date":"2025-01-14","ids":{"openalex":"https://openalex.org/W4406972172","doi":"https://doi.org/10.4071/001c.128331"},"language":"en","primary_location":{"id":"doi:10.4071/001c.128331","doi":"https://doi.org/10.4071/001c.128331","is_oa":true,"landing_page_url":"https://doi.org/10.4071/001c.128331","pdf_url":"https://imapsource.org/article/128331.pdf","source":{"id":"https://openalex.org/S4210197219","display_name":"IMAPSource Proceedings","issn_l":"2380-4505","issn":["2380-4505"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IMAPSource Proceedings","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://imapsource.org/article/128331.pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5109471722","display_name":"Manjusha Mehendale","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210138502","display_name":"Onto Innovation (United States)","ror":"https://ror.org/0317a1b85","country_code":"US","type":"company","lineage":["https://openalex.org/I4210138502"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Mehendale","raw_affiliation_strings":["Onto Innovation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Onto Innovation","institution_ids":["https://openalex.org/I4210138502"]}]},{"author_position":"middle","author":{"id":null,"display_name":"K. Park","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210138502","display_name":"Onto Innovation (United States)","ror":"https://ror.org/0317a1b85","country_code":"US","type":"company","lineage":["https://openalex.org/I4210138502"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"K. Park","raw_affiliation_strings":["Onto Innovation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Onto Innovation","institution_ids":["https://openalex.org/I4210138502"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037399259","display_name":"Yingbing Han","orcid":"https://orcid.org/0009-0000-7049-3312","observed_orcids":["https://orcid.org/0009-0000-7049-3312"]},"institutions":[{"id":"https://openalex.org/I4210138502","display_name":"Onto Innovation (United States)","ror":"https://ror.org/0317a1b85","country_code":"US","type":"company","lineage":["https://openalex.org/I4210138502"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Y. T. Han","raw_affiliation_strings":["Onto Innovation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Onto Innovation","institution_ids":["https://openalex.org/I4210138502"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021013323","display_name":"Jisen Dai","orcid":"https://orcid.org/0000-0002-1065-2219","observed_orcids":["https://orcid.org/0000-0002-1065-2219"]},"institutions":[{"id":"https://openalex.org/I4210138502","display_name":"Onto Innovation (United States)","ror":"https://ror.org/0317a1b85","country_code":"US","type":"company","lineage":["https://openalex.org/I4210138502"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Dai","raw_affiliation_strings":["Onto Innovation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Onto Innovation","institution_ids":["https://openalex.org/I4210138502"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006731222","display_name":"C. Kim","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210138502","display_name":"Onto Innovation (United States)","ror":"https://ror.org/0317a1b85","country_code":"US","type":"company","lineage":["https://openalex.org/I4210138502"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"C. Kim","raw_affiliation_strings":["Onto Innovation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Onto Innovation","institution_ids":["https://openalex.org/I4210138502"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045344070","display_name":"G. A. Antonelli","orcid":"https://orcid.org/0000-0002-8536-2750","observed_orcids":["https://orcid.org/0000-0002-8536-2750"]},"institutions":[{"id":"https://openalex.org/I4210138502","display_name":"Onto Innovation (United States)","ror":"https://ror.org/0317a1b85","country_code":"US","type":"company","lineage":["https://openalex.org/I4210138502"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"G. A. Antonelli","raw_affiliation_strings":["Onto Innovation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Onto Innovation","institution_ids":["https://openalex.org/I4210138502"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5017653396","display_name":"Priya Mukundhan","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210138502","display_name":"Onto Innovation (United States)","ror":"https://ror.org/0317a1b85","country_code":"US","type":"company","lineage":["https://openalex.org/I4210138502"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"P. Mukundhan","raw_affiliation_strings":["Onto Innovation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Onto Innovation","institution_ids":["https://openalex.org/I4210138502"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210138502"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":true,"cited_by_count":0,"citation_normalized_percentile":{"value":0.006827,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"2024","issue":"DPC","first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9307000041007996,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9307000041007996,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.016300000250339508,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10662","display_name":"Ultrasonics and Acoustic Wave Propagation","score":0.013199999928474426,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/high-bandwidth-memory","display_name":"high-bandwidth memory","score":0.7450000047683716},{"id":"https://openalex.org/keywords/fan-out-wafer-level-packaging","display_name":"fan-out wafer-level packaging","score":0.9340000152587891},{"id":"https://openalex.org/keywords/through-silicon-vias","display_name":"through-silicon vias","score":0.968999981880188},{"id":"https://openalex.org/keywords/in-line-process-control","display_name":"in-line process control","score":0.8059999942779541},{"id":"https://openalex.org/keywords/3d-stacking","display_name":"3D stacking","score":0.5049999952316284},{"id":"https://openalex.org/keywords/dram","display_name":"DRAM","score":0.34700000286102295}],"concepts":[{"id":"https://openalex.org/C195766429","wikidata":"https://www.wikidata.org/wiki/Q394","display_name":"Metrology","level":2,"score":0.784250020980835},{"id":"https://openalex.org/C55005982","wikidata":"https://www.wikidata.org/wiki/Q3902709","display_name":"Picosecond","level":3,"score":0.5897008776664734},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4858941435813904},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.35811954736709595},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.35285288095474243},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.21863403916358948},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.10624966025352478},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.4071/001c.128331","doi":"https://doi.org/10.4071/001c.128331","is_oa":true,"landing_page_url":"https://doi.org/10.4071/001c.128331","pdf_url":"https://imapsource.org/article/128331.pdf","source":{"id":"https://openalex.org/S4210197219","display_name":"IMAPSource Proceedings","issn_l":"2380-4505","issn":["2380-4505"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IMAPSource Proceedings","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.4071/001c.128331","doi":"https://doi.org/10.4071/001c.128331","is_oa":true,"landing_page_url":"https://doi.org/10.4071/001c.128331","pdf_url":"https://imapsource.org/article/128331.pdf","source":{"id":"https://openalex.org/S4210197219","display_name":"IMAPSource Proceedings","issn_l":"2380-4505","issn":["2380-4505"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IMAPSource Proceedings","raw_type":"journal-article"},"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4406972172.pdf","grobid_xml":"https://content.openalex.org/works/W4406972172.grobid-xml"},"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W7163140273","https://openalex.org/W2967566955","https://openalex.org/W4416884307","https://openalex.org/W2903710015","https://openalex.org/W1528898571","https://openalex.org/W2504200675","https://openalex.org/W2995435612","https://openalex.org/W2805143360","https://openalex.org/W2040644039","https://openalex.org/W2510586240"],"abstract_inverted_index":{"High-performance":[0],"computing":[1],"applications":[2],"such":[3,30,166],"as":[4,150,167,217,224],"artificial":[5],"intelligence,":[6],"and":[7,38,60,79,99,116,138,143,155,193,255,333,337,343,419],"machine":[8],"learning":[9],"require":[10],"massive":[11],"amount":[12],"of":[13,34,87,107,181,183,227,260,349,424],"parallel":[14],"processing":[15],"requiring":[16],"significant":[17],"memory":[18,22],"bandwidth.":[19],"High":[20],"bandwidth":[21],"(HBM)":[23],"solutions":[24,53],"have":[25,104],"been":[26],"optimized":[27],"to":[28,54,61,83,171,176,200],"enable":[29],"applications.":[31,90],"HBM":[32,119,261],"consists":[33],"core":[35],"DRAM":[36],"die":[37,42],"a":[39,44,72,130,187,225],"logic":[40],"buffer":[41],"in":[43,110,117,133,190,206],"vertically":[45],"stacked":[46],"3D":[47,344,427],"structure.":[48],"Customers":[49],"are":[50,136],"adopting":[51],"front-end":[52],"meet":[55,62,84],"the":[56,63,85,108,118,123,159,177,184,207,218,228,350],"shrinking":[57],"process":[58,120,161,196,209],"tolerances":[59],"stringent":[64],"reliability":[65,191],"requirements.":[66],"[1]":[67],"Picosecond":[68],"acoustic":[69],"metrology":[70],"is":[71,148,169,215],"well-established":[73],"technique":[74],"for":[75,174,304,341,407],"in-line":[76,195],"measurements":[77],"[2-3]":[78],"can":[80],"be":[81],"applied":[82],"challenges":[86],"advanced":[88],"packaging":[89,114],"In":[91,122,158,347,426],"this":[92],"paper,":[93],"we":[94],"shall":[95],"present":[96],"system-level":[97],"improvements":[98],"specific":[100],"use":[101],"cases":[102],"that":[103],"accelerated":[105],"adoption":[106],"technology":[109],"fan-out":[111],"wafer":[112],"level":[113],"(FOWLP)":[115],"loop.":[121],"FOWLP":[124],"process,":[125],"re-distribution":[126],"lines":[127],"(RDL)":[128],"play":[129],"critical":[131,188,216],"role":[132,189],"how":[134],"I/Os":[135],"connected":[137],"measuring":[139],"RDL":[140,306],"thickness":[141,180,202,214,231],"before":[142],"after":[144],"copper":[145,212,229],"seed":[146,230],"etch":[147],"necessary":[149],"it":[151],"impacts":[152],"line":[153],"resistance":[154],"leakage":[156],"current.":[157],"TSV":[160],"loop,":[162],"multi-layer":[163],"metal":[164],"stack":[165],"gold/nickel/copper":[168],"used":[170],"form":[172],"pads":[173],"bonding":[175],"micropillar.":[178],"The":[179],"each":[182],"layers":[185],"plays":[186],"performance":[192],"hence":[194],"control":[197],"requires":[198],"layer":[199,201],"monitoring":[203],"is.":[204],"Similarly,":[205],"microbump":[208],"flow,":[210],"controlling":[211],"seed/barrier":[213],"relative":[219],"bump":[220,234],"heights":[221],"will":[222],"vary":[223],"function":[226],"variation":[232],"impacting":[233],"co-planarity":[235],"[4-5].":[236],"References":[237],"1.":[238],"S.":[239,241,256],"Ha,":[240],"Lee,":[242,246,252],"GH.":[243],"Bae,":[244],"DS.":[245],"S.H.":[247],"Kim,":[248,300],"BW.":[249],"Woo,":[250],"N-H":[251],"YS.":[253],"Lee":[254],"Pae,":[257],"\u201cReliability":[258],"Characterization":[259],"featuring":[262],"HK+MG":[263],"Logic":[264],"Chip":[265],"with":[266],"Multi-stacked":[267],"DRAMs,\u201d":[268],"2023":[269,277],"IEEE":[270],"International":[271],"Reliability":[272],"Physics":[273],"Symposium":[274],"(IRPS),":[275],"May":[276],"2.":[278],"J.":[279,281,287,297,358],"Dai.,":[280],"Chen,":[282,322,416,421],"M.":[283,285],"Mehendale,":[284],"Alves,":[286],"Ding,":[288,328],"F.":[289],"Shen,":[290,298,326],"R.":[291],"Mair,":[292],"A.":[293],"Hegde,":[294],"P.":[295],"Mukundhan,":[296,332],"C.":[299,415],"\u201cComprehensive":[301],"In-line":[302],"Metrology":[303,339],"Advanced":[305,345],"Process":[307,406],"Monitoring\u201d,":[308],"IMAPS":[309,351],"2017":[310],"3.":[311],"Parker":[312],"Huang,":[313],"Bruce":[314],"Chiu,":[315],"Jay":[316,323],"Chao,":[317],"Chun":[318],"Hung":[319],"Lu,":[320],"Stephen":[321],"Chen":[324],"Fei":[325],"Jian":[327],"Johnny":[329],"Dai,":[330],"Priya":[331],"Timothy":[334],"Kryman.,":[335],"Optical":[336],"Acoustic":[338],"Techniques":[340],"2.5D":[342],"Packaging,":[346,353],"Proceeding":[348],"Device":[352],"San":[354],"Diego,":[355],"2014.":[356],"4.":[357],"Derakhshandeh,":[359],"Inge":[360],"De":[361],"Preter,":[362],"Carine":[363],"Gerets,":[364],"Lin":[365],"Tong":[366],"Hou,":[367],"N.":[368],"Heylen,":[369],"Eric":[370],"Beyne,":[371],"Gerald":[372],"Beyer,":[373],"John":[374],"Slabbekoorn,":[375],"Vikas":[376],"Dubey,":[377],"Anne":[378],"Jourdain,":[379],"Goedele":[380],"Potoms,":[381],"Fumihiro":[382],"Inoue,":[383],"Geraldine":[384],"Jamieson,":[385],"Kevin":[386],"Vandersmissen,":[387],"Samuel":[388],"Suhard,":[389],"Tomas":[390],"Webers,":[391],"Giovanni":[392],"Capuz,":[393],"Teng":[394],"Yue":[395],"Wang,":[396],"Kenneth":[397],"June":[398],"Rebibis,":[399],"Andy":[400],"Miller,":[401],"\u201c3D":[402],"Stacking":[403],"Using":[404],"Bump-Less":[405],"Sub":[408],"10\u00b5m":[409],"Pitch":[410],"Interconnects,\u201d":[411],"ECTC":[412],"2016":[413],"5.":[414],"D.":[417],"Yu,":[418],"K.":[420],"\u201cVertical":[422],"Interconnects":[423],"Microbumps":[425],"Integration,\u201d":[428],"MRS":[429],"Bulletin,":[430],"Vol.":[431],"40,":[432],"March":[433],"2015,":[434],"257-262":[435]},"counts_by_year":[],"updated_date":"2026-09-27T08:07:27.782135","created_date":"2025-01-30T00:00:00"}