{"id":"https://openalex.org/W4401124271","doi":"https://doi.org/10.1002/sdtp.17536","title":"29\u20104: TOF SIMS for OLED Film 3D Detection and Real\u2010Time Failure Analysis","display_name":"29\u20104: TOF SIMS for OLED Film 3D Detection and Real\u2010Time Failure Analysis","publication_year":2024,"publication_date":"2024-06-01","ids":{"openalex":"https://openalex.org/W4401124271","doi":"https://doi.org/10.1002/sdtp.17536"},"language":"en","primary_location":{"id":"doi:10.1002/sdtp.17536","doi":"https://doi.org/10.1002/sdtp.17536","is_oa":false,"landing_page_url":"https://doi.org/10.1002/sdtp.17536","pdf_url":null,"source":{"id":"https://openalex.org/S4210171700","display_name":"SID Symposium Digest of Technical Papers","issn_l":"0097-966X","issn":["0097-966X","2154-6738","2154-6746","2168-0159"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core"],"host_organization":"https://openalex.org/P4310320595","host_organization_name":"Wiley","host_organization_lineage":["https://openalex.org/P4310320595"],"host_organization_lineage_names":["Wiley"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SID Symposium Digest of Technical Papers","raw_type":"journal-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5114199763","display_name":"Kening Zheng","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210100976","display_name":"BOE Technology Group (China)","ror":"https://ror.org/01cwwvj38","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210100976"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Kening Zheng","raw_affiliation_strings":["Chengdu BOE Optoelectroncs Technology Co., Ltd.  Chengdu China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chengdu BOE Optoelectroncs Technology Co., Ltd.  Chengdu China","institution_ids":["https://openalex.org/I4210100976"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100612034","display_name":"Qiang Fu","orcid":"https://orcid.org/0000-0002-5191-3315","observed_orcids":["https://orcid.org/0000-0002-5191-3315","https://orcid.org/0000-0001-5316-6758","https://orcid.org/0000-0003-3015-9330","https://orcid.org/0000-0002-8672-4055"]},"institutions":[{"id":"https://openalex.org/I4210100976","display_name":"BOE Technology Group (China)","ror":"https://ror.org/01cwwvj38","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210100976"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Qiang Fu","raw_affiliation_strings":["BOE Technology Group Co., Ltd.  Beijing China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"BOE Technology Group Co., Ltd.  Beijing China","institution_ids":["https://openalex.org/I4210100976"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Bo Shi","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210100976","display_name":"BOE Technology Group (China)","ror":"https://ror.org/01cwwvj38","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210100976"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Bo Shi","raw_affiliation_strings":["Chengdu BOE Optoelectroncs Technology Co., Ltd.  Chengdu China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chengdu BOE Optoelectroncs Technology Co., Ltd.  Chengdu China","institution_ids":["https://openalex.org/I4210100976"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087608713","display_name":"Long Chen","orcid":"https://orcid.org/0009-0009-2458-194X","observed_orcids":["https://orcid.org/0009-0009-2458-194X"]},"institutions":[{"id":"https://openalex.org/I4210100976","display_name":"BOE Technology Group (China)","ror":"https://ror.org/01cwwvj38","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210100976"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Long Chen","raw_affiliation_strings":["Chengdu BOE Optoelectroncs Technology Co., Ltd.  Chengdu China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chengdu BOE Optoelectroncs Technology Co., Ltd.  Chengdu China","institution_ids":["https://openalex.org/I4210100976"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Dongyu Gao","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210100976","display_name":"BOE Technology Group (China)","ror":"https://ror.org/01cwwvj38","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210100976"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Dongyu Gao","raw_affiliation_strings":["Chongqing BOE Display Technology Co., Ltd.  China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chongqing BOE Display Technology Co., Ltd.  China","institution_ids":["https://openalex.org/I4210100976"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Li Zhu","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210100976","display_name":"BOE Technology Group (China)","ror":"https://ror.org/01cwwvj38","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210100976"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Li Zhu","raw_affiliation_strings":["Chengdu BOE Optoelectroncs Technology Co., Ltd.  Chengdu China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chengdu BOE Optoelectroncs Technology Co., Ltd.  Chengdu China","institution_ids":["https://openalex.org/I4210100976"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108962590","display_name":"Langtao Li","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210100976","display_name":"BOE Technology Group (China)","ror":"https://ror.org/01cwwvj38","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210100976"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Langtao Li","raw_affiliation_strings":["Chengdu BOE Optoelectroncs Technology Co., Ltd.  Chengdu China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chengdu BOE Optoelectroncs Technology Co., Ltd.  Chengdu China","institution_ids":["https://openalex.org/I4210100976"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5114199874","display_name":"Dengyu Wang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210100976","display_name":"BOE Technology Group (China)","ror":"https://ror.org/01cwwvj38","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210100976"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Dengyu Wang","raw_affiliation_strings":["Chengdu BOE Optoelectroncs Technology Co., Ltd.  Chengdu China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chengdu BOE Optoelectroncs Technology Co., Ltd.  Chengdu China","institution_ids":["https://openalex.org/I4210100976"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111273939","display_name":"Xuenan Pan","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210100976","display_name":"BOE Technology Group (China)","ror":"https://ror.org/01cwwvj38","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210100976"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xuenan Pan","raw_affiliation_strings":["Chengdu BOE Optoelectroncs Technology Co., Ltd.  Chengdu China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chengdu BOE Optoelectroncs Technology Co., Ltd.  Chengdu China","institution_ids":["https://openalex.org/I4210100976"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111273938","display_name":"Kai Zhang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210100976","display_name":"BOE Technology Group (China)","ror":"https://ror.org/01cwwvj38","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210100976"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Kai Zhang","raw_affiliation_strings":["Chengdu BOE Optoelectroncs Technology Co., Ltd.  Chengdu China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chengdu BOE Optoelectroncs Technology Co., Ltd.  Chengdu China","institution_ids":["https://openalex.org/I4210100976"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103461513","display_name":"Dongfang Yang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210100976","display_name":"BOE Technology Group (China)","ror":"https://ror.org/01cwwvj38","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210100976"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Dongfang Yang","raw_affiliation_strings":["Chengdu BOE Optoelectroncs Technology Co., Ltd.  Chengdu China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chengdu BOE Optoelectroncs Technology Co., Ltd.  Chengdu China","institution_ids":["https://openalex.org/I4210100976"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102696066","display_name":"Guoqiang Tang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210100976","display_name":"BOE Technology Group (China)","ror":"https://ror.org/01cwwvj38","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210100976"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Guoqiang Tang","raw_affiliation_strings":["Chengdu BOE Optoelectroncs Technology Co., Ltd.  Chengdu China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chengdu BOE Optoelectroncs Technology Co., Ltd.  Chengdu China","institution_ids":["https://openalex.org/I4210100976"]}]},{"author_position":"last","author":{"id":null,"display_name":"Fujiang Jin","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210100976","display_name":"BOE Technology Group (China)","ror":"https://ror.org/01cwwvj38","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210100976"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fujiang Jin","raw_affiliation_strings":["Chengdu BOE Optoelectroncs Technology Co., Ltd.  Chengdu China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Chengdu BOE Optoelectroncs Technology Co., Ltd.  Chengdu China","institution_ids":["https://openalex.org/I4210100976"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210100976"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"55","issue":"1","first_page":"377","last_page":"381"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12166","display_name":"Ion-surface interactions and analysis","score":0.3707999885082245,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12166","display_name":"Ion-surface interactions and analysis","score":0.3707999885082245,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.10930000245571136,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10611","display_name":"Organic Light-Emitting Diodes Research","score":0.0917000025510788,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/time-of-flight-secondary-ion-mass-spectrometry","display_name":"time-of-flight secondary ion mass spectrometry","score":0.9819999933242798},{"id":"https://openalex.org/keywords/defect-detection","display_name":"defect detection","score":0.8040000200271606},{"id":"https://openalex.org/keywords/production-line-inspection","display_name":"production line inspection","score":0.597000002861023}],"concepts":[{"id":"https://openalex.org/C150759737","wikidata":"https://www.wikidata.org/wiki/Q209593","display_name":"OLED","level":3,"score":0.7263206243515015},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4813862144947052},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3352469205856323},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.1610802710056305},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1002/sdtp.17536","doi":"https://doi.org/10.1002/sdtp.17536","is_oa":false,"landing_page_url":"https://doi.org/10.1002/sdtp.17536","pdf_url":null,"source":{"id":"https://openalex.org/S4210171700","display_name":"SID Symposium Digest of Technical Papers","issn_l":"0097-966X","issn":["0097-966X","2154-6738","2154-6746","2168-0159"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core"],"host_organization":"https://openalex.org/P4310320595","host_organization_name":"Wiley","host_organization_lineage":["https://openalex.org/P4310320595"],"host_organization_lineage_names":["Wiley"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SID Symposium Digest of Technical Papers","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W2468805608","https://openalex.org/W2806184877","https://openalex.org/W3030993512","https://openalex.org/W3205497733","https://openalex.org/W4313244844","https://openalex.org/W4385516856"],"related_works":["https://openalex.org/W2994805349","https://openalex.org/W7077056851","https://openalex.org/W2947523585","https://openalex.org/W3010290657","https://openalex.org/W3089513990","https://openalex.org/W1966874761","https://openalex.org/W7131583715","https://openalex.org/W2949905509","https://openalex.org/W7014201477","https://openalex.org/W4413469437"],"abstract_inverted_index":{"By":[0],"analyzing":[1],"OLED":[2,21],"film":[3],"layers":[4],"using":[5],"the":[6,18,25,35],"TOF":[7],"SIMS":[8],"method":[9,30],"with":[10],"3D":[11],"imaging":[12],"capability,":[13],"we":[14],"can":[15,31],"effectively":[16],"improve":[17],"detection":[19],"of":[20],"defects":[22],"and":[23,42],"understand":[24],"constitutive":[26],"relationship.":[27],"This":[28],"inspection":[29],"be":[32],"integrated":[33],"into":[34],"production":[36],"line":[37],"to":[38],"realize":[39],"process":[40],"improvement":[41],"defect":[43],"interception":[44],"during":[45],"mass":[46],"production.":[47]},"counts_by_year":[],"updated_date":"2026-10-14T16:39:01.820549","created_date":"2024-07-31T00:00:00"}