{"id":"https://openalex.org/W4400405486","doi":"https://doi.org/10.60087/jaigs.v3i1.191","title":"Integration of AI and Machine Learning in Semiconductor Manufacturing for Defect Detection and Yield Improvement","display_name":"Integration of AI and Machine Learning in Semiconductor Manufacturing for Defect Detection and Yield Improvement","publication_year":2024,"publication_date":"2024-03-30","ids":{"openalex":"https://openalex.org/W4400405486","doi":"https://doi.org/10.60087/jaigs.v3i1.191"},"language":"en","primary_location":{"id":"doi:10.60087/jaigs.v3i1.191","doi":"https://doi.org/10.60087/jaigs.v3i1.191","is_oa":true,"landing_page_url":"https://doi.org/10.60087/jaigs.v3i1.191","pdf_url":"https://ojs.boulibrary.com/index.php/JAIGS/article/download/191/142","source":{"id":"https://openalex.org/S5407043178","display_name":"Journal of Artificial Intelligence General science (JAIGS)","issn_l":"3006-4023","issn":["3006-4023"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I4210096066","host_organization_name":"Open Knowledge (United Kingdom)","host_organization_lineage":["https://openalex.org/I4210096066"],"host_organization_lineage_names":[],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Artificial Intelligence General science (JAIGS) ISSN:3006-4023","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"hybrid","oa_url":"https://ojs.boulibrary.com/index.php/JAIGS/article/download/191/142","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5095697189","display_name":"Monish Katari","orcid":"https://orcid.org/0009-0007-9255-9555","observed_orcids":["https://orcid.org/0009-0007-9255-9555"]},"institutions":[{"id":"https://openalex.org/I4210154351","display_name":"Marvell (United States)","ror":"https://ror.org/04wmff902","country_code":"US","type":"company","lineage":["https://openalex.org/I4210092679","https://openalex.org/I4210154351"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Monish Katari","raw_affiliation_strings":["Marvell Semiconductor Inc, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Marvell Semiconductor Inc, USA","institution_ids":["https://openalex.org/I4210154351"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5094286726","display_name":"Lavanya Shanmugam","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Lavanya Shanmugam","raw_affiliation_strings":["Tata Consultancy Services, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tata Consultancy Services, USA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5094240517","display_name":"Jesu Narkarunai Arasu Malaiyappan -","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210114444","display_name":"Meta (United States)","ror":"https://ror.org/01zbnvs85","country_code":"US","type":"company","lineage":["https://openalex.org/I4210114444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jesu Narkarunai Arasu Malaiyappan","raw_affiliation_strings":["Meta Platforms Inc, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Meta Platforms Inc, USA","institution_ids":["https://openalex.org/I4210114444"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.459,"has_fulltext":true,"cited_by_count":10,"citation_normalized_percentile":{"value":0.79341637,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":98},"biblio":{"volume":"3","issue":"1","first_page":"418","last_page":"431"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10876","display_name":"Fault Detection and Control Systems","score":0.0010999999940395355,"subfield":{"id":"https://openalex.org/subfields/2207","display_name":"Control and Systems Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14260","display_name":"Impact of AI and Big Data on Business and Society","score":0.0005000000237487257,"subfield":{"id":"https://openalex.org/subfields/1803","display_name":"Management Science and Operations Research"},"field":{"id":"https://openalex.org/fields/18","display_name":"Decision Sciences"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/semiconductor-manufacturing","display_name":"semiconductor manufacturing","score":0.8309999704360962},{"id":"https://openalex.org/keywords/defect-detection","display_name":"defect detection","score":0.9399999976158142},{"id":"https://openalex.org/keywords/yield-improvement","display_name":"yield improvement","score":0.968999981880188},{"id":"https://openalex.org/keywords/machine-learning","display_name":"machine learning","score":0.7480000257492065},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"artificial intelligence","score":0.9700000286102295},{"id":"https://openalex.org/keywords/process-optimization","display_name":"process optimization","score":0.878000020980835},{"id":"https://openalex.org/keywords/quality-control","display_name":"quality control","score":0.9850000143051147}],"concepts":[{"id":"https://openalex.org/C134121241","wikidata":"https://www.wikidata.org/wiki/Q899301","display_name":"Yield (engineering)","level":2,"score":0.6712344884872437},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.5935646295547485},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.5177397131919861},{"id":"https://openalex.org/C119857082","wikidata":"https://www.wikidata.org/wiki/Q2539","display_name":"Machine learning","level":1,"score":0.4848366975784302},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.48001354932785034},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4616130590438843},{"id":"https://openalex.org/C108225325","wikidata":"https://www.wikidata.org/wiki/Q11456","display_name":"Semiconductor","level":2,"score":0.42555558681488037},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3336588144302368},{"id":"https://openalex.org/C13736549","wikidata":"https://www.wikidata.org/wiki/Q4489420","display_name":"Industrial engineering","level":1,"score":0.3285115659236908},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.22714537382125854},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.16782978177070618},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.07440516352653503},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.60087/jaigs.v3i1.191","doi":"https://doi.org/10.60087/jaigs.v3i1.191","is_oa":true,"landing_page_url":"https://doi.org/10.60087/jaigs.v3i1.191","pdf_url":"https://ojs.boulibrary.com/index.php/JAIGS/article/download/191/142","source":{"id":"https://openalex.org/S5407043178","display_name":"Journal of Artificial Intelligence General science (JAIGS)","issn_l":"3006-4023","issn":["3006-4023"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I4210096066","host_organization_name":"Open Knowledge (United Kingdom)","host_organization_lineage":["https://openalex.org/I4210096066"],"host_organization_lineage_names":[],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Artificial Intelligence General science (JAIGS) ISSN:3006-4023","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.60087/jaigs.v3i1.191","doi":"https://doi.org/10.60087/jaigs.v3i1.191","is_oa":true,"landing_page_url":"https://doi.org/10.60087/jaigs.v3i1.191","pdf_url":"https://ojs.boulibrary.com/index.php/JAIGS/article/download/191/142","source":{"id":"https://openalex.org/S5407043178","display_name":"Journal of Artificial Intelligence General science (JAIGS)","issn_l":"3006-4023","issn":["3006-4023"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I4210096066","host_organization_name":"Open Knowledge (United Kingdom)","host_organization_lineage":["https://openalex.org/I4210096066"],"host_organization_lineage_names":[],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of Artificial Intelligence General science (JAIGS) ISSN:3006-4023","raw_type":"journal-article"},"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.5378999710083008,"id":"https://metadata.un.org/sdg/9"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4400405486.pdf","grobid_xml":"https://content.openalex.org/works/W4400405486.grobid-xml"},"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W7164399722","https://openalex.org/W7162562156","https://openalex.org/W4414109919","https://openalex.org/W4408971600","https://openalex.org/W7132830210","https://openalex.org/W4409555704","https://openalex.org/W4414270928","https://openalex.org/W4401783823","https://openalex.org/W7152046057","https://openalex.org/W7138952451"],"abstract_inverted_index":{"The":[0],"integration":[1],"of":[2,28,48,79],"Artificial":[3],"Intelligence":[4],"(AI)":[5],"and":[6,17,22,39,50,66,72,81],"Machine":[7],"Learning":[8],"(ML)":[9],"into":[10],"semiconductor":[11,54,85],"manufacturing":[12],"has":[13],"revolutionized":[14],"defect":[15,61],"detection":[16,62],"yield":[18,67],"improvement":[19],"processes.":[20],"AI":[21,49,80],"ML":[23,51,82],"algorithms":[24],"analyze":[25],"vast":[26],"amounts":[27],"data":[29],"generated":[30],"during":[31],"fabrication":[32],"to":[33,90],"enhance":[34],"quality":[35],"control,":[36],"reduce":[37],"defects,":[38],"optimize":[40],"production":[41],"yields.":[42],"This":[43],"paper":[44],"provides":[45],"an":[46],"overview":[47],"applications":[52],"in":[53,60,94],"manufacturing,":[55],"focusing":[56],"on":[57,84],"their":[58,88],"roles":[59],"methodologies,":[63],"process":[64],"optimization,":[65],"enhancement":[68],"strategies.":[69],"Case":[70],"studies":[71],"current":[73],"advancements":[74,93],"illustrate":[75],"the":[76],"transformative":[77],"impact":[78],"technologies":[83],"fabrication,":[86],"highlighting":[87],"potential":[89],"drive":[91],"future":[92],"microelectronics.":[95]},"counts_by_year":[{"year":2026,"cited_by_count":3},{"year":2025,"cited_by_count":6},{"year":2024,"cited_by_count":1}],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2024-07-09T00:00:00"}