{"id":"https://openalex.org/W4400034040","doi":"https://doi.org/10.1109/ectc51529.2024.00046","title":"Multi-material Corner Singularity in Electronic Packaging: Avoiding Mesh Dependence in Analyzing Stress","display_name":"Multi-material Corner Singularity in Electronic Packaging: Avoiding Mesh Dependence in Analyzing Stress","publication_year":2024,"publication_date":"2024-05-28","ids":{"openalex":"https://openalex.org/W4400034040","doi":"https://doi.org/10.1109/ectc51529.2024.00046"},"language":"en","primary_location":{"id":"doi:10.1109/ectc51529.2024.00046","doi":"https://doi.org/10.1109/ectc51529.2024.00046","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1109/ectc51529.2024.00046","pdf_url":null,"source":{"id":"https://openalex.org/S4363608088","display_name":"IEEE Electronic Components and Technology Conference (ECTC)","issn_l":"2766-8401","issn":["2766-8401"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 IEEE 74th Electronic Components and Technology Conference (ECTC)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5102728782","display_name":"Yaxiong Chen","orcid":"https://orcid.org/0000-0002-2028-0172","observed_orcids":["https://orcid.org/0000-0002-2028-0172"]},"institutions":[{"id":"https://openalex.org/I4210140035","display_name":"NXP (United States)","ror":"https://ror.org/054fc6480","country_code":"US","type":"company","lineage":["https://openalex.org/I109147379","https://openalex.org/I4210140035"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yaxiong Chen","raw_affiliation_strings":["NXP Semiconductors, Austin, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"NXP Semiconductors, Austin, USA","institution_ids":["https://openalex.org/I4210140035"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110561103","display_name":"Torsten Hauck","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210123704","display_name":"NXP (Germany)","ror":"https://ror.org/0268h4j55","country_code":"DE","type":"company","lineage":["https://openalex.org/I109147379","https://openalex.org/I4210123704"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Torsten Hauck","raw_affiliation_strings":["NXP Semiconductors, Munich, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"NXP Semiconductors, Munich, Germany","institution_ids":["https://openalex.org/I4210123704"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5080314217","display_name":"Ganesh Subbarayan","orcid":"https://orcid.org/0000-0003-0462-1130","observed_orcids":["https://orcid.org/0000-0003-0462-1130","https://orcid.org/0009-0004-8844-4358"]},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ganesh Subbarayan","raw_affiliation_strings":["Purdue University, West Lafayette, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Purdue University, West Lafayette, USA","institution_ids":["https://openalex.org/I219193219"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.08341359,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"240","last_page":"245"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.8115000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.8115000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.09600000083446503,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.019500000402331352,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/stress-singularity","display_name":"stress singularity","score":0.8690000176429749},{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"electronic packaging","score":0.8169999718666077},{"id":"https://openalex.org/keywords/mesh-sensitivity","display_name":"mesh sensitivity","score":0.6190000176429749},{"id":"https://openalex.org/keywords/stress-intensity-factor","display_name":"stress intensity factor","score":0.8159999847412109},{"id":"https://openalex.org/keywords/wedge-angle","display_name":"wedge angle","score":0.7979999780654907},{"id":"https://openalex.org/keywords/failure-risk-assessment","display_name":"failure risk assessment","score":0.6169999837875366},{"id":"https://openalex.org/keywords/interposer","display_name":"interposer","score":0.7490000128746033},{"id":"https://openalex.org/keywords/microelectronic-interconnects","display_name":"microelectronic interconnects","score":0.9110000133514404},{"id":"https://openalex.org/keywords/stress-concentration","display_name":"stress concentration","score":0.6240000128746033},{"id":"https://openalex.org/keywords/plane-elasticity","display_name":"plane elasticity","score":0.7200000286102295}],"concepts":[{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.6379656791687012},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.5756173729896545},{"id":"https://openalex.org/C16171025","wikidata":"https://www.wikidata.org/wiki/Q863349","display_name":"Singularity","level":2,"score":0.566525399684906},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5094273686408997},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.35014769434928894},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.29993975162506104},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1569993495941162},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.10746800899505615},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.09206828474998474},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ectc51529.2024.00046","doi":"https://doi.org/10.1109/ectc51529.2024.00046","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1109/ectc51529.2024.00046","pdf_url":null,"source":{"id":"https://openalex.org/S4363608088","display_name":"IEEE Electronic Components and Technology Conference (ECTC)","issn_l":"2766-8401","issn":["2766-8401"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 IEEE 74th Electronic Components and Technology Conference (ECTC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W1971585028","https://openalex.org/W1993812914","https://openalex.org/W1999208306","https://openalex.org/W2003000852","https://openalex.org/W2021220136","https://openalex.org/W2075439258","https://openalex.org/W2124249034","https://openalex.org/W2132133530","https://openalex.org/W2167105128","https://openalex.org/W2964867707","https://openalex.org/W3155345461","https://openalex.org/W4226158634","https://openalex.org/W4286207999"],"related_works":["https://openalex.org/W209217344","https://openalex.org/W4392910122","https://openalex.org/W104745185","https://openalex.org/W3155345461","https://openalex.org/W2544957305","https://openalex.org/W2168896349","https://openalex.org/W2036385534","https://openalex.org/W2124249034","https://openalex.org/W4313422995","https://openalex.org/W2109014574"],"abstract_inverted_index":{"Multi-material":[0],"corners":[1,19,41],"occur":[2],"at":[3,187],"interfaces":[4],"in":[5,11,16,39],"electronic":[6],"packaging.":[7],"They":[8],"are":[9,20,58],"ubiquitous":[10],"chip":[12],"dielectric":[13],"stacks":[14],"and":[15,62,90,96,104,124,150,179],"interposers.":[17],"These":[18],"locations":[21],"of":[22,48,54,77,101,110],"stress":[23,70,88,137,174],"concentration":[24],"(singular":[25],"according":[26],"to":[27,44,69,81,173,183],"elasticity":[28,116],"theory).":[29],"This":[30,163],"paper":[31],"introduces":[32],"a":[33,83,126,135,144,160,166,180],"practical":[34],"approach":[35,164],"for":[36,129,169],"analyzing":[37],"singularities":[38,71,178],"multi-material":[40,188],"with":[42],"application":[43],"the":[45,108,120,148],"mechanical":[46],"analysis":[47,57,158],"microelectronic":[49],"interconnect":[50],"structures.":[51],"The":[52,74,99],"results":[53],"finite":[55,156],"element":[56,157],"mesh":[59,121],"refinement-dependent,":[60],"inaccurate,":[61],"often":[63],"yield":[64],"overly":[65],"conservative":[66],"prediction":[67],"due":[68],"near":[72,147],"corners.":[73],"primary":[75],"objective":[76],"this":[78],"study":[79],"is":[80,112],"establish":[82],"correlation":[84],"between":[85],"corner":[86,149],"singularities,":[87],"levels,":[89],"failure":[91,131,185],"risk,":[92,132],"considering":[93],"material":[94,102],"properties":[95],"wedge":[97,105],"angles.":[98],"influence":[100],"behavior":[103],"angle":[106],"on":[107],"order":[109],"singularity":[111],"analyzed":[113],"using":[114],"planar":[115],"theory.":[117],"To":[118],"address":[119],"sensitivity":[122],"issue":[123],"provide":[125],"robust":[127,181],"metric":[128,182],"evaluating":[130],"we":[133],"propose":[134],"generalized":[136],"intensity":[138],"factor,":[139],"which":[140],"remains":[141],"constant":[142],"within":[143],"defined":[145],"range":[146],"can":[151],"be":[152],"easily":[153],"integrated":[154],"into":[155],"as":[159],"post-processing":[161],"step.":[162],"offers":[165],"mesh-independent":[167],"solution":[168],"assessing":[170],"designs":[171],"prone":[172],"overshooting":[175],"caused":[176],"by":[177],"evaluate":[184],"risk":[186],"corner.":[189]},"counts_by_year":[],"updated_date":"2026-10-30T12:39:25.321706","created_date":"2024-06-27T00:00:00"}