{"id":"https://openalex.org/W4400034026","doi":"https://doi.org/10.1109/ectc51529.2024.00181","title":"Complex board via structure induced uneven stress/strain impact on interconnect stability: SAC305, full and hybrid LTS comparison","display_name":"Complex board via structure induced uneven stress/strain impact on interconnect stability: SAC305, full and hybrid LTS comparison","publication_year":2024,"publication_date":"2024-05-28","ids":{"openalex":"https://openalex.org/W4400034026","doi":"https://doi.org/10.1109/ectc51529.2024.00181"},"language":"en","primary_location":{"id":"doi:10.1109/ectc51529.2024.00181","doi":"https://doi.org/10.1109/ectc51529.2024.00181","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ectc51529.2024.00181","pdf_url":null,"source":{"id":"https://openalex.org/S4363608088","display_name":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","issn_l":"2766-8401","issn":["2766-8401"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 IEEE 74th Electronic Components and Technology Conference (ECTC)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5052592970","display_name":"Tae-Kyu Lee","orcid":"https://orcid.org/0000-0002-3433-8152","observed_orcids":["https://orcid.org/0000-0002-3433-8152"]},"institutions":[{"id":"https://openalex.org/I135428043","display_name":"Cisco Systems (United States)","ror":"https://ror.org/03yt1ez60","country_code":"US","type":"company","lineage":["https://openalex.org/I135428043"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Tae-Kyu Lee","raw_affiliation_strings":["Cisco Systems,San Jose,United States","Cisco Systems, San Jose, United States"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Cisco Systems,San Jose,United States","institution_ids":["https://openalex.org/I135428043"]},{"raw_affiliation_string":"Cisco Systems, San Jose, United States","institution_ids":["https://openalex.org/I135428043"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100759792","display_name":"Yujin Park","orcid":"https://orcid.org/0009-0004-8043-0584","observed_orcids":["https://orcid.org/0009-0004-8043-0584"]},"institutions":[{"id":"https://openalex.org/I135428043","display_name":"Cisco Systems (United States)","ror":"https://ror.org/03yt1ez60","country_code":"US","type":"company","lineage":["https://openalex.org/I135428043"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yujin Park","raw_affiliation_strings":["Cisco Systems,San Jose,United States","Cisco Systems, San Jose, United States"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Cisco Systems,San Jose,United States","institution_ids":["https://openalex.org/I135428043"]},{"raw_affiliation_string":"Cisco Systems, San Jose, United States","institution_ids":["https://openalex.org/I135428043"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5050966238","display_name":"Gnyaneshwar Ramakrishna","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I135428043","display_name":"Cisco Systems (United States)","ror":"https://ror.org/03yt1ez60","country_code":"US","type":"company","lineage":["https://openalex.org/I135428043"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Gnyaneshwar Ramakrishna","raw_affiliation_strings":["Cisco Systems,San Jose,United States","Cisco Systems, San Jose, United States"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Cisco Systems,San Jose,United States","institution_ids":["https://openalex.org/I135428043"]},{"raw_affiliation_string":"Cisco Systems, San Jose, United States","institution_ids":["https://openalex.org/I135428043"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040000624","display_name":"Jonghyun Nam","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405272917","display_name":"SK Hynix (South Korea)","ror":"https://ror.org/04z2p0w98","country_code":"KR","type":"company","lineage":["https://openalex.org/I4405272917"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jonghyun Nam","raw_affiliation_strings":["SK Hynix,Icheon,Korea","SK Hynix, Icheon, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SK Hynix,Icheon,Korea","institution_ids":["https://openalex.org/I4405272917"]},{"raw_affiliation_string":"SK Hynix, Icheon, Korea","institution_ids":["https://openalex.org/I4405272917"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5114182323","display_name":"Daljin Yoon","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405272917","display_name":"SK Hynix (South Korea)","ror":"https://ror.org/04z2p0w98","country_code":"KR","type":"company","lineage":["https://openalex.org/I4405272917"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Daljin Yoon","raw_affiliation_strings":["SK Hynix,Icheon,Korea","SK Hynix, Icheon, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SK Hynix,Icheon,Korea","institution_ids":["https://openalex.org/I4405272917"]},{"raw_affiliation_string":"SK Hynix, Icheon, Korea","institution_ids":["https://openalex.org/I4405272917"]}]},{"author_position":"last","author":{"id":null,"display_name":"Heera Roh","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405272917","display_name":"SK Hynix (South Korea)","ror":"https://ror.org/04z2p0w98","country_code":"KR","type":"company","lineage":["https://openalex.org/I4405272917"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Heera Roh","raw_affiliation_strings":["SK Hynix,Icheon,Korea","SK Hynix, Icheon, Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SK Hynix,Icheon,Korea","institution_ids":["https://openalex.org/I4405272917"]},{"raw_affiliation_string":"SK Hynix, Icheon, Korea","institution_ids":["https://openalex.org/I4405272917"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.8042,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.58911962,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1124","last_page":"1130"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10834","display_name":"Welding Techniques and Residual Stresses","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/sac305-solder","display_name":"SAC305 solder","score":0.8529999852180481},{"id":"https://openalex.org/keywords/board-level-interconnects","display_name":"board-level interconnects","score":0.6399999856948853},{"id":"https://openalex.org/keywords/in-situ-resistance-measurement","display_name":"in situ resistance measurement","score":0.7129999995231628},{"id":"https://openalex.org/keywords/in-situ-optical-observation","display_name":"in situ optical observation","score":0.7639999985694885},{"id":"https://openalex.org/keywords/ball-grid-array","display_name":"ball grid array","score":0.6370000243186951},{"id":"https://openalex.org/keywords/reflow-soldering","display_name":"reflow soldering","score":0.46399998664855957}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6832878589630127},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.5538474917411804},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5159614682197571},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.38960233330726624},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.33327221870422363},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.32185807824134827},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.26394370198249817},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.17704686522483826},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.09392726421356201},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ectc51529.2024.00181","doi":"https://doi.org/10.1109/ectc51529.2024.00181","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ectc51529.2024.00181","pdf_url":null,"source":{"id":"https://openalex.org/S4363608088","display_name":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","issn_l":"2766-8401","issn":["2766-8401"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 IEEE 74th Electronic Components and Technology Conference (ECTC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"sustainable_development_goals_aurora":[{"display_name":"Climate action","score":0.47999998927116394,"id":"https://metadata.un.org/sdg/13"}],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320309493","display_name":"Portland State University","ror":"https://ror.org/00yn2fy02"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W2145374250","https://openalex.org/W2605188449","https://openalex.org/W3082369297","https://openalex.org/W3096522346","https://openalex.org/W4254389816"],"related_works":["https://openalex.org/W2155019192","https://openalex.org/W2014709025","https://openalex.org/W2766970861","https://openalex.org/W3125341812","https://openalex.org/W1991674760","https://openalex.org/W1668171714","https://openalex.org/W4380607112","https://openalex.org/W2218294330","https://openalex.org/W1997278405","https://openalex.org/W2347989876"],"abstract_inverted_index":{"The":[0,33,113,253,305,342],"power":[1,37],"delivery":[2],"and":[3,11,38,54,73,83,88,97,138,147,153,160,182,241,270,320,336],"high-speed":[4],"signal":[5,43,52,55,93],"demand":[6],"in":[7,18,229,260],"recent":[8],"high":[9],"performance":[10],"network":[12],"chips":[13],"drives":[14],"a":[15,67,118,130,177,195,216],"great":[16],"effort":[17],"the":[19,24,30,36,42,51,57,63,85,91,122,144,208,257,267,278,282,287,290,309,316,321,333,347],"interconnections":[20],"not":[21,325],"only":[22,191],"at":[23,29],"chip":[25],"level":[26],"but":[27],"also":[28],"board":[31,47,101,353],"level.":[32],"balance":[34],"between":[35,315],"ground":[39],"pins":[40,44],"versus":[41],"creates":[45],"complex":[46,100],"configurations":[48,102,201],"to":[49,188,204,207,303],"achieve":[50],"speed":[53],"quality":[56],"device":[58],"needs.":[59],"To":[60,276],"efficiently":[61],"connect":[62],"increasing":[64],"Cu":[65],"layers,":[66],"mixture":[68,178],"of":[69,120,125,132,143,179,281,289],"trace,":[70],"micro-via,":[71],"through-hole,":[72],"via-in":[74],"pad":[75,319,323],"plated":[76],"over":[77],"(VIPPO)":[78],"structures":[79],"can":[80,103,262],"be":[81,263],"used":[82],"increase":[84],"component":[86],"density":[87],"functionality":[89],"for":[90,332],"desired":[92],"integrity.":[94],"But":[95],"utilizing":[96],"mixing":[98],"these":[99],"induce":[104],"solder":[105,161,199,209,224,234,239,247,273,283,339,348],"joint":[106,145,162,200,214,274,340],"interface":[107],"defects":[108],"known":[109],"as":[110,194,215],"Solder":[111],"separation.":[112],"study":[114],"presented":[115],"here":[116],"is":[117],"continuation":[119],"identifying":[121],"driving":[123,279],"force":[124,280,329],"this":[126],"defect":[127,259,285,350],"mechanism.":[128],"Through":[129],"series":[131],"in-situ":[133,140],"resistance":[134],"measurement":[135],"during":[136,330],"reflow":[137,331],"an":[139,296],"optical":[141,297],"observation":[142],"melting":[146,222],"solidification":[148],"behavior,":[149],"accurate":[150],"separation":[151,210,258,284,349],"time":[152],"temperature":[154,223,301],"are":[155,227,356],"identified":[156,307],"per":[157,352],"design":[158,193,354],"configuration":[159,355],"alloy":[163,219],"combinations.":[164],"10x15mm2ball":[165],"grid":[166],"arrays":[167],"(BGA)":[168],"components":[169],"were":[170,202],"assembled":[171,236,249],"on":[172],"test":[173,291],"boards,":[174],"which":[175,231,244],"contain":[176],"full":[180,189,242,271,317,337],"VIPPO":[181,183,190,318],"+":[184],"backdrilled":[185,322],"pads":[186,192],"compared":[187,228],"baseline.":[196],"Three":[197],"different":[198],"selected":[203],"investigate":[205],"sensitivity":[206],"defect.":[211],"Full":[212],"SAC305":[213,233,261],"baseline,":[217],"Sn-Bi-In":[218,246],"system":[220],"low":[221],"(LTS)":[225],"joints":[226],"hybrid,":[230],"have":[232,245],"balls":[235,248],"with":[237,250,265,295,346],"Sn-Bi-Ag":[238,251],"paste,":[240],"LTS,":[243],"paste.":[252],"results":[254],"indicated":[255],"that":[256,308],"mitigated":[264],"using":[266],"hybrid":[268,334],"LTS":[269,272,335,338],"configuration.":[275,341],"identify":[277],"mechanism,":[286],"surface":[288],"PCB":[292],"was":[293],"scanned":[294],"profilometer":[298],"from":[299],"room":[300],"up":[302],"200\u00b0C.":[304],"analysis":[306],"z-axis":[310],"expansion":[311],"induced":[312],"height":[313],"difference":[314],"did":[324],"generated":[326],"enough":[327],"tension":[328],"contribution":[343],"parameters":[344],"associated":[345],"mechanism":[351],"discussed.":[357]},"counts_by_year":[{"year":2025,"cited_by_count":1}],"updated_date":"2026-10-09T09:14:12.587421","created_date":"2025-10-10T00:00:00"}