{"id":"https://openalex.org/W4398767115","doi":"https://doi.org/10.1016/j.mssp.2024.108556","title":"Thermoelectric properties of (Cu,Te) co-doped CoSb3 synthesized by high-pressure and high-temperature","display_name":"Thermoelectric properties of (Cu,Te) co-doped CoSb3 synthesized by high-pressure and high-temperature","publication_year":2024,"publication_date":"2024-05-24","ids":{"openalex":"https://openalex.org/W4398767115","doi":"https://doi.org/10.1016/j.mssp.2024.108556"},"language":"en","primary_location":{"id":"doi:10.1016/j.mssp.2024.108556","doi":"https://doi.org/10.1016/j.mssp.2024.108556","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.mssp.2024.108556","pdf_url":null,"source":{"id":"https://openalex.org/S82126420","display_name":"Materials Science in Semiconductor Processing","issn_l":"1369-8001","issn":["1369-8001","1873-4081"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","ki-jl-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Materials Science in Semiconductor Processing","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5112851297","display_name":"Bingke Qin","orcid":"https://orcid.org/0000-0003-0566-0967","observed_orcids":["https://orcid.org/0000-0003-0566-0967","https://orcid.org/0000-0001-7987-3434"]},"institutions":[{"id":"https://openalex.org/I4210128208","display_name":"Tongren University","ror":"https://ror.org/035hxad97","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210128208"]},{"id":"https://openalex.org/I4210138370","display_name":"Liupanshui Normal University","ror":"https://ror.org/038d7ve10","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210138370"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Bingke Qin","raw_affiliation_strings":["Liupanshui Normal University, Liupanshui 553004, China","School of Data Science, Tongren University, Tongren, 554300, China"],"raw_orcid":"https://orcid.org/0000-0003-0566-0967","affiliations":[{"raw_affiliation_string":"Liupanshui Normal University, Liupanshui 553004, China","institution_ids":["https://openalex.org/I4210138370"]},{"raw_affiliation_string":"School of Data Science, Tongren University, Tongren, 554300, China","institution_ids":["https://openalex.org/I4210128208"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068374218","display_name":"Yonghua Ji","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210138370","display_name":"Liupanshui Normal University","ror":"https://ror.org/038d7ve10","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210138370"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Yonghua Ji","raw_affiliation_strings":["Liupanshui Normal University, Liupanshui 553004, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Liupanshui Normal University, Liupanshui 553004, China","institution_ids":["https://openalex.org/I4210138370"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5069292350","display_name":"Yizhu Lei","orcid":"https://orcid.org/0000-0002-9247-6000","observed_orcids":["https://orcid.org/0000-0002-9247-6000"]},"institutions":[{"id":"https://openalex.org/I4210138370","display_name":"Liupanshui Normal University","ror":"https://ror.org/038d7ve10","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210138370"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yizhu Lei","raw_affiliation_strings":["Liupanshui Normal University, Liupanshui 553004, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Liupanshui Normal University, Liupanshui 553004, China","institution_ids":["https://openalex.org/I4210138370"]}]},{"author_position":"last","author":{"id":null,"display_name":"Yong Li","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210128208","display_name":"Tongren University","ror":"https://ror.org/035hxad97","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210128208"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yong Li","raw_affiliation_strings":["School of Data Science, Tongren University, Tongren, 554300, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Data Science, Tongren University, Tongren, 554300, China","institution_ids":["https://openalex.org/I4210128208"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5068374218"],"corresponding_institution_ids":["https://openalex.org/I4210138370"],"apc_list":{"value":3060,"currency":"USD","value_usd":3060},"apc_paid":null,"fwci":0.3499,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.38816725,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":"180","issue":null,"first_page":"108556","last_page":"108556"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/cosb3","display_name":"CoSb3","score":0.8970000147819519},{"id":"https://openalex.org/keywords/skutterudites","display_name":"skutterudites","score":0.9610000252723694},{"id":"https://openalex.org/keywords/thermoelectric-properties","display_name":"thermoelectric properties","score":0.828000009059906},{"id":"https://openalex.org/keywords/high-pressure-high-temperature-synthesis","display_name":"high-pressure high-temperature synthesis","score":0.9599999785423279},{"id":"https://openalex.org/keywords/lattice-thermal-conductivity","display_name":"lattice thermal conductivity","score":0.8450000286102295},{"id":"https://openalex.org/keywords/carrier-concentration","display_name":"carrier concentration","score":0.7670000195503235},{"id":"https://openalex.org/keywords/thermoelectric-figure-of-merit","display_name":"figure of merit ZT","score":0.8360000252723694},{"id":"https://openalex.org/keywords/waste-heat-recovery","display_name":"waste heat recovery","score":0.8140000104904175}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.9028455018997192},{"id":"https://openalex.org/C2984729377","wikidata":"https://www.wikidata.org/wiki/Q5757669","display_name":"High pressure","level":2,"score":0.8122010231018066},{"id":"https://openalex.org/C63024428","wikidata":"https://www.wikidata.org/wiki/Q552456","display_name":"Thermoelectric effect","level":2,"score":0.7541639804840088},{"id":"https://openalex.org/C57863236","wikidata":"https://www.wikidata.org/wiki/Q1130571","display_name":"Doping","level":2,"score":0.6349017024040222},{"id":"https://openalex.org/C2986710310","wikidata":"https://www.wikidata.org/wiki/Q11456","display_name":"Electronic materials","level":2,"score":0.4526798129081726},{"id":"https://openalex.org/C207365445","wikidata":"https://www.wikidata.org/wiki/Q15020929","display_name":"Thermoelectric materials","level":3,"score":0.42662298679351807},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.41064319014549255},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.34234070777893066},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2738388776779175},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.2625453770160675},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.23773163557052612},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.11829811334609985},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.08581268787384033},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.mssp.2024.108556","doi":"https://doi.org/10.1016/j.mssp.2024.108556","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.mssp.2024.108556","pdf_url":null,"source":{"id":"https://openalex.org/S82126420","display_name":"Materials Science in Semiconductor Processing","issn_l":"1369-8001","issn":["1369-8001","1873-4081"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","ki-jl-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Materials Science in Semiconductor Processing","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.5690000057220459,"id":"https://metadata.un.org/sdg/7"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":22,"referenced_works":["https://openalex.org/W2137813091","https://openalex.org/W2623231920","https://openalex.org/W3095597589","https://openalex.org/W3206282761","https://openalex.org/W3207773532","https://openalex.org/W3208967667","https://openalex.org/W4281707353","https://openalex.org/W4285076855","https://openalex.org/W4292249592","https://openalex.org/W4293005028","https://openalex.org/W4307287158","https://openalex.org/W4311625335","https://openalex.org/W4319027847","https://openalex.org/W4361210752","https://openalex.org/W4386191205","https://openalex.org/W4386688997","https://openalex.org/W4386695477","https://openalex.org/W4387900861","https://openalex.org/W4388996092","https://openalex.org/W4392382239","https://openalex.org/W4392913679","https://openalex.org/W4392926181"],"related_works":["https://openalex.org/W2075106645","https://openalex.org/W4396831152","https://openalex.org/W4281707353","https://openalex.org/W2053636234","https://openalex.org/W1559465610","https://openalex.org/W2238995478","https://openalex.org/W4390222989","https://openalex.org/W2746353343","https://openalex.org/W2554511786","https://openalex.org/W1938110338"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":3},{"year":2025,"cited_by_count":1}],"updated_date":"2026-10-14T16:39:01.820549","created_date":"2024-05-25T00:00:00"}