{"id":"https://openalex.org/W4396765367","doi":"https://doi.org/10.1117/12.3009988","title":"In-space manufacturing of morphing electronics","display_name":"In-space manufacturing of morphing electronics","publication_year":2024,"publication_date":"2024-05-09","ids":{"openalex":"https://openalex.org/W4396765367","doi":"https://doi.org/10.1117/12.3009988"},"language":"en","primary_location":{"id":"doi:10.1117/12.3009988","doi":"https://doi.org/10.1117/12.3009988","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.3009988","pdf_url":null,"source":{"id":"https://openalex.org/S7407096717","display_name":"Active and Passive Smart Structures and Integrated Systems","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Active and Passive Smart Structures and Integrated Systems XVIII","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5109714352","display_name":"Isaac Little","orcid":"https://orcid.org/0009-0001-6085-2219","observed_orcids":["https://orcid.org/0009-0001-6085-2219"]},"institutions":[{"id":"https://openalex.org/I120156002","display_name":"Boise State University","ror":"https://ror.org/02e3zdp86","country_code":"US","type":"education","lineage":["https://openalex.org/I120156002"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Isaac J. Little","raw_affiliation_strings":["Boise State Univ. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Boise State Univ. (United States)","institution_ids":["https://openalex.org/I120156002"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5066723070","display_name":"Adam Tran","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I120156002","display_name":"Boise State University","ror":"https://ror.org/02e3zdp86","country_code":"US","type":"education","lineage":["https://openalex.org/I120156002"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Adam Tran","raw_affiliation_strings":["Boise State Univ. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Boise State Univ. (United States)","institution_ids":["https://openalex.org/I120156002"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5001821618","display_name":"Zhangxian Deng","orcid":"https://orcid.org/0000-0003-1084-1738","observed_orcids":["https://orcid.org/0000-0003-1084-1738"]},"institutions":[{"id":"https://openalex.org/I120156002","display_name":"Boise State University","ror":"https://ror.org/02e3zdp86","country_code":"US","type":"education","lineage":["https://openalex.org/I120156002"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Zhangxian Deng","raw_affiliation_strings":["Boise State Univ. (United States)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Boise State Univ. (United States)","institution_ids":["https://openalex.org/I120156002"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I120156002"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.10130482,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"5","issue":null,"first_page":"60","last_page":"60"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.6348000168800354,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.6348000168800354,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11737","display_name":"Advanced Materials and Mechanics","score":0.32710000872612,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10810","display_name":"Polymer composites and self-healing","score":0.017799999564886093,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/shape-memory-polymers","display_name":"shape memory polymers","score":0.9869999885559082},{"id":"https://openalex.org/keywords/in-space-manufacturing","display_name":"space manufacturing","score":0.9010000228881836},{"id":"https://openalex.org/keywords/additive-manufacturing","display_name":"additive manufacturing","score":0.75},{"id":"https://openalex.org/keywords/material-extrusion","display_name":"material extrusion","score":0.9229999780654907},{"id":"https://openalex.org/keywords/flexible-electronics","display_name":"flexible electronics","score":0.7710000276565552},{"id":"https://openalex.org/keywords/solar-arrays","display_name":"solar arrays","score":0.8759999871253967},{"id":"https://openalex.org/keywords/stimuli-responsive-materials","display_name":"stimuli-responsive materials","score":0.7319999933242798},{"id":"https://openalex.org/keywords/recoverable-strain","display_name":"recoverable strain","score":0.8489999771118164},{"id":"https://openalex.org/keywords/glass-transition-temperature","display_name":"glass transition temperature","score":0.9869999885559082},{"id":"https://openalex.org/keywords/spacecraft-aerodynamics","display_name":"spacecraft aerodynamics","score":0.5609999895095825}],"concepts":[{"id":"https://openalex.org/C50637493","wikidata":"https://www.wikidata.org/wiki/Q1136781","display_name":"Morphing","level":2,"score":0.9075910449028015},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.5464493036270142},{"id":"https://openalex.org/C13393347","wikidata":"https://www.wikidata.org/wiki/Q8424","display_name":"Aerodynamics","level":2,"score":0.5159004926681519},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.49938011169433594},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.47388002276420593},{"id":"https://openalex.org/C185698529","wikidata":"https://www.wikidata.org/wiki/Q906777","display_name":"Shape-memory polymer","level":3,"score":0.4735516607761383},{"id":"https://openalex.org/C29829512","wikidata":"https://www.wikidata.org/wiki/Q40218","display_name":"Spacecraft","level":2,"score":0.4617284834384918},{"id":"https://openalex.org/C167740415","wikidata":"https://www.wikidata.org/wiki/Q2876213","display_name":"Aerospace","level":2,"score":0.44975394010543823},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.42609792947769165},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.41735661029815674},{"id":"https://openalex.org/C101518730","wikidata":"https://www.wikidata.org/wiki/Q930236","display_name":"Energy harvesting","level":3,"score":0.4131702780723572},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.33425700664520264},{"id":"https://openalex.org/C49097943","wikidata":"https://www.wikidata.org/wiki/Q898455","display_name":"Shape-memory alloy","level":2,"score":0.26989108324050903},{"id":"https://openalex.org/C186370098","wikidata":"https://www.wikidata.org/wiki/Q442787","display_name":"Energy (signal processing)","level":2,"score":0.18936878442764282},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1826358139514923},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.17508307099342346},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.10756832361221313},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.09329670667648315},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1117/12.3009988","doi":"https://doi.org/10.1117/12.3009988","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.3009988","pdf_url":null,"source":{"id":"https://openalex.org/S7407096717","display_name":"Active and Passive Smart Structures and Integrated Systems","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Active and Passive Smart Structures and Integrated Systems XVIII","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.651199996471405,"display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":42,"referenced_works":["https://openalex.org/W2104684050","https://openalex.org/W2123741193","https://openalex.org/W2165293299","https://openalex.org/W2181500729","https://openalex.org/W2274398118","https://openalex.org/W2336992486","https://openalex.org/W2342043377","https://openalex.org/W2438087508","https://openalex.org/W2509943880","https://openalex.org/W2660587980","https://openalex.org/W2735788939","https://openalex.org/W2790751302","https://openalex.org/W2793227423","https://openalex.org/W2901434305","https://openalex.org/W2946039829","https://openalex.org/W2965738952","https://openalex.org/W2969151196","https://openalex.org/W2973806426","https://openalex.org/W2979636671","https://openalex.org/W3009511788","https://openalex.org/W3034044789","https://openalex.org/W3046815525","https://openalex.org/W3107064670","https://openalex.org/W3116496189","https://openalex.org/W3150588129","https://openalex.org/W3203868145","https://openalex.org/W4212878793","https://openalex.org/W4233433366","https://openalex.org/W4249896608","https://openalex.org/W4250596592","https://openalex.org/W4250945007","https://openalex.org/W4287509591","https://openalex.org/W4292208777","https://openalex.org/W4307249257","https://openalex.org/W4308215370","https://openalex.org/W4312196588","https://openalex.org/W4366547491","https://openalex.org/W4376867759","https://openalex.org/W4384498136","https://openalex.org/W4386026457","https://openalex.org/W4386545319","https://openalex.org/W4387661705"],"related_works":["https://openalex.org/W4415849497","https://openalex.org/W4224213231","https://openalex.org/W4408384918","https://openalex.org/W3211178403","https://openalex.org/W7154616360","https://openalex.org/W2338363085","https://openalex.org/W4405782555","https://openalex.org/W7082449519","https://openalex.org/W7123348641","https://openalex.org/W4390398572"],"abstract_inverted_index":{"Shape":[0],"memory":[1,106],"polymers":[2],"(SMPs)":[3],"are":[4],"smart":[5],"materials":[6],"capable":[7],"of":[8,74,93,113,132,155,158,164],"\u201cremembering\u201d":[9],"and":[10,49,65,83,122,169],"reverting":[11],"to":[12,18,55,88,137,144],"a":[13,104,130],"pre-set":[14],"shape":[15,105],"upon":[16],"exposure":[17],"specific":[19],"stimuli":[20],"like":[21],"heat":[22],"or":[23,147],"light,":[24,145],"even":[25],"after":[26],"substantial":[27],"deformation.":[28],"When":[29],"combined":[30],"with":[31,70],"flexible":[32],"electronics,":[33],"SMPs":[34],"enable":[35],"innovative":[36],"morphing":[37,95,140,159],"structures":[38,134],"for":[39,172],"space":[40],"applications.":[41],"These":[42,150],"structures,":[43,96,160],"such":[44],"as":[45],"adaptive":[46],"satellite":[47],"antennas":[48],"solar":[50],"arrays,":[51],"possess":[52],"the":[53,71,90,114,118,153,162],"capability":[54],"reconfigure":[56],"themselves":[57],"dynamically,":[58],"thereby":[59],"optimizing":[60],"signal":[61],"reception,":[62],"energy":[63],"harvesting,":[64],"spacecraft":[66],"aerodynamics":[67],"in":[68,103,142],"accordance":[69],"unique":[72],"demands":[73],"each":[75],"mission.":[76],"This":[77],"research":[78],"merges":[79],"material":[80,111],"extrusion":[81],"(MEX)":[82],"fused":[84],"filament":[85],"deposition":[86],"techniques":[87],"advance":[89],"additive":[91],"manufacturing":[92,157],"SMP-based":[94,133],"which":[97],"feature":[98],"conductive":[99],"silver":[100],"traces":[101],"encased":[102],"polylactic":[107],"acid/thermoplastic":[108],"matrix.":[109],"Thermo-mechanical":[110],"properties":[112],"printed":[115],"SMP,":[116],"including":[117],"maximum":[119],"recoverable":[120],"strain":[121],"glass":[123],"transition":[124],"temperature,":[125],"were":[126,135],"first":[127],"characterized.":[128],"Subsequently,":[129],"series":[131],"prototyped":[136],"demonstrate":[138],"their":[139],"capabilities":[141],"response":[143],"thermal,":[146],"electrical":[148],"stimuli.":[149],"results":[151],"confirmed":[152],"feasibility":[154],"on-demand":[156],"reducing":[161],"constraints":[163],"Earth-based":[165],"pre-launch":[166],"design":[167],"limits":[168],"ensuring":[170],"sustainability":[171],"future":[173],"deep-space":[174],"exploration":[175],"missions.":[176]},"counts_by_year":[],"updated_date":"2026-10-29T09:56:32.521200","created_date":"2024-05-10T00:00:00"}