{"id":"https://openalex.org/W4393124995","doi":"https://doi.org/10.1016/j.microrel.2024.115372","title":"Research progress of hybrid bonding technology for three-dimensional integration","display_name":"Research progress of hybrid bonding technology for three-dimensional integration","publication_year":2024,"publication_date":"2024-03-23","ids":{"openalex":"https://openalex.org/W4393124995","doi":"https://doi.org/10.1016/j.microrel.2024.115372"},"language":"en","primary_location":{"id":"doi:10.1016/j.microrel.2024.115372","doi":"https://doi.org/10.1016/j.microrel.2024.115372","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2024.115372","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"volume":null,"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101934060","display_name":"Anqi Zhou","orcid":"https://orcid.org/0000-0001-7160-079X","observed_orcids":["https://orcid.org/0000-0001-7160-079X"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I4210165038","display_name":"University of Chinese Academy of Sciences","ror":"https://ror.org/05qbk4x57","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210165038"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Anqi Zhou","raw_affiliation_strings":["Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China","School of Integrated Circuits, University of Chinese Academy of Sciences, Beijing 100049, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"School of Integrated Circuits, University of Chinese Academy of Sciences, Beijing 100049, China","institution_ids":["https://openalex.org/I4210165038"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100433599","display_name":"Yu Zhang","orcid":"https://orcid.org/0000-0002-6738-3769","observed_orcids":["https://orcid.org/0000-0002-6738-3769"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Yu Zhang","raw_affiliation_strings":["Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004243536","display_name":"Fei Ding","orcid":"https://orcid.org/0000-0003-2923-4815","observed_orcids":["https://orcid.org/0000-0003-2923-4815","https://orcid.org/0009-0001-1618-4372"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fei Ding","raw_affiliation_strings":["Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109694875","display_name":"Ziqi Lian","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I4210165038","display_name":"University of Chinese Academy of Sciences","ror":"https://ror.org/05qbk4x57","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210165038"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ziqi Lian","raw_affiliation_strings":["Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China","School of Integrated Circuits, University of Chinese Academy of Sciences, Beijing 100049, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"School of Integrated Circuits, University of Chinese Academy of Sciences, Beijing 100049, China","institution_ids":["https://openalex.org/I4210165038"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043983912","display_name":"Renxi Jin","orcid":"https://orcid.org/0000-0003-4987-9397","observed_orcids":["https://orcid.org/0000-0003-4987-9397"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Renxi Jin","raw_affiliation_strings":["Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5016114527","display_name":"Yudong Yang","orcid":"https://orcid.org/0000-0002-7142-2249","observed_orcids":["https://orcid.org/0000-0002-7142-2249","https://orcid.org/0009-0007-9779-7376"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yudong Yang","raw_affiliation_strings":["Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101721567","display_name":"Qidong Wang","orcid":"https://orcid.org/0009-0000-0612-2672","observed_orcids":["https://orcid.org/0009-0000-0612-2672","https://orcid.org/0009-0000-4425-0472"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Qidong Wang","raw_affiliation_strings":["Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5083314215","display_name":"Liqiang Cao","orcid":"https://orcid.org/0000-0002-0859-1437","observed_orcids":["https://orcid.org/0000-0002-0859-1437"]},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Liqiang Cao","raw_affiliation_strings":["Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5100433599","https://openalex.org/A5101721567"],"corresponding_institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210119392"],"apc_list":{"value":2280,"currency":"USD","value_usd":2280},"apc_paid":null,"fwci":5.5465,"has_fulltext":false,"cited_by_count":56,"citation_normalized_percentile":{"value":0.97341758,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":95,"max":100},"biblio":{"volume":"155","issue":null,"first_page":"115372","last_page":"115372"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/hybrid-bonding","display_name":"hybrid bonding","score":0.9990000128746033},{"id":"https://openalex.org/keywords/3d-integration","display_name":"3D integration","score":0.9589999914169312},{"id":"https://openalex.org/keywords/3d-packaging","display_name":"3D packaging","score":0.9380000233650208},{"id":"https://openalex.org/keywords/bonding-equipment","display_name":"bonding equipment","score":0.734000027179718},{"id":"https://openalex.org/keywords/bonding-process","display_name":"bonding process","score":0.7279999852180481},{"id":"https://openalex.org/keywords/interconnection-density","display_name":"interconnection density","score":0.75},{"id":"https://openalex.org/keywords/low-power-consumption","display_name":"low power consumption","score":0.7279999852180481}],"concepts":[{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.38779786229133606},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.3534201383590698},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3296913504600525}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.microrel.2024.115372","doi":"https://doi.org/10.1016/j.microrel.2024.115372","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2024.115372","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":61,"referenced_works":["https://openalex.org/W1591076839","https://openalex.org/W2003049306","https://openalex.org/W2039182669","https://openalex.org/W2072368357","https://openalex.org/W2107398534","https://openalex.org/W2119047303","https://openalex.org/W2127767984","https://openalex.org/W2161765200","https://openalex.org/W2324585205","https://openalex.org/W2518432791","https://openalex.org/W2521650663","https://openalex.org/W2539577271","https://openalex.org/W2544984142","https://openalex.org/W2548389113","https://openalex.org/W2621068960","https://openalex.org/W2635202139","https://openalex.org/W2687276848","https://openalex.org/W2885839527","https://openalex.org/W2904844661","https://openalex.org/W2949396930","https://openalex.org/W2970266003","https://openalex.org/W3016212306","https://openalex.org/W3022258004","https://openalex.org/W3047887375","https://openalex.org/W3126768181","https://openalex.org/W3183240912","https://openalex.org/W3187614799","https://openalex.org/W3189605176","https://openalex.org/W3192584000","https://openalex.org/W3193028680","https://openalex.org/W3193867763","https://openalex.org/W3202865710","https://openalex.org/W4210389905","https://openalex.org/W4210650863","https://openalex.org/W4225693735","https://openalex.org/W4285021810","https://openalex.org/W4285103029","https://openalex.org/W4285103049","https://openalex.org/W4285103076","https://openalex.org/W4285103167","https://openalex.org/W4285103191","https://openalex.org/W4285103243","https://openalex.org/W4308039182","https://openalex.org/W4319586087","https://openalex.org/W4323831452","https://openalex.org/W4385825881","https://openalex.org/W6638399047","https://openalex.org/W6641577526","https://openalex.org/W6642659385","https://openalex.org/W6653525630","https://openalex.org/W6667276669","https://openalex.org/W6670294900","https://openalex.org/W6680315061","https://openalex.org/W6767534504","https://openalex.org/W6767914844","https://openalex.org/W6799481844","https://openalex.org/W6799836799","https://openalex.org/W6799924085","https://openalex.org/W6839020030","https://openalex.org/W6839695970","https://openalex.org/W6839920694"],"related_works":["https://openalex.org/W7223453667","https://openalex.org/W4391910519","https://openalex.org/W4382888889","https://openalex.org/W2151167650","https://openalex.org/W2048148374","https://openalex.org/W4378805958","https://openalex.org/W7161852426","https://openalex.org/W4408080844","https://openalex.org/W7141477315","https://openalex.org/W4400062968"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":36},{"year":2025,"cited_by_count":17},{"year":2024,"cited_by_count":3}],"updated_date":"2026-11-05T12:25:35.769452","created_date":"2024-03-24T00:00:00"}