{"id":"https://openalex.org/W4392387948","doi":"https://doi.org/10.4071/001c.94519","title":"Investigating the Impact of Final Finishes on the Insertion Loss in As Received and After Aging","display_name":"Investigating the Impact of Final Finishes on the Insertion Loss in As Received and After Aging","publication_year":2024,"publication_date":"2024-02-29","ids":{"openalex":"https://openalex.org/W4392387948","doi":"https://doi.org/10.4071/001c.94519"},"language":"en","primary_location":{"id":"doi:10.4071/001c.94519","doi":"https://doi.org/10.4071/001c.94519","is_oa":true,"landing_page_url":"http://dx.doi.org/10.4071/001c.94519","pdf_url":"https://imapsource.org/article/94519.pdf","source":{"id":"https://openalex.org/S4210197219","display_name":"IMAPSource Proceedings","issn_l":"2380-4505","issn":["2380-4505"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IMAPSource Proceedings","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://imapsource.org/article/94519.pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5059431360","display_name":"Britta Schafsteller","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4092182","display_name":"Graz University of Technology","ror":"https://ror.org/00d7xrm67","country_code":"AT","type":"education","lineage":["https://openalex.org/I4092182"]},{"id":"https://openalex.org/I4210098619","display_name":"Atotech (Germany)","ror":"https://ror.org/014cg2q58","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210098619"]},{"id":"https://openalex.org/I4210126372","display_name":"AT&S (Austria)","ror":"https://ror.org/0307rp314","country_code":"AT","type":"company","lineage":["https://openalex.org/I4210126372"]}],"countries":["AT","DE"],"is_corresponding":true,"raw_author_name":"Britta Schafsteller","raw_affiliation_strings":["Atotech Deutschland GmbH","Erich Schlaffer AT&S Leoben, Austria","Institute of Microwave and Photonic Engineering Graz University of Technology Graz, Austria","MKS instruments, Atotech Deutschland GmbH Erasmusstrasse 20 10553 Berlin, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Atotech Deutschland GmbH","institution_ids":["https://openalex.org/I4210098619"]},{"raw_affiliation_string":"Erich Schlaffer AT&S Leoben, Austria","institution_ids":["https://openalex.org/I4210126372"]},{"raw_affiliation_string":"Institute of Microwave and Photonic Engineering Graz University of Technology Graz, Austria","institution_ids":["https://openalex.org/I4092182"]},{"raw_affiliation_string":"MKS instruments, Atotech Deutschland GmbH Erasmusstrasse 20 10553 Berlin, Germany","institution_ids":["https://openalex.org/I4210098619"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5094051405","display_name":"Michael Schwaemmlein","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4092182","display_name":"Graz University of Technology","ror":"https://ror.org/00d7xrm67","country_code":"AT","type":"education","lineage":["https://openalex.org/I4092182"]},{"id":"https://openalex.org/I4210098619","display_name":"Atotech (Germany)","ror":"https://ror.org/014cg2q58","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210098619"]},{"id":"https://openalex.org/I4210126372","display_name":"AT&S (Austria)","ror":"https://ror.org/0307rp314","country_code":"AT","type":"company","lineage":["https://openalex.org/I4210126372"]}],"countries":["AT","DE"],"is_corresponding":false,"raw_author_name":"Michael Schwaemmlein","raw_affiliation_strings":["Atotech Deutschland GmbH","Erich Schlaffer AT&S Leoben, Austria","Institute of Microwave and Photonic Engineering Graz University of Technology Graz, Austria","MKS instruments, Atotech Deutschland GmbH Erasmusstrasse 20 10553 Berlin, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Atotech Deutschland GmbH","institution_ids":["https://openalex.org/I4210098619"]},{"raw_affiliation_string":"Erich Schlaffer AT&S Leoben, Austria","institution_ids":["https://openalex.org/I4210126372"]},{"raw_affiliation_string":"Institute of Microwave and Photonic Engineering Graz University of Technology Graz, Austria","institution_ids":["https://openalex.org/I4092182"]},{"raw_affiliation_string":"MKS instruments, Atotech Deutschland GmbH Erasmusstrasse 20 10553 Berlin, Germany","institution_ids":["https://openalex.org/I4210098619"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5091437558","display_name":"Mario Rosin","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4092182","display_name":"Graz University of Technology","ror":"https://ror.org/00d7xrm67","country_code":"AT","type":"education","lineage":["https://openalex.org/I4092182"]},{"id":"https://openalex.org/I4210098619","display_name":"Atotech (Germany)","ror":"https://ror.org/014cg2q58","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210098619"]},{"id":"https://openalex.org/I4210126372","display_name":"AT&S (Austria)","ror":"https://ror.org/0307rp314","country_code":"AT","type":"company","lineage":["https://openalex.org/I4210126372"]}],"countries":["AT","DE"],"is_corresponding":false,"raw_author_name":"Mario Rosin","raw_affiliation_strings":["Atotech Deutschland GmbH","Erich Schlaffer AT&S Leoben, Austria","Institute of Microwave and Photonic Engineering Graz University of Technology Graz, Austria","MKS instruments, Atotech Deutschland GmbH Erasmusstrasse 20 10553 Berlin, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Atotech Deutschland GmbH","institution_ids":["https://openalex.org/I4210098619"]},{"raw_affiliation_string":"Erich Schlaffer AT&S Leoben, Austria","institution_ids":["https://openalex.org/I4210126372"]},{"raw_affiliation_string":"Institute of Microwave and Photonic Engineering Graz University of Technology Graz, Austria","institution_ids":["https://openalex.org/I4092182"]},{"raw_affiliation_string":"MKS instruments, Atotech Deutschland GmbH Erasmusstrasse 20 10553 Berlin, Germany","institution_ids":["https://openalex.org/I4210098619"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Gustavo Ramos","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4092182","display_name":"Graz University of Technology","ror":"https://ror.org/00d7xrm67","country_code":"AT","type":"education","lineage":["https://openalex.org/I4092182"]},{"id":"https://openalex.org/I4210098619","display_name":"Atotech (Germany)","ror":"https://ror.org/014cg2q58","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210098619"]},{"id":"https://openalex.org/I4210126372","display_name":"AT&S (Austria)","ror":"https://ror.org/0307rp314","country_code":"AT","type":"company","lineage":["https://openalex.org/I4210126372"]}],"countries":["AT","DE"],"is_corresponding":false,"raw_author_name":"Gustavo Ramos","raw_affiliation_strings":["Atotech Deutschland GmbH","Erich Schlaffer AT&S Leoben, Austria","Institute of Microwave and Photonic Engineering Graz University of Technology Graz, Austria","MKS instruments, Atotech Deutschland GmbH Erasmusstrasse 20 10553 Berlin, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Atotech Deutschland GmbH","institution_ids":["https://openalex.org/I4210098619"]},{"raw_affiliation_string":"Erich Schlaffer AT&S Leoben, Austria","institution_ids":["https://openalex.org/I4210126372"]},{"raw_affiliation_string":"Institute of Microwave and Photonic Engineering Graz University of Technology Graz, Austria","institution_ids":["https://openalex.org/I4092182"]},{"raw_affiliation_string":"MKS instruments, Atotech Deutschland GmbH Erasmusstrasse 20 10553 Berlin, Germany","institution_ids":["https://openalex.org/I4210098619"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035436550","display_name":"Ziad R. Hatab","orcid":"https://orcid.org/0000-0002-5667-9150","observed_orcids":["https://orcid.org/0000-0002-5667-9150"]},"institutions":[{"id":"https://openalex.org/I4092182","display_name":"Graz University of Technology","ror":"https://ror.org/00d7xrm67","country_code":"AT","type":"education","lineage":["https://openalex.org/I4092182"]},{"id":"https://openalex.org/I4210098619","display_name":"Atotech (Germany)","ror":"https://ror.org/014cg2q58","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210098619"]},{"id":"https://openalex.org/I4210126372","display_name":"AT&S (Austria)","ror":"https://ror.org/0307rp314","country_code":"AT","type":"company","lineage":["https://openalex.org/I4210126372"]}],"countries":["AT","DE"],"is_corresponding":false,"raw_author_name":"Ziad Hatab","raw_affiliation_strings":["Graz University of Technology","Erich Schlaffer AT&S Leoben, Austria","Institute of Microwave and Photonic Engineering Graz University of Technology Graz, Austria","MKS instruments, Atotech Deutschland GmbH Erasmusstrasse 20 10553 Berlin, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Graz University of Technology","institution_ids":["https://openalex.org/I4092182"]},{"raw_affiliation_string":"Erich Schlaffer AT&S Leoben, Austria","institution_ids":["https://openalex.org/I4210126372"]},{"raw_affiliation_string":"Institute of Microwave and Photonic Engineering Graz University of Technology Graz, Austria","institution_ids":["https://openalex.org/I4092182"]},{"raw_affiliation_string":"MKS instruments, Atotech Deutschland GmbH Erasmusstrasse 20 10553 Berlin, Germany","institution_ids":["https://openalex.org/I4210098619"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075105943","display_name":"Michael Gadringer","orcid":"https://orcid.org/0000-0002-2778-5456","observed_orcids":["https://orcid.org/0000-0002-2778-5456"]},"institutions":[{"id":"https://openalex.org/I4092182","display_name":"Graz University of Technology","ror":"https://ror.org/00d7xrm67","country_code":"AT","type":"education","lineage":["https://openalex.org/I4092182"]},{"id":"https://openalex.org/I4210098619","display_name":"Atotech (Germany)","ror":"https://ror.org/014cg2q58","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210098619"]},{"id":"https://openalex.org/I4210126372","display_name":"AT&S (Austria)","ror":"https://ror.org/0307rp314","country_code":"AT","type":"company","lineage":["https://openalex.org/I4210126372"]}],"countries":["AT","DE"],"is_corresponding":false,"raw_author_name":"Michael E. Gadringer","raw_affiliation_strings":["Graz University of Technology","Erich Schlaffer AT&S Leoben, Austria","Institute of Microwave and Photonic Engineering Graz University of Technology Graz, Austria","MKS instruments, Atotech Deutschland GmbH Erasmusstrasse 20 10553 Berlin, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Graz University of Technology","institution_ids":["https://openalex.org/I4092182"]},{"raw_affiliation_string":"Erich Schlaffer AT&S Leoben, Austria","institution_ids":["https://openalex.org/I4210126372"]},{"raw_affiliation_string":"Institute of Microwave and Photonic Engineering Graz University of Technology Graz, Austria","institution_ids":["https://openalex.org/I4092182"]},{"raw_affiliation_string":"MKS instruments, Atotech Deutschland GmbH Erasmusstrasse 20 10553 Berlin, Germany","institution_ids":["https://openalex.org/I4210098619"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5063286375","display_name":"Erich Schlaffer","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4210126372","display_name":"AT&S (Austria)","ror":"https://ror.org/0307rp314","country_code":"AT","type":"company","lineage":["https://openalex.org/I4210126372"]}],"countries":["AT"],"is_corresponding":false,"raw_author_name":"Erich Schlaffer","raw_affiliation_strings":["AT&S (Austria)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"AT&S (Austria)","institution_ids":["https://openalex.org/I4210126372"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5059431360"],"corresponding_institution_ids":["https://openalex.org/I4092182","https://openalex.org/I4210098619","https://openalex.org/I4210126372"],"apc_list":null,"apc_paid":null,"fwci":0.1971,"has_fulltext":true,"cited_by_count":2,"citation_normalized_percentile":{"value":0.34421191,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":95},"biblio":{"volume":"2023","issue":"Symposium","first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9951000213623047,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9951000213623047,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.0032999999821186066,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.0005000000237487257,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/printed-circuit-board-surface-finish","display_name":"printed circuit board surface finish","score":0.8679999709129333},{"id":"https://openalex.org/keywords/insertion-loss","display_name":"insertion loss","score":0.9459999799728394},{"id":"https://openalex.org/keywords/thermal-aging","display_name":"thermal aging","score":0.8360000252723694},{"id":"https://openalex.org/keywords/immersion-tin","display_name":"immersion tin","score":0.902999997138977},{"id":"https://openalex.org/keywords/immersion-silver","display_name":"immersion silver","score":0.9990000128746033},{"id":"https://openalex.org/keywords/electroless-nickel-immersion-gold","display_name":"electroless nickel immersion gold","score":0.7960000038146973},{"id":"https://openalex.org/keywords/enepig","display_name":"ENEPIG","score":0.9079999923706055},{"id":"https://openalex.org/keywords/solderability","display_name":"solderability","score":0.7720000147819519},{"id":"https://openalex.org/keywords/bondability","display_name":"bondability","score":0.5509999990463257},{"id":"https://openalex.org/keywords/solder-joint-reliability","display_name":"solder joint reliability","score":0.7590000033378601},{"id":"https://openalex.org/keywords/corrosion-resistance","display_name":"corrosion resistance","score":0.9769999980926514}],"concepts":[{"id":"https://openalex.org/C2778115343","wikidata":"https://www.wikidata.org/wiki/Q7557224","display_name":"Solderability","level":3,"score":0.8387541770935059},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7620939016342163},{"id":"https://openalex.org/C71039073","wikidata":"https://www.wikidata.org/wiki/Q3439090","display_name":"Surface finish","level":2,"score":0.5919010639190674},{"id":"https://openalex.org/C199068039","wikidata":"https://www.wikidata.org/wiki/Q574523","display_name":"Immersion (mathematics)","level":2,"score":0.5640677213668823},{"id":"https://openalex.org/C107365816","wikidata":"https://www.wikidata.org/wiki/Q114817","display_name":"Surface roughness","level":2,"score":0.5207338333129883},{"id":"https://openalex.org/C502130503","wikidata":"https://www.wikidata.org/wiki/Q1089","display_name":"Palladium","level":3,"score":0.5190328359603882},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.5172565579414368},{"id":"https://openalex.org/C525849907","wikidata":"https://www.wikidata.org/wiki/Q1096","display_name":"Tin","level":2,"score":0.5165776014328003},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.5148531794548035},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.4914003610610962},{"id":"https://openalex.org/C2777879630","wikidata":"https://www.wikidata.org/wiki/Q2009662","display_name":"Surface finishing","level":2,"score":0.4268072843551636},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.2992665767669678},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.08605694770812988},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.08542114496231079},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C161790260","wikidata":"https://www.wikidata.org/wiki/Q82264","display_name":"Catalysis","level":2,"score":0.0},{"id":"https://openalex.org/C55493867","wikidata":"https://www.wikidata.org/wiki/Q7094","display_name":"Biochemistry","level":1,"score":0.0},{"id":"https://openalex.org/C202444582","wikidata":"https://www.wikidata.org/wiki/Q837863","display_name":"Pure mathematics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.4071/001c.94519","doi":"https://doi.org/10.4071/001c.94519","is_oa":true,"landing_page_url":"http://dx.doi.org/10.4071/001c.94519","pdf_url":"https://imapsource.org/article/94519.pdf","source":{"id":"https://openalex.org/S4210197219","display_name":"IMAPSource Proceedings","issn_l":"2380-4505","issn":["2380-4505"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IMAPSource Proceedings","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.4071/001c.94519","doi":"https://doi.org/10.4071/001c.94519","is_oa":true,"landing_page_url":"http://dx.doi.org/10.4071/001c.94519","pdf_url":"https://imapsource.org/article/94519.pdf","source":{"id":"https://openalex.org/S4210197219","display_name":"IMAPSource Proceedings","issn_l":"2380-4505","issn":["2380-4505"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":"https://openalex.org/P4365380702","host_organization_name":"International Microelectronics Assembly and Packaging Society","host_organization_lineage":["https://openalex.org/P4365380702"],"host_organization_lineage_names":["International Microelectronics Assembly and Packaging Society"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IMAPSource Proceedings","raw_type":"journal-article"},"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4392387948.pdf","grobid_xml":"https://content.openalex.org/works/W4392387948.grobid-xml"},"referenced_works_count":6,"referenced_works":["https://openalex.org/W2104571089","https://openalex.org/W2155230688","https://openalex.org/W2474081254","https://openalex.org/W4242003204","https://openalex.org/W4289827273","https://openalex.org/W4317555564"],"related_works":["https://openalex.org/W4416876380","https://openalex.org/W4392361372","https://openalex.org/W7098101848","https://openalex.org/W2548471226","https://openalex.org/W2055443135","https://openalex.org/W4416876123","https://openalex.org/W2622391682","https://openalex.org/W4416880805","https://openalex.org/W2986248228","https://openalex.org/W7212035089"],"abstract_inverted_index":{"The":[0,57,188,213],"task":[1],"of":[2,42,47,87,137,142,225],"the":[3,7,14,19,26,35,38,45,48,54,68,77,83,92,125,135,143,191,199,210,216,226,238],"final":[4,49,144,201,228],"finish":[5,50,145],"on":[6,37,59,91,114],"printed":[8],"circuit":[9],"board":[10],"is":[11,51],"to":[12,64,73,122,131,222,236],"protect":[13],"copper":[15],"surface":[16,107],"and":[17,61,67,89,134,178,182,233],"at":[18,117,203],"same":[20],"time":[21],"keep":[22],"it":[23],"active":[24],"for":[25,193,198,241],"subsequent":[27],"assembly":[28,234],"steps.":[29],"In":[30,103,120],"high":[31,80,118,177,242],"frequency":[32,81,126,197,243],"applications,":[33],"additionally":[34],"impact":[36,136],"signal":[39,84],"loss":[40,116,195,218],"becomes":[41,86],"interest.":[43],"Typically,":[44],"choice":[46],"defined":[52],"by":[53],"target":[55],"application.":[56],"demands":[58],"solderability":[60],"bondability":[62],"need":[63],"be":[65,74],"considered":[66],"acceptable":[69],"price":[70],"level":[71],"needs":[72],"defined.":[75],"For":[76],"use":[78],"in":[79,209,215],"applications":[82],"integrity":[85],"interest":[88],"adds":[90],"reliability":[93,99,232],"criteria":[94],"such":[95,230],"as":[96,206,231],"solder":[97],"joint":[98],"or":[100,139],"corrosion":[101],"resistance.":[102],"this":[104],"study":[105],"various":[106],"finishes":[108,151,202,229],"were":[109],"tested":[110],"towards":[111],"their":[112],"performance":[113,219,235],"insertion":[115,194,217],"frequency.":[119],"contrast":[121],"earlier":[123],"studies":[124],"range":[127],"was":[128,146],"investigated":[129],"up":[130],"150":[132],"GHz":[133],"thermal":[138],"humid":[140],"aging":[141],"evaluated.":[147],"Overall,":[148],"seven":[149],"different":[150,200,227],"have":[152],"been":[153],"selected":[154],"including":[155],"EPAG":[156],"(Electroless":[157,173,184],"palladium/Autocatalytic":[158],"gold),":[159,169],"I-Sn":[160],"(Immersion":[161],"tin),":[162],"I-Ag":[163],"(immersion":[164],"silver),":[165],"DIG":[166],"(direct":[167],"immersion":[168],"Au/Pd/Au":[170],"(Gold/Palladium/Gold),":[171],"ENIG":[172],"Nickel/Immersion":[174],"Gold)":[175],"with":[176],"medium":[179],"phosphorous":[180],"Nickel":[181],"ENEPIG":[183],"Nickel/Electroless":[185],"Palladium/Immersion":[186],"Gold).":[187],"paper":[189],"compiles":[190],"data":[192],"versus":[196],"layer":[204],"thicknesses":[205],"commonly":[207],"used":[208],"PCB":[211],"industry.":[212],"results":[214],"are":[220],"correlated":[221],"other":[223],"properties":[224],"identify":[237],"best":[239],"candidates":[240],"applications.":[244]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2024,"cited_by_count":1}],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2024-03-05T00:00:00"}