{"id":"https://openalex.org/W4390836723","doi":"https://doi.org/10.1109/access.2024.3351940","title":"Low Loss Hybrid-Plane PCB Structure for Improving Signal Quality in High-Speed Signal Transmission","display_name":"Low Loss Hybrid-Plane PCB Structure for Improving Signal Quality in High-Speed Signal Transmission","publication_year":2024,"publication_date":"2024-01-01","ids":{"openalex":"https://openalex.org/W4390836723","doi":"https://doi.org/10.1109/access.2024.3351940"},"language":"en","primary_location":{"id":"doi:10.1109/access.2024.3351940","doi":"https://doi.org/10.1109/access.2024.3351940","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2024.3351940","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10385078.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"listed_in":["anvur-scientific","cwts-core","doaj","jufo-1","ki-jl-1","norway-1","oarl","poland-100","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by-nc-nd","license_id":"https://openalex.org/licenses/cc-by-nc-nd","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"parent_works":[],"lineage":["https://openalex.org/W4390836723"],"child_works_count":0,"type":"article","is_traditional":true,"indexed_in":["crossref","doaj"],"open_access":{"is_oa":true,"oa_status":"gold","oa_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10385078.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5089469093","display_name":"Jeonghyeon Choi","orcid":"https://orcid.org/0009-0006-9739-0392","observed_orcids":["https://orcid.org/0009-0006-9739-0392"]},"institutions":[{"id":"https://openalex.org/I89440247","display_name":"Myongji University","ror":"https://ror.org/00s9dpb54","country_code":"KR","type":"education","lineage":["https://openalex.org/I89440247"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jeonghyeon Choi","raw_affiliation_strings":["Department of Semiconductor Engineering, Myongji University, Yongin-si, Republic of Korea"],"raw_orcid":"https://orcid.org/0009-0006-9739-0392","affiliations":[{"raw_affiliation_string":"Department of Semiconductor Engineering, Myongji University, Yongin-si, Republic of Korea","institution_ids":["https://openalex.org/I89440247"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5029578836","display_name":"Youbean Kim","orcid":"https://orcid.org/0009-0008-3317-9859","observed_orcids":["https://orcid.org/0009-0008-3317-9859"]},"institutions":[{"id":"https://openalex.org/I89440247","display_name":"Myongji University","ror":"https://ror.org/00s9dpb54","country_code":"KR","type":"education","lineage":["https://openalex.org/I89440247"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Youbean Kim","raw_affiliation_strings":["Department of Semiconductor Engineering, Myongji University, Yongin-si, Republic of Korea"],"raw_orcid":"https://orcid.org/0009-0008-3317-9859","affiliations":[{"raw_affiliation_string":"Department of Semiconductor Engineering, Myongji University, Yongin-si, Republic of Korea","institution_ids":["https://openalex.org/I89440247"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I89440247"],"apc_list":{"value":1995,"currency":"USD","value_usd":1995},"apc_paid":{"value":1995,"currency":"USD","value_usd":1995},"fwci":1.5229,"has_fulltext":true,"cited_by_count":16,"citation_normalized_percentile":{"value":0.81096917,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":93,"max":99},"biblio":{"volume":"12","issue":null,"first_page":"6413","last_page":"6422"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9702000021934509,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9702000021934509,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.019700000062584877,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.002300000051036477,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/low-loss-dielectrics","display_name":"low-loss dielectrics","score":0.7829999923706055},{"id":"https://openalex.org/keywords/high-speed-signal-transmission","display_name":"high-speed signal transmission","score":0.8349999785423279},{"id":"https://openalex.org/keywords/signal-integrity","display_name":"signal integrity","score":0.906000018119812},{"id":"https://openalex.org/keywords/dielectric-loss","display_name":"dielectric loss","score":0.7160000205039978},{"id":"https://openalex.org/keywords/fr4","display_name":"FR4","score":0.9160000085830688},{"id":"https://openalex.org/keywords/s-parameters","display_name":"S-parameters","score":0.7559999823570251},{"id":"https://openalex.org/keywords/eye-diagram","display_name":"eye diagram","score":0.9950000047683716},{"id":"https://openalex.org/keywords/printed-circuit-board-design","display_name":"printed circuit board design","score":0.5320000052452087}],"concepts":[{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.6348586082458496},{"id":"https://openalex.org/C761482","wikidata":"https://www.wikidata.org/wiki/Q118093","display_name":"Transmission (telecommunications)","level":2,"score":0.5512332916259766},{"id":"https://openalex.org/C2779530757","wikidata":"https://www.wikidata.org/wiki/Q1207505","display_name":"Quality (philosophy)","level":2,"score":0.49495476484298706},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4892852008342743},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4467396140098572},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.20525327324867249},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.13245943188667297},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.12642565369606018},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/access.2024.3351940","doi":"https://doi.org/10.1109/access.2024.3351940","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2024.3351940","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10385078.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"listed_in":["anvur-scientific","cwts-core","doaj","jufo-1","ki-jl-1","norway-1","oarl","poland-100","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by-nc-nd","license_id":"https://openalex.org/licenses/cc-by-nc-nd","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:e0449b6fe24e46caa1d71b3fc57b54fd","doi":null,"is_oa":true,"landing_page_url":"https://doaj.org/article/e0449b6fe24e46caa1d71b3fc57b54fd","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE Access, Vol 12, Pp 6413-6422 (2024)","raw_type":"article"}],"best_oa_location":{"id":"doi:10.1109/access.2024.3351940","doi":"https://doi.org/10.1109/access.2024.3351940","is_oa":true,"landing_page_url":"https://doi.org/10.1109/access.2024.3351940","pdf_url":"https://ieeexplore.ieee.org/ielx7/6287639/6514899/10385078.pdf","source":{"id":"https://openalex.org/S2485537415","display_name":"IEEE Access","issn_l":"2169-3536","issn":["2169-3536"],"is_oa":true,"is_in_doaj":true,"is_core":true,"listed_in":["anvur-scientific","cwts-core","doaj","jufo-1","ki-jl-1","norway-1","oarl","poland-100","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by-nc-nd","license_id":"https://openalex.org/licenses/cc-by-nc-nd","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Access","raw_type":"journal-article"},"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.5378999710083008}],"study_designs":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320321279","display_name":"Myongji University","ror":"https://ror.org/00s9dpb54"},{"id":"https://openalex.org/F4320322064","display_name":"Korea Institute for Advancement of Technology","ror":"https://ror.org/015w1qa96"},{"id":"https://openalex.org/F4320332195","display_name":"Samsung","ror":"https://ror.org/04w3jy968"}],"has_content":{"pdf":true,"grobid_xml":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4390836723.pdf","grobid_xml":"https://content.openalex.org/works/W4390836723.grobid-xml"},"referenced_works_count":20,"referenced_works":["https://openalex.org/W1549156645","https://openalex.org/W1556177135","https://openalex.org/W1969066593","https://openalex.org/W1974428459","https://openalex.org/W2016741792","https://openalex.org/W2026355783","https://openalex.org/W2029517690","https://openalex.org/W2060129489","https://openalex.org/W2072698610","https://openalex.org/W2081438330","https://openalex.org/W2083481314","https://openalex.org/W2109247713","https://openalex.org/W2112283532","https://openalex.org/W2139977703","https://openalex.org/W2149543178","https://openalex.org/W2538371015","https://openalex.org/W2539819189","https://openalex.org/W2965410099","https://openalex.org/W2980646915","https://openalex.org/W3047921247"],"related_works":["https://openalex.org/W2029517690","https://openalex.org/W2081438330","https://openalex.org/W7130378835","https://openalex.org/W2787465275","https://openalex.org/W2946542895","https://openalex.org/W1969066593","https://openalex.org/W2505980921","https://openalex.org/W2367384105","https://openalex.org/W7097764087","https://openalex.org/W2147896931"],"abstract_inverted_index":{"Due":[0],"to":[1,36,62,70,86,127,148,169,193,199,216],"the":[2,10,18,32,52,87,124,132,182,218,222,227,232],"inherent":[3],"loss":[4,80,93,119,137,211,224],"characteristics":[5,173,197],"of":[6,90,134,221],"transmission":[7,14,27],"lines":[8,28],"today,":[9],"challenges":[11],"in":[12,26,39,101,107,123,144,187],"signal":[13,129,145,175,233],"are":[15,56],"increasing.":[16],"Typically,":[17],"most":[19],"widely":[20],"used":[21],"Printed":[22],"Circuit":[23],"Boards":[24],"(PCBs)":[25],"employ":[29],"FR-4":[30,50,205],"as":[31],"insulation":[33,41,54,206],"material":[34],"due":[35,61,85],"its":[37],"advantages":[38],"electrical":[40,172,196],"and":[42,103,160,162,174],"cost-effectiveness.":[43],"Nevertheless,":[44],"PCBs":[45,76,200],"that":[46,77,116,181],"rely":[47],"solely":[48,202],"on":[49,231],"for":[51,58,167,226],"entire":[53],"layer":[55],"unsuitable":[57],"high-speed":[59,104,128],"circuits":[60],"significant":[63],"dielectric":[64,81,94,120,138,212,225],"losses.":[65],"Efforts":[66],"have":[67,97],"been":[68,99,191],"made":[69],"reduce":[71],"losses":[72],"by":[73],"researching":[74],"hybrid-stackup":[75,151],"stack":[78],"low":[79,92,118,136,210,223],"materials":[82,121,139],"vertically.":[83],"However,":[84],"high":[88],"cost":[89],"these":[91],"materials,":[95],"they":[96],"mainly":[98],"applied":[100],"high-end":[102],"applications.":[105],"Therefore,":[106],"this":[108,188],"paper,":[109],"we":[110],"propose":[111],"a":[112],"hybrid-plane":[113,184,228],"PCB":[114,153,185],"structure":[115,186],"uses":[117],"only":[122],"planes":[125],"adjacent":[126],"traces,":[130],"minimizing":[131],"use":[133],"expensive":[135],"while":[140],"achieving":[141],"similar":[142],"enhancements":[143],"quality":[146],"compared":[147,198,215],"previously":[149],"researched":[150],"Each":[152],"was":[154],"modeled":[155],"using":[156],"Ansys":[157],"Q2D":[158],"Extractor,":[159],"S-parameters":[161],"eye":[163],"diagrams":[164],"were":[165,214],"extracted":[166],"each":[168],"compare":[170],"their":[171],"quality.":[176],"The":[177],"simulation":[178],"results":[179],"confirm":[180],"proposed":[183],"paper":[189],"has":[190],"found":[192],"exhibit":[194],"improved":[195],"constructed":[201],"with":[203],"an":[204],"layer.":[207],"Furthermore,":[208],"various":[209],"thicknesses":[213],"interpret":[217],"optimal":[219],"thickness":[220],"PCB,":[229],"based":[230],"integrity":[234],"assurance":[235],"rate.":[236]},"counts_by_year":[{"year":2026,"cited_by_count":6},{"year":2025,"cited_by_count":8},{"year":2024,"cited_by_count":2}],"updated_date":"2026-11-05T12:25:35.769452","created_date":"2024-01-13T00:00:00"}