{"id":"https://openalex.org/W4388016752","doi":"https://doi.org/10.5104/jiep.jiep-d-23-00072","title":"Atomic Diffusion Bonding of Wafers in Air Using Ag-3at%Cu Films","display_name":"Atomic Diffusion Bonding of Wafers in Air Using Ag-3at%Cu Films","publication_year":2023,"publication_date":"2023-10-30","ids":{"openalex":"https://openalex.org/W4388016752","doi":"https://doi.org/10.5104/jiep.jiep-d-23-00072"},"language":"en","primary_location":{"id":"doi:10.5104/jiep.jiep-d-23-00072","doi":"https://doi.org/10.5104/jiep.jiep-d-23-00072","is_oa":false,"landing_page_url":"https://doi.org/10.5104/jiep.jiep-d-23-00072","pdf_url":null,"source":{"id":"https://openalex.org/S66058762","display_name":"Journal of The Japan Institute of Electronics Packaging","issn_l":"1343-9677","issn":["1343-9677","1884-121X"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["poland-20","russia-white-list-4"],"host_organization":"https://openalex.org/P4324113819","host_organization_name":"Japan Institute of Electronics Packaging","host_organization_lineage":["https://openalex.org/P4324113819"],"host_organization_lineage_names":["Japan Institute of Electronics Packaging"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of The Japan Institute of Electronics Packaging","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5061949224","display_name":"Yuki Watabe","orcid":"https://orcid.org/0000-0002-3863-5429","observed_orcids":["https://orcid.org/0000-0002-3863-5429"]},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]},{"id":"https://openalex.org/I4405269153","display_name":"Frontier Research Institute for Interdisciplinary Sciences, Tohoku University","ror":"https://ror.org/0388qbr12","country_code":"JP","type":"facility","lineage":["https://openalex.org/I4405269153"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yuki Watabe","raw_affiliation_strings":["Department of Electronic Engineering, Graduate School of Engineering, Tohoku University","Frontier Research Institute for Interdisciplinary Sciences (FRIS), Tohoku University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electronic Engineering, Graduate School of Engineering, Tohoku University","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Frontier Research Institute for Interdisciplinary Sciences (FRIS), Tohoku University","institution_ids":["https://openalex.org/I201537933","https://openalex.org/I4405269153"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068116967","display_name":"Miyuki Uomoto","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]},{"id":"https://openalex.org/I4405269153","display_name":"Frontier Research Institute for Interdisciplinary Sciences, Tohoku University","ror":"https://ror.org/0388qbr12","country_code":"JP","type":"facility","lineage":["https://openalex.org/I4405269153"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Miyuki Uomoto","raw_affiliation_strings":["Frontier Research Institute for Interdisciplinary Sciences (FRIS), Tohoku University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Frontier Research Institute for Interdisciplinary Sciences (FRIS), Tohoku University","institution_ids":["https://openalex.org/I201537933","https://openalex.org/I4405269153"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5015516189","display_name":"T. Shimatsu","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]},{"id":"https://openalex.org/I4405269153","display_name":"Frontier Research Institute for Interdisciplinary Sciences, Tohoku University","ror":"https://ror.org/0388qbr12","country_code":"JP","type":"facility","lineage":["https://openalex.org/I4405269153"]},{"id":"https://openalex.org/I4405285984","display_name":"Research Institute of Electrical Communication, Tohoku University","ror":"https://ror.org/00vbrys56","country_code":"JP","type":"facility","lineage":["https://openalex.org/I201537933","https://openalex.org/I4405285984"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takehito Shimatsu","raw_affiliation_strings":["Frontier Research Institute for Interdisciplinary Sciences (FRIS), Tohoku University","Research Institute of Electrical Communication (RIEC), Tohoku University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Frontier Research Institute for Interdisciplinary Sciences (FRIS), Tohoku University","institution_ids":["https://openalex.org/I201537933","https://openalex.org/I4405269153"]},{"raw_affiliation_string":"Research Institute of Electrical Communication (RIEC), Tohoku University","institution_ids":["https://openalex.org/I201537933","https://openalex.org/I4405285984"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"27","issue":"1","first_page":"143","last_page":"149"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.7080000042915344,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.7080000042915344,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.2551000118255615,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10723","display_name":"Advanced Welding Techniques Analysis","score":0.01850000023841858,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/atomic-diffusion-bonding","display_name":"atomic diffusion bonding","score":0.9850000143051147},{"id":"https://openalex.org/keywords/wafer-bonding","display_name":"wafer bonding","score":0.796999990940094},{"id":"https://openalex.org/keywords/thin-silver-films","display_name":"silver thin films","score":0.8069999814033508},{"id":"https://openalex.org/keywords/annealing","display_name":"annealing","score":0.49799999594688416},{"id":"https://openalex.org/keywords/copper-precipitation","display_name":"copper precipitation","score":0.7540000081062317}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.781186580657959},{"id":"https://openalex.org/C69357855","wikidata":"https://www.wikidata.org/wiki/Q163214","display_name":"Diffusion","level":2,"score":0.6144269704818726},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5719020366668701},{"id":"https://openalex.org/C2779133538","wikidata":"https://www.wikidata.org/wiki/Q677010","display_name":"Wafer bonding","level":3,"score":0.561671257019043},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2728409767150879},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.10301235318183899},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.06734392046928406}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.5104/jiep.jiep-d-23-00072","doi":"https://doi.org/10.5104/jiep.jiep-d-23-00072","is_oa":false,"landing_page_url":"https://doi.org/10.5104/jiep.jiep-d-23-00072","pdf_url":null,"source":{"id":"https://openalex.org/S66058762","display_name":"Journal of The Japan Institute of Electronics Packaging","issn_l":"1343-9677","issn":["1343-9677","1884-121X"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":["poland-20","russia-white-list-4"],"host_organization":"https://openalex.org/P4324113819","host_organization_name":"Japan Institute of Electronics Packaging","host_organization_lineage":["https://openalex.org/P4324113819"],"host_organization_lineage_names":["Japan Institute of Electronics Packaging"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Journal of The Japan Institute of Electronics Packaging","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W1964958541","https://openalex.org/W1991442473","https://openalex.org/W1999986279","https://openalex.org/W2057592630","https://openalex.org/W2064820918","https://openalex.org/W2084435929","https://openalex.org/W2315390327","https://openalex.org/W2981252446","https://openalex.org/W3213683729","https://openalex.org/W4293087068"],"related_works":["https://openalex.org/W2315390327","https://openalex.org/W3197666957","https://openalex.org/W3213683729","https://openalex.org/W1985632224","https://openalex.org/W3040785249","https://openalex.org/W2074810512","https://openalex.org/W1976646239","https://openalex.org/W3164125166","https://openalex.org/W3206968767","https://openalex.org/W2322472404"],"abstract_inverted_index":{"Ag-3":[0],"at%Cu\u5408\u91d1\u819c\u3092\u7528\u3044\u305f\u5927\u6c17\u4e2d\u306e\u539f\u5b50\u62e1\u6563\u63a5\u5408\u6cd5\u306b\u3088\u308b\u30a6\u30a8\u30cf\u306e\u63a5\u5408\u6027\u3092\u8a55\u4fa1\u3057\u305f\u3002\u63a5\u5408\u304c\u4f1d\u64ad\u3059\u308b\u6700\u9577\u306e\u5927\u6c17\u66b4\u9732\u6642\u9593texp\u306f\uff0cAg\u8584\u819c\u306e\u5834\u5408\u306f\u7d04500":[1],"s\u3068\u77ed\u3044\u304c\uff0cAg-Cu\u819c\u3067\u306f2.6":[2],"\u00d7":[3,11,18],"105":[4,19],"s":[5,13],"(72":[6],"h)\u307e\u3067\u5897\u52a0\u3057\u305f\u3002\u5ba4\u6e29\u63a5\u5408\u5f8c\u306e\u63a5\u5408\u754c\u9762\u306e\u8868\u9762\u81ea\u7531\u30a8\u30cd\u30eb\u30ae\u306f0.1":[7],"J/m2\u4ee5\u4e0b\u3068\u5c0f\u3055\u3044\u304c\uff0ctexp":[8],"=":[9,16],"1":[10],"104":[12],"(3":[14],"h)\u4ee5\u4e0b\u306e\u63a5\u5408\u3067\u306f100\u00b0C\u306e\u71b1\u51e6\u7406\u306b\u3088\u308a\uff0c\u307e\u305f\uff0ctexp":[15],"2.6":[17],"s\u4ee5\u4e0b\u3067\u306f150\u00b0C\u306e\u71b1\u51e6\u7406\u306b\u3088\u308a\uff0c\u3044\u305a\u308c\u3082\u5f37\u56fa\u306a\u63a5\u5408\u304c\u5f97\u3089\u308c\u305f\u3002\u6210\u819c\u6642\u306bCu\u304c\u819c\u8868\u9762\u306b\u6790\u51fa\u3059\u308b\u3053\u3068\u3067Ag\u306e\u51dd\u96c6\u304c\u6291\u5236\u3055\u308c\uff0c\u5927\u6c17\u66b4\u9732\u6642\u9593\u306b\u5bfe\u3059\u308b\u63a5\u5408\u6027\u80fd\u304c\u5411\u4e0a\u3057\u305f\u3082\u306e\u3068\u8003\u3048\u3089\u308c\u308b\u3002":[20]},"counts_by_year":[],"updated_date":"2026-10-24T09:50:30.924529","created_date":"2023-11-01T00:00:00"}