{"id":"https://openalex.org/W4387239145","doi":null,"title":"Manufacturing technology for flexible thermoresistors on polyimide base","display_name":"Manufacturing technology for flexible thermoresistors on polyimide base","publication_year":2013,"publication_date":"2013-02-01","ids":{"openalex":"https://openalex.org/W4387239145"},"language":"en","primary_location":{"id":"pmh:oai:doaj.org/article:ebfc663b3bc64a1bbbeedee309c690b9","doi":null,"is_oa":false,"landing_page_url":"https://doaj.org/article/ebfc663b3bc64a1bbbeedee309c690b9","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"\u0422\u0435\u0445\u043d\u043e\u043b\u043e\u0433\u0456\u044f \u0442\u0430 \u043a\u043e\u043d\u0441\u0442\u0440\u0443\u044e\u0432\u0430\u043d\u043d\u044f \u0432 \u0435\u043b\u0435\u043a\u0442\u0440\u043e\u043d\u043d\u0456\u0439 \u0430\u043f\u0430\u0440\u0430\u0442\u0443\u0440\u0456, Iss 1, Pp 38-41 (2013)","raw_type":"article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["doaj"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://doaj.org/article/f98dcc7ba97d45cdaa0c5d7a1c243ce4","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5114087009","display_name":"D. A. Dinev","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"D. A. Dinev","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037913499","display_name":"V. D. Zhora","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"V. D. Zhora","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036311517","display_name":"N.N. Grigoryeva","orcid":"https://orcid.org/0009-0000-4318-6173","observed_orcids":["https://orcid.org/0009-0000-4318-6173"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"N. N. Grigoryeva","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"last","author":{"id":"https://openalex.org/A5012371580","display_name":"V. P. Grunyanskaya","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"V. P. Grunyanskaya","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T13928","display_name":"Advanced Sensor Technologies Research","score":0.7660999894142151,"subfield":{"id":"https://openalex.org/subfields/3105","display_name":"Instrumentation"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T13928","display_name":"Advanced Sensor Technologies Research","score":0.7660999894142151,"subfield":{"id":"https://openalex.org/subfields/3105","display_name":"Instrumentation"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","score":0.20800000429153442,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12084","display_name":"Synthesis and properties of polymers","score":0.004399999976158142,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/polyimide-films","display_name":"polyimide films","score":0.9440000057220459},{"id":"https://openalex.org/keywords/temperature-sensors","display_name":"temperature sensors","score":0.9200000166893005},{"id":"https://openalex.org/keywords/thermal-contact","display_name":"thermal contact","score":0.7110000252723694},{"id":"https://openalex.org/keywords/manufacturing-technology","display_name":"manufacturing technology","score":0.6589999794960022},{"id":"https://openalex.org/keywords/fast-response","display_name":"fast response","score":0.46000000834465027}],"concepts":[{"id":"https://openalex.org/C2780965675","wikidata":"https://www.wikidata.org/wiki/Q145958","display_name":"Polyimide","level":3,"score":0.8623270988464355},{"id":"https://openalex.org/C42058472","wikidata":"https://www.wikidata.org/wiki/Q810214","display_name":"Base (topology)","level":2,"score":0.5477818250656128},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.4845406115055084},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.38574790954589844},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.35576507449150085},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.31539425253868103},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.2601326107978821},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.10834407806396484},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.04768291115760803},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"pmh:oai:doaj.org/article:ebfc663b3bc64a1bbbeedee309c690b9","doi":null,"is_oa":false,"landing_page_url":"https://doaj.org/article/ebfc663b3bc64a1bbbeedee309c690b9","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"\u0422\u0435\u0445\u043d\u043e\u043b\u043e\u0433\u0456\u044f \u0442\u0430 \u043a\u043e\u043d\u0441\u0442\u0440\u0443\u044e\u0432\u0430\u043d\u043d\u044f \u0432 \u0435\u043b\u0435\u043a\u0442\u0440\u043e\u043d\u043d\u0456\u0439 \u0430\u043f\u0430\u0440\u0430\u0442\u0443\u0440\u0456, Iss 1, Pp 38-41 (2013)","raw_type":"article"},{"id":"pmh:oai:doaj.org/article:f98dcc7ba97d45cdaa0c5d7a1c243ce4","doi":null,"is_oa":true,"landing_page_url":"https://doaj.org/article/f98dcc7ba97d45cdaa0c5d7a1c243ce4","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, Iss 1, Pp 38-41 (2013)","raw_type":"article"}],"best_oa_location":{"id":"pmh:oai:doaj.org/article:f98dcc7ba97d45cdaa0c5d7a1c243ce4","doi":null,"is_oa":true,"landing_page_url":"https://doaj.org/article/f98dcc7ba97d45cdaa0c5d7a1c243ce4","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, Iss 1, Pp 38-41 (2013)","raw_type":"article"},"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W7217057854","https://openalex.org/W7125897557","https://openalex.org/W1982972954","https://openalex.org/W2078815509","https://openalex.org/W2354964253","https://openalex.org/W3123908951","https://openalex.org/W2068130614","https://openalex.org/W2763840431","https://openalex.org/W3110929259","https://openalex.org/W2955622781"],"abstract_inverted_index":{"The":[0],"article":[1],"proposes":[2],"the":[3,30],"manufacturing":[4],"technology":[5],"for":[6],"flexible":[7],"thermoresistors":[8],"on":[9],"polyimide":[10],"film":[11],"and":[12,42],"analyzes":[13],"their":[14],"advantages":[15],"in":[16],"relation":[17],"to":[18,44],"other":[19],"temperature":[20],"sensors.":[21],"Such":[22],"heating":[23],"elements":[24],"provide":[25],"good":[26],"thermal":[27],"contact":[28],"with":[29],"controlled":[31],"object":[32],"of":[33],"complex":[34],"shape.":[35],"In":[36],"addition,":[37],"they":[38],"are":[39],"quick-response,":[40],"reliable":[41],"easy":[43],"manufacture.":[45]},"counts_by_year":[],"updated_date":"2026-10-12T09:40:04.860316","created_date":"2023-10-02T00:00:00"}