{"id":"https://openalex.org/W4386536632","doi":"https://doi.org/10.1063/5.0162925","title":"Optimization of process parameters affecting performance of part characteristics in fused deposition modeling (FDM) 3D printing: A critical review","display_name":"Optimization of process parameters affecting performance of part characteristics in fused deposition modeling (FDM) 3D printing: A critical review","publication_year":2023,"publication_date":"2023-01-01","ids":{"openalex":"https://openalex.org/W4386536632","doi":"https://doi.org/10.1063/5.0162925"},"language":"en","primary_location":{"id":"doi:10.1063/5.0162925","doi":"https://doi.org/10.1063/5.0162925","is_oa":false,"landing_page_url":"https://doi.org/10.1063/5.0162925","pdf_url":null,"source":{"id":"https://openalex.org/S2764696622","display_name":"AIP conference proceedings","issn_l":"0094-243X","issn":["0094-243X","1551-7616","1935-0465"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310320257","host_organization_name":"American Institute of Physics","host_organization_lineage":["https://openalex.org/P4310320257"],"host_organization_lineage_names":["American Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"AIP Conference Proceedings","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5027724436","display_name":"Vishwjeet V. Ambade","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Vishwjeet V. Ambade","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033022904","display_name":"S. W. Rajurkar","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"S. W. Rajurkar","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]},{"author_position":"last","author":{"id":"https://openalex.org/A5000394823","display_name":"G. K. Awari","orcid":"https://orcid.org/0000-0002-6270-8712","observed_orcids":["https://orcid.org/0000-0002-6270-8712"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"G. K. Awari","raw_affiliation_strings":[],"raw_orcid":null,"affiliations":[]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":2.8934,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.92014017,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":88,"max":97},"biblio":{"volume":"2804","issue":null,"first_page":"020072","last_page":"020072"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10705","display_name":"Additive Manufacturing Materials and Processes","score":0.0007999999797903001,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12080","display_name":"Injection Molding Process and Properties","score":0.00039999998989515007,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/fused-deposition-modeling","display_name":"fused deposition modeling","score":0.9980000257492065},{"id":"https://openalex.org/keywords/3d-printing-process-parameters","display_name":"3D printing parameters","score":0.8460000157356262},{"id":"https://openalex.org/keywords/process-parameter-optimization","display_name":"process parameter optimization","score":0.7979999780654907},{"id":"https://openalex.org/keywords/part-performance","display_name":"part performance","score":0.6169999837875366},{"id":"https://openalex.org/keywords/additive-manufacturing","display_name":"additive manufacturing","score":0.6349999904632568},{"id":"https://openalex.org/keywords/polymer-extrusion","display_name":"polymer extrusion","score":0.5299999713897705}],"concepts":[{"id":"https://openalex.org/C2780329122","wikidata":"https://www.wikidata.org/wiki/Q18349149","display_name":"Fused deposition modeling","level":3,"score":0.8875102996826172},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.6305467486381531},{"id":"https://openalex.org/C524769229","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3D printing","level":2,"score":0.6252629160881042},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5075370073318481},{"id":"https://openalex.org/C64297162","wikidata":"https://www.wikidata.org/wiki/Q1987070","display_name":"Deposition (geology)","level":3,"score":0.4856247007846832},{"id":"https://openalex.org/C21880701","wikidata":"https://www.wikidata.org/wiki/Q2144042","display_name":"Process engineering","level":1,"score":0.4822450578212738},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.43910014629364014},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.3478715121746063},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3454737365245819},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.23773697018623352},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.16996726393699646},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.10535714030265808},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.06368181109428406},{"id":"https://openalex.org/C2816523","wikidata":"https://www.wikidata.org/wiki/Q180184","display_name":"Sediment","level":2,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1063/5.0162925","doi":"https://doi.org/10.1063/5.0162925","is_oa":false,"landing_page_url":"https://doi.org/10.1063/5.0162925","pdf_url":null,"source":{"id":"https://openalex.org/S2764696622","display_name":"AIP conference proceedings","issn_l":"0094-243X","issn":["0094-243X","1551-7616","1935-0465"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","jufo-1","norway-1"],"host_organization":"https://openalex.org/P4310320257","host_organization_name":"American Institute of Physics","host_organization_lineage":["https://openalex.org/P4310320257"],"host_organization_lineage_names":["American Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"AIP Conference Proceedings","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":64,"referenced_works":["https://openalex.org/W1805651604","https://openalex.org/W1837197540","https://openalex.org/W1899233657","https://openalex.org/W1964000165","https://openalex.org/W1964160185","https://openalex.org/W1983079844","https://openalex.org/W1987087218","https://openalex.org/W2002837833","https://openalex.org/W2008300737","https://openalex.org/W2025762535","https://openalex.org/W2038180014","https://openalex.org/W2068507382","https://openalex.org/W2088439614","https://openalex.org/W2089189161","https://openalex.org/W2091653176","https://openalex.org/W2093500299","https://openalex.org/W2095576930","https://openalex.org/W2099655045","https://openalex.org/W2104923870","https://openalex.org/W2106515369","https://openalex.org/W2142615681","https://openalex.org/W2248769346","https://openalex.org/W2308320691","https://openalex.org/W2409040977","https://openalex.org/W2512046375","https://openalex.org/W2512199170","https://openalex.org/W2597374800","https://openalex.org/W2601051689","https://openalex.org/W2613583922","https://openalex.org/W2725015551","https://openalex.org/W2734859595","https://openalex.org/W2754261920","https://openalex.org/W2766716419","https://openalex.org/W2770239401","https://openalex.org/W2775236031","https://openalex.org/W2789731474","https://openalex.org/W2793177870","https://openalex.org/W2795953826","https://openalex.org/W2885435251","https://openalex.org/W2887838075","https://openalex.org/W2901889661","https://openalex.org/W2905002374","https://openalex.org/W2924170386","https://openalex.org/W2945549476","https://openalex.org/W2965274764","https://openalex.org/W2965827431","https://openalex.org/W2966607880","https://openalex.org/W2979367241","https://openalex.org/W2980734204","https://openalex.org/W2998252399","https://openalex.org/W3037131440","https://openalex.org/W3037633988","https://openalex.org/W3038040121","https://openalex.org/W3113360996","https://openalex.org/W3133948467","https://openalex.org/W3166379426","https://openalex.org/W3170052077","https://openalex.org/W3185001943","https://openalex.org/W3186256987","https://openalex.org/W3186476107","https://openalex.org/W3191976261","https://openalex.org/W3202073943","https://openalex.org/W4214526944","https://openalex.org/W4256706557"],"related_works":["https://openalex.org/W7164459634","https://openalex.org/W7204821496","https://openalex.org/W4377993944","https://openalex.org/W3153395898","https://openalex.org/W3214377666","https://openalex.org/W6885073128","https://openalex.org/W7161578972","https://openalex.org/W4319996787","https://openalex.org/W3139885661","https://openalex.org/W4285229311"],"abstract_inverted_index":null,"counts_by_year":[{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":1}],"updated_date":"2026-11-06T12:05:46.655746","created_date":"2023-09-09T00:00:00"}