{"id":"https://openalex.org/W4385541876","doi":"https://doi.org/10.1109/ectc51909.2023.00350","title":"Inorganic capping layers in advanced photosensitive polymer based RDL processes: processing and reliability","display_name":"Inorganic capping layers in advanced photosensitive polymer based RDL processes: processing and reliability","publication_year":2023,"publication_date":"2023-05-01","ids":{"openalex":"https://openalex.org/W4385541876","doi":"https://doi.org/10.1109/ectc51909.2023.00350"},"language":"en","primary_location":{"id":"doi:10.1109/ectc51909.2023.00350","doi":"https://doi.org/10.1109/ectc51909.2023.00350","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ectc51909.2023.00350","pdf_url":null,"source":{"id":"https://openalex.org/S4363608088","display_name":"IEEE Electronic Components and Technology Conference (ECTC)","issn_l":"2766-8401","issn":["2766-8401"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5014908469","display_name":"N\u00e9lson Pinho","orcid":"https://orcid.org/0000-0002-0701-5921","observed_orcids":["https://orcid.org/0000-0002-0701-5921"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Nelson Pinho","raw_affiliation_strings":["Imec, Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Imec, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080162224","display_name":"Emmanuel Chery","orcid":"https://orcid.org/0000-0002-2526-3873","observed_orcids":["https://orcid.org/0000-0002-2526-3873"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Emmanuel Chery","raw_affiliation_strings":["Imec, Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Imec, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5005677852","display_name":"Ritwik Bhatia","orcid":"https://orcid.org/0009-0001-0910-184X","observed_orcids":["https://orcid.org/0009-0001-0910-184X"]},"institutions":[{"id":"https://openalex.org/I864088423","display_name":"Veeco (United States)","ror":"https://ror.org/055c6bd74","country_code":"US","type":"company","lineage":["https://openalex.org/I864088423"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ritwik Bhatia","raw_affiliation_strings":["Veeco, Waltham, MA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Veeco, Waltham, MA, USA","institution_ids":["https://openalex.org/I864088423"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5082457472","display_name":"Ganesh M. Sundaram","orcid":"https://orcid.org/0000-0001-9258-2981","observed_orcids":["https://orcid.org/0000-0001-9258-2981"]},"institutions":[{"id":"https://openalex.org/I864088423","display_name":"Veeco (United States)","ror":"https://ror.org/055c6bd74","country_code":"US","type":"company","lineage":["https://openalex.org/I864088423"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ganesh Sundaram","raw_affiliation_strings":["Veeco, Waltham, MA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Veeco, Waltham, MA, USA","institution_ids":["https://openalex.org/I864088423"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5041973317","display_name":"John Slabbekoorn","orcid":"https://orcid.org/0000-0002-6098-8618","observed_orcids":["https://orcid.org/0000-0002-6098-8618"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"John Slabbekoorn","raw_affiliation_strings":["Imec, Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Imec, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085234531","display_name":"Mikhail B. Krishtab","orcid":"https://orcid.org/0000-0001-6215-8506","observed_orcids":["https://orcid.org/0000-0001-6215-8506"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Mikhail Krishtab","raw_affiliation_strings":["Imec, Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Imec, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087597143","display_name":"Andy Miller","orcid":"https://orcid.org/0000-0001-6103-1685","observed_orcids":["https://orcid.org/0000-0001-6103-1685"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Andy Miller","raw_affiliation_strings":["Imec, Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Imec, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5051712390","display_name":"Eric Beyne","orcid":"https://orcid.org/0000-0002-3096-050X","observed_orcids":["https://orcid.org/0000-0002-3096-050X"]},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"Eric Beyne","raw_affiliation_strings":["Imec, Leuven, Belgium"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Imec, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":2.2407,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.86490496,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"2040","last_page":"2045"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.35179999470710754,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.35179999470710754,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.2863999903202057,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.25850000977516174,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/atomic-layer-deposition","display_name":"atomic layer deposition","score":0.7879999876022339},{"id":"https://openalex.org/keywords/redistribution-layer","display_name":"redistribution layer","score":0.7440000176429749},{"id":"https://openalex.org/keywords/photopolymers","display_name":"photopolymers","score":0.847000002861023},{"id":"https://openalex.org/keywords/line-and-space-patterns","display_name":"line/space patterning","score":0.6769999861717224},{"id":"https://openalex.org/keywords/reliability","display_name":"reliability","score":0.5740000009536743},{"id":"https://openalex.org/keywords/printed-electronics","display_name":"printed electronics","score":0.3190000057220459}],"concepts":[{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.6311763525009155},{"id":"https://openalex.org/C521977710","wikidata":"https://www.wikidata.org/wiki/Q81163","display_name":"Polymer","level":2,"score":0.6054238677024841},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5284214615821838},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.487989604473114},{"id":"https://openalex.org/C74080474","wikidata":"https://www.wikidata.org/wiki/Q7305975","display_name":"Redistribution (election)","level":3,"score":0.47303837537765503},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.4319417178630829},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.40741121768951416},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3652225136756897},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3505271375179291},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.12630155682563782},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.11680442094802856},{"id":"https://openalex.org/C199539241","wikidata":"https://www.wikidata.org/wiki/Q7748","display_name":"Law","level":1,"score":0.0},{"id":"https://openalex.org/C94625758","wikidata":"https://www.wikidata.org/wiki/Q7163","display_name":"Politics","level":2,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C17744445","wikidata":"https://www.wikidata.org/wiki/Q36442","display_name":"Political science","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/ectc51909.2023.00350","doi":"https://doi.org/10.1109/ectc51909.2023.00350","is_oa":false,"landing_page_url":"https://doi.org/10.1109/ectc51909.2023.00350","pdf_url":null,"source":{"id":"https://openalex.org/S4363608088","display_name":"IEEE Electronic Components and Technology Conference (ECTC)","issn_l":"2766-8401","issn":["2766-8401"],"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W2074358422","https://openalex.org/W2208253452","https://openalex.org/W2572386853","https://openalex.org/W2785666495","https://openalex.org/W2896475466","https://openalex.org/W2918280849","https://openalex.org/W2966685200","https://openalex.org/W2997165664","https://openalex.org/W3162184085","https://openalex.org/W4285103097","https://openalex.org/W4285103196","https://openalex.org/W4293214381","https://openalex.org/W4323320274","https://openalex.org/W4385525194"],"related_works":["https://openalex.org/W6930110166","https://openalex.org/W4400411786","https://openalex.org/W4306169092","https://openalex.org/W4410987911","https://openalex.org/W3193054856","https://openalex.org/W2592434964","https://openalex.org/W4391639425","https://openalex.org/W4411689044","https://openalex.org/W2509204909","https://openalex.org/W2900352688"],"abstract_inverted_index":{"In":[0],"this":[1],"work,":[2],"thin":[3],"inorganic":[4],"ALD-deposited":[5],"capping":[6,45],"layers":[7],"are":[8,47],"integrated":[9],"into":[10],"polymer-based":[11],"redistribution":[12],"layer":[13],"(RDL)":[14],"processes":[15],"with":[16,27],"2\u20134$\\mu":[17],"\\mathrm{m}$line/space.":[18],"The":[19],"primary":[20],"objective":[21],"of":[22,43],"enhanced":[23],"reliability":[24],"is":[25],"shown,":[26],"secondary":[28],"process":[29,38],"improvements":[30],"detailed.":[31,49],"Impact":[32],"and":[33,40],"respective":[34],"mitigation":[35],"on":[36],"Lithography":[37],"reviewed":[39],"the":[41,44],"introduction":[42],"etch":[46],"further":[48]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":1}],"updated_date":"2026-11-10T11:39:43.021295","created_date":"2023-08-04T00:00:00"}