{"id":"https://openalex.org/W4384934612","doi":"https://doi.org/10.24425/amm.2021.136407","title":"Effect of the ENEPIG Process on the Bonding Strength of BiTe-based Thermoelectric Elements","display_name":"Effect of the ENEPIG Process on the Bonding Strength of BiTe-based Thermoelectric Elements","publication_year":2021,"publication_date":"2021-12-28","ids":{"openalex":"https://openalex.org/W4384934612","doi":"https://doi.org/10.24425/amm.2021.136407"},"language":"en","primary_location":{"id":"doi:10.24425/amm.2021.136407","doi":"https://doi.org/10.24425/amm.2021.136407","is_oa":true,"landing_page_url":"https://doi.org/10.24425/amm.2021.136407","pdf_url":"http://journals.pan.pl/Content/119280/PDF-MASTER/AMM-2021-4-09-Injoon%20Son.pdf","source":{"id":"https://openalex.org/S20440071","display_name":"Archives of Metallurgy and Materials","issn_l":"0860-7052","issn":["0860-7052","1733-3490","2300-1909"],"is_oa":true,"is_in_doaj":true,"is_core":true,"listed_in":["cwts-core","ddh","doaj","dongbi-c","jufo-1","norway-1","poland-40","russia-white-list-3"],"host_organization":"https://openalex.org/P4310320322","host_organization_name":"De Gruyter Open","host_organization_lineage":["https://openalex.org/P4310320322","https://openalex.org/P4310313990"],"host_organization_lineage_names":["De Gruyter Open","De Gruyter"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Archives of Metallurgy and Materials","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref","datacite","doaj"],"open_access":{"is_oa":true,"oa_status":"diamond","oa_url":"http://journals.pan.pl/Content/119280/PDF-MASTER/AMM-2021-4-09-Injoon%20Son.pdf","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5067962382","display_name":"S.S. Kim","orcid":"https://orcid.org/0000-0001-8472-1320","observed_orcids":["https://orcid.org/0000-0001-8472-1320"]},"institutions":[{"id":"https://openalex.org/I135598925","display_name":"Kyushu University","ror":"https://ror.org/00p4k0j84","country_code":"JP","type":"education","lineage":["https://openalex.org/I135598925"]},{"id":"https://openalex.org/I31419693","display_name":"Kyungpook National University","ror":"https://ror.org/040c17130","country_code":"KR","type":"education","lineage":["https://openalex.org/I31419693"]}],"countries":["JP","KR"],"is_corresponding":false,"raw_author_name":"Subin Kim","raw_affiliation_strings":["Kyungpook National University, Department of Materials Science and Metallurgical Engineering, Daegu, Republic of Korea","KYuSHu uNiveRSiTY gRADuATe SCHooL oF eNgiNeeRiNg, DePARTmeNT oF mATeRiALS PRoCeSS eNgiNeeRiNg, FuKuoKA, jAPAN"],"raw_orcid":"https://orcid.org/0000-0001-8472-1320","affiliations":[{"raw_affiliation_string":"Kyungpook National University, Department of Materials Science and Metallurgical Engineering, Daegu, Republic of Korea","institution_ids":["https://openalex.org/I31419693"]},{"raw_affiliation_string":"KYuSHu uNiveRSiTY gRADuATe SCHooL oF eNgiNeeRiNg, DePARTmeNT oF mATeRiALS PRoCeSS eNgiNeeRiNg, FuKuoKA, jAPAN","institution_ids":["https://openalex.org/I135598925"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5003122555","display_name":"Sung Hwa Bae","orcid":"https://orcid.org/0000-0003-4096-3197","observed_orcids":["https://orcid.org/0000-0003-4096-3197"]},"institutions":[{"id":"https://openalex.org/I135598925","display_name":"Kyushu University","ror":"https://ror.org/00p4k0j84","country_code":"JP","type":"education","lineage":["https://openalex.org/I135598925"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Sung Hwa Bae","raw_affiliation_strings":["Kyushu University Graduate School of Engineering, Department of Materials Process Engineering, Fukuoka, Japan"],"raw_orcid":"https://orcid.org/0000-0003-4096-3197","affiliations":[{"raw_affiliation_string":"Kyushu University Graduate School of Engineering, Department of Materials Process Engineering, Fukuoka, Japan","institution_ids":["https://openalex.org/I135598925"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5047606409","display_name":"Injoon Son","orcid":"https://orcid.org/0000-0002-2282-8007","observed_orcids":["https://orcid.org/0000-0002-2282-8007"]},"institutions":[{"id":"https://openalex.org/I31419693","display_name":"Kyungpook National University","ror":"https://ror.org/040c17130","country_code":"KR","type":"education","lineage":["https://openalex.org/I31419693"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Injoon Son","raw_affiliation_strings":["Kyungpook National University, Department of Materials Science and Metallurgical Engineering, Daegu, Republic of Korea"],"raw_orcid":"https://orcid.org/0000-0002-2282-8007","affiliations":[{"raw_affiliation_string":"Kyungpook National University, Department of Materials Science and Metallurgical Engineering, Daegu, Republic of Korea","institution_ids":["https://openalex.org/I31419693"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0734,"has_fulltext":true,"cited_by_count":1,"citation_normalized_percentile":{"value":0.32914986,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":93},"biblio":{"volume":null,"issue":null,"first_page":"967","last_page":"970"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.5928000211715698,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.5928000211715698,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":0.3100999891757965,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.07460000365972519,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/gold-plating","display_name":"gold plating","score":0.6779999732971191},{"id":"https://openalex.org/keywords/thermoelectric-modules","display_name":"thermoelectric modules","score":0.875},{"id":"https://openalex.org/keywords/bond-strength","display_name":"bond strength","score":0.925000011920929},{"id":"https://openalex.org/keywords/intermetallic-compounds","display_name":"intermetallic compounds","score":0.7229999899864197},{"id":"https://openalex.org/keywords/copper-diffusion","display_name":"copper diffusion","score":0.640999972820282}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.825785756111145},{"id":"https://openalex.org/C2987263936","wikidata":"https://www.wikidata.org/wiki/Q10843872","display_name":"Materials processing","level":2,"score":0.6630197763442993},{"id":"https://openalex.org/C2993208542","wikidata":"https://www.wikidata.org/wiki/Q207652","display_name":"Industrial chemistry","level":2,"score":0.6377804279327393},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.6118218898773193},{"id":"https://openalex.org/C63024428","wikidata":"https://www.wikidata.org/wiki/Q552456","display_name":"Thermoelectric effect","level":2,"score":0.5957989692687988},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.5762050151824951},{"id":"https://openalex.org/C207365445","wikidata":"https://www.wikidata.org/wiki/Q15020929","display_name":"Thermoelectric materials","level":3,"score":0.44188302755355835},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.3609849810600281},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3530101180076599},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.34090012311935425},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.15467077493667603},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.14167478680610657},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.06710094213485718},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C183696295","wikidata":"https://www.wikidata.org/wiki/Q2487696","display_name":"Biochemical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.24425/amm.2021.136407","doi":"https://doi.org/10.24425/amm.2021.136407","is_oa":true,"landing_page_url":"https://doi.org/10.24425/amm.2021.136407","pdf_url":"http://journals.pan.pl/Content/119280/PDF-MASTER/AMM-2021-4-09-Injoon%20Son.pdf","source":{"id":"https://openalex.org/S20440071","display_name":"Archives of Metallurgy and Materials","issn_l":"0860-7052","issn":["0860-7052","1733-3490","2300-1909"],"is_oa":true,"is_in_doaj":true,"is_core":true,"listed_in":["cwts-core","ddh","doaj","dongbi-c","jufo-1","norway-1","poland-40","russia-white-list-3"],"host_organization":"https://openalex.org/P4310320322","host_organization_name":"De Gruyter Open","host_organization_lineage":["https://openalex.org/P4310320322","https://openalex.org/P4310313990"],"host_organization_lineage_names":["De Gruyter Open","De Gruyter"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Archives of Metallurgy and Materials","raw_type":"journal-article"},{"id":"pmh:oai:doaj.org/article:286ac270ca034b7e8392479f34894c06","doi":null,"is_oa":true,"landing_page_url":"https://doaj.org/article/286ac270ca034b7e8392479f34894c06","pdf_url":null,"source":{"id":"https://openalex.org/S4306401280","display_name":"DOAJ (DOAJ: Directory of Open Access Journals)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":"cc-by-sa","license_id":"https://openalex.org/licenses/cc-by-sa","version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Archives of Metallurgy and Materials, Vol vol. 66, Iss No 4, Pp 967-970 (2021)","raw_type":"article"},{"id":"doi:10.24425/amm.2021.136407","doi":"https://doi.org/10.24425/amm.2021.136407","is_oa":true,"landing_page_url":"https://doi.org/10.24425/amm.2021.136407","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"Other"}],"best_oa_location":{"id":"doi:10.24425/amm.2021.136407","doi":"https://doi.org/10.24425/amm.2021.136407","is_oa":true,"landing_page_url":"https://doi.org/10.24425/amm.2021.136407","pdf_url":"http://journals.pan.pl/Content/119280/PDF-MASTER/AMM-2021-4-09-Injoon%20Son.pdf","source":{"id":"https://openalex.org/S20440071","display_name":"Archives of Metallurgy and Materials","issn_l":"0860-7052","issn":["0860-7052","1733-3490","2300-1909"],"is_oa":true,"is_in_doaj":true,"is_core":true,"listed_in":["cwts-core","ddh","doaj","dongbi-c","jufo-1","norway-1","poland-40","russia-white-list-3"],"host_organization":"https://openalex.org/P4310320322","host_organization_name":"De Gruyter Open","host_organization_lineage":["https://openalex.org/P4310320322","https://openalex.org/P4310313990"],"host_organization_lineage_names":["De Gruyter Open","De Gruyter"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Archives of Metallurgy and Materials","raw_type":"journal-article"},"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.4943999946117401}],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4384934612.pdf","grobid_xml":"https://content.openalex.org/works/W4384934612.grobid-xml"},"referenced_works_count":17,"referenced_works":["https://openalex.org/W1987777437","https://openalex.org/W1987791874","https://openalex.org/W1994715177","https://openalex.org/W2042056247","https://openalex.org/W2042357966","https://openalex.org/W2084074646","https://openalex.org/W2087742069","https://openalex.org/W2088301283","https://openalex.org/W2131488455","https://openalex.org/W2624903741","https://openalex.org/W2802858014","https://openalex.org/W2890559663","https://openalex.org/W2924322077","https://openalex.org/W3015365320","https://openalex.org/W3040709033","https://openalex.org/W6605905859","https://openalex.org/W6817116025"],"related_works":["https://openalex.org/W3119443751","https://openalex.org/W3138840968","https://openalex.org/W2737821169","https://openalex.org/W3139462488","https://openalex.org/W3210161133","https://openalex.org/W2924322077","https://openalex.org/W4366006137","https://openalex.org/W3197416651","https://openalex.org/W3211360588","https://openalex.org/W4384928235"],"abstract_inverted_index":{"To":[0],"improve":[1],"the":[2,16,46,58,64,85,96,101,105,109,118,131],"mechanical":[3],"performance":[4],"of":[5,18,48,112,130],"BiTe-based":[6,44,86,97,132],"thermoelectric":[7,87,98,133],"modules,":[8],"this":[9],"study":[10],"applies":[11],"anti-diffusion":[12],"layers":[13,29],"that":[14,117],"inhibit":[15],"generation":[17],"metal":[19],"intercompounds":[20],"and":[21,100],"an":[22,54],"electroless":[23],"nickel/electrode":[24],"palladium/mission":[25],"gold":[26],"(ENEPIG)":[27],"plating":[28,81,91],"to":[30,76,84,94],"ensure":[31],"a":[32,37,125],"stable":[33],"bonding":[34,69,106,128],"interface.":[35],"If":[36],"plated":[38],"layer":[39],"is":[40,121],"formed":[41],"only":[42],"on":[43,63],"thermoelectric,":[45],"diffusion":[47],"Cu":[49,65,102],"in":[50,123],"electrode":[51,66,103],"substrates":[52],"produces":[53],"intermetallic":[55],"compound.":[56],"Therefore,":[57],"ENEPIG":[59,80,90,119],"process":[60,120],"was":[61,82,92],"applied":[62],"substrate.":[67],"The":[68],"strength":[70,107],"highly":[71,126],"increased":[72],"from":[73],"approximately":[74,113],"10.4":[75],"16.4":[77],"MPa":[78],"when":[79],"conducted":[83],"element.":[88],"When":[89],"performed":[93],"both":[95],"element":[99],"substrate,":[104],"showed":[108],"highest":[110],"value":[111],"17.6":[114],"MPa,":[115],"suggesting":[116],"effective":[122],"ensuring":[124],"reliable":[127],"interface":[129],"module.":[134]},"counts_by_year":[{"year":2023,"cited_by_count":1}],"updated_date":"2026-10-30T12:39:25.321706","created_date":"2023-07-22T00:00:00"}