{"id":"https://openalex.org/W4383901232","doi":"https://doi.org/10.1016/j.mssp.2023.107737","title":"Polishing of diamond, SiC, GaN based on the oxidation modification of hydroxyl radical: Status, challenges and strategies","display_name":"Polishing of diamond, SiC, GaN based on the oxidation modification of hydroxyl radical: Status, challenges and strategies","publication_year":2023,"publication_date":"2023-07-11","ids":{"openalex":"https://openalex.org/W4383901232","doi":"https://doi.org/10.1016/j.mssp.2023.107737"},"language":"en","primary_location":{"id":"doi:10.1016/j.mssp.2023.107737","doi":"https://doi.org/10.1016/j.mssp.2023.107737","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.mssp.2023.107737","pdf_url":null,"source":{"id":"https://openalex.org/S82126420","display_name":"Materials Science in Semiconductor Processing","issn_l":"1369-8001","issn":["1369-8001","1873-4081"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","ki-jl-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Materials Science in Semiconductor Processing","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5083267682","display_name":"Dong Shi","orcid":"https://orcid.org/0000-0003-0431-2047","observed_orcids":["https://orcid.org/0000-0003-0431-2047"]},"institutions":[{"id":"https://openalex.org/I191208505","display_name":"Xiamen University","ror":"https://ror.org/00mcjh785","country_code":"CN","type":"education","lineage":["https://openalex.org/I191208505"]},{"id":"https://openalex.org/I4210123686","display_name":"Quzhou University","ror":"https://ror.org/024nfx323","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210123686"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Dong Shi","raw_affiliation_strings":["College of Mechanical Engineering, Quzhou University, Quzhou, 324000, China","Department of Mechanical & Electrical Engineering, Xiamen University, Xiamen, 361005, China"],"raw_orcid":"https://orcid.org/0000-0003-0431-2047","affiliations":[{"raw_affiliation_string":"College of Mechanical Engineering, Quzhou University, Quzhou, 324000, China","institution_ids":["https://openalex.org/I4210123686"]},{"raw_affiliation_string":"Department of Mechanical & Electrical Engineering, Xiamen University, Xiamen, 361005, China","institution_ids":["https://openalex.org/I191208505"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072291924","display_name":"Wei Zhou","orcid":"https://orcid.org/0000-0002-9820-556X","observed_orcids":["https://orcid.org/0000-0002-9820-556X","https://orcid.org/0000-0002-4287-8941","https://orcid.org/0009-0001-0475-5174"]},"institutions":[{"id":"https://openalex.org/I191208505","display_name":"Xiamen University","ror":"https://ror.org/00mcjh785","country_code":"CN","type":"education","lineage":["https://openalex.org/I191208505"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Wei Zhou","raw_affiliation_strings":["Department of Mechanical & Electrical Engineering, Xiamen University, Xiamen, 361005, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical & Electrical Engineering, Xiamen University, Xiamen, 361005, China","institution_ids":["https://openalex.org/I191208505"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5061311147","display_name":"Tianchen Zhao","orcid":"https://orcid.org/0000-0002-6214-7812","observed_orcids":["https://orcid.org/0000-0002-6214-7812"]},"institutions":[{"id":"https://openalex.org/I4210123686","display_name":"Quzhou University","ror":"https://ror.org/024nfx323","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210123686"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Tianchen Zhao","raw_affiliation_strings":["College of Mechanical Engineering, Quzhou University, Quzhou, 324000, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"College of Mechanical Engineering, Quzhou University, Quzhou, 324000, China","institution_ids":["https://openalex.org/I4210123686"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5061311147","https://openalex.org/A5072291924"],"corresponding_institution_ids":["https://openalex.org/I191208505","https://openalex.org/I4210123686"],"apc_list":{"value":3030,"currency":"USD","value_usd":3030},"apc_paid":null,"fwci":4.1354,"has_fulltext":false,"cited_by_count":41,"citation_normalized_percentile":{"value":0.94521524,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":99,"max":100},"biblio":{"volume":"166","issue":null,"first_page":"107737","last_page":"107737"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10188","display_name":"Advanced machining processes and optimization","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12092","display_name":"Erosion and Abrasive Machining","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/diamond-polishing","display_name":"diamond polishing","score":0.8429999947547913},{"id":"https://openalex.org/keywords/hydroxyl-radicals","display_name":"hydroxyl radicals","score":0.9570000171661377},{"id":"https://openalex.org/keywords/heterogeneous-fenton-reaction","display_name":"heterogeneous Fenton reaction","score":0.8299999833106995},{"id":"https://openalex.org/keywords/wide-bandgap-semiconductors","display_name":"wide bandgap semiconductors","score":0.9350000023841858},{"id":"https://openalex.org/keywords/ultra-precision-polishing","display_name":"ultra-precision polishing","score":0.8489999771118164},{"id":"https://openalex.org/keywords/polishing-slurry","display_name":"polishing slurry","score":0.6690000295639038},{"id":"https://openalex.org/keywords/polishing-pad","display_name":"polishing pad","score":0.9449999928474426},{"id":"https://openalex.org/keywords/oxidation-mechanism","display_name":"oxidation mechanism","score":0.5040000081062317}],"concepts":[{"id":"https://openalex.org/C138113353","wikidata":"https://www.wikidata.org/wiki/Q611639","display_name":"Polishing","level":2,"score":0.9469858407974243},{"id":"https://openalex.org/C2776921476","wikidata":"https://www.wikidata.org/wiki/Q5283","display_name":"Diamond","level":2,"score":0.79246985912323},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7465051412582397},{"id":"https://openalex.org/C180088628","wikidata":"https://www.wikidata.org/wiki/Q1069404","display_name":"Chemical-mechanical planarization","level":3,"score":0.7220996618270874},{"id":"https://openalex.org/C94293008","wikidata":"https://www.wikidata.org/wiki/Q23925154","display_name":"Slurry","level":2,"score":0.5469229817390442},{"id":"https://openalex.org/C108225325","wikidata":"https://www.wikidata.org/wiki/Q11456","display_name":"Semiconductor","level":2,"score":0.5423153638839722},{"id":"https://openalex.org/C134121241","wikidata":"https://www.wikidata.org/wiki/Q899301","display_name":"Yield (engineering)","level":2,"score":0.5300276875495911},{"id":"https://openalex.org/C136478896","wikidata":"https://www.wikidata.org/wiki/Q898288","display_name":"Brittleness","level":2,"score":0.5002691745758057},{"id":"https://openalex.org/C42360764","wikidata":"https://www.wikidata.org/wiki/Q83588","display_name":"Chemical engineering","level":1,"score":0.4160047471523285},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.38705188035964966},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.24239277839660645},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.22693586349487305},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.2043001651763916},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.mssp.2023.107737","doi":"https://doi.org/10.1016/j.mssp.2023.107737","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.mssp.2023.107737","pdf_url":null,"source":{"id":"https://openalex.org/S82126420","display_name":"Materials Science in Semiconductor Processing","issn_l":"1369-8001","issn":["1369-8001","1873-4081"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","ki-jl-1","norway-1","poland-70","russia-white-list-1"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Materials Science in Semiconductor Processing","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":150,"referenced_works":["https://openalex.org/W70267170","https://openalex.org/W1888616392","https://openalex.org/W1953589467","https://openalex.org/W1963489932","https://openalex.org/W1966768049","https://openalex.org/W1968031169","https://openalex.org/W1973821320","https://openalex.org/W1974072513","https://openalex.org/W1983638732","https://openalex.org/W1989113328","https://openalex.org/W1992467265","https://openalex.org/W1993132492","https://openalex.org/W1994217653","https://openalex.org/W1994516284","https://openalex.org/W2002055142","https://openalex.org/W2003349207","https://openalex.org/W2004774327","https://openalex.org/W2011769794","https://openalex.org/W2025502419","https://openalex.org/W2027038812","https://openalex.org/W2031856899","https://openalex.org/W2032261102","https://openalex.org/W2032328042","https://openalex.org/W2033716210","https://openalex.org/W2034277923","https://openalex.org/W2038962735","https://openalex.org/W2041057274","https://openalex.org/W2048652145","https://openalex.org/W2051407751","https://openalex.org/W2052945309","https://openalex.org/W2053673512","https://openalex.org/W2058412027","https://openalex.org/W2062775888","https://openalex.org/W2063635310","https://openalex.org/W2064179643","https://openalex.org/W2068862838","https://openalex.org/W2071458629","https://openalex.org/W2076569034","https://openalex.org/W2077784051","https://openalex.org/W2080162606","https://openalex.org/W2088533199","https://openalex.org/W2094190414","https://openalex.org/W2101765592","https://openalex.org/W2105171045","https://openalex.org/W2108679924","https://openalex.org/W2109286147","https://openalex.org/W2114343498","https://openalex.org/W2114986745","https://openalex.org/W2118849167","https://openalex.org/W2134187077","https://openalex.org/W2137026308","https://openalex.org/W2140999005","https://openalex.org/W2141784245","https://openalex.org/W2162491388","https://openalex.org/W2166148044","https://openalex.org/W2207463973","https://openalex.org/W2275135493","https://openalex.org/W2332176714","https://openalex.org/W2363801810","https://openalex.org/W2479423231","https://openalex.org/W2527605937","https://openalex.org/W2558056826","https://openalex.org/W2562235308","https://openalex.org/W2577976329","https://openalex.org/W2594433658","https://openalex.org/W2608619052","https://openalex.org/W2744563093","https://openalex.org/W2744982745","https://openalex.org/W2751430366","https://openalex.org/W2754563842","https://openalex.org/W2765939052","https://openalex.org/W2766796456","https://openalex.org/W2769960215","https://openalex.org/W2771880392","https://openalex.org/W2780355582","https://openalex.org/W2780950673","https://openalex.org/W2794957411","https://openalex.org/W2795559551","https://openalex.org/W2796726085","https://openalex.org/W2802040652","https://openalex.org/W2808950353","https://openalex.org/W2886224382","https://openalex.org/W2887446060","https://openalex.org/W2906120523","https://openalex.org/W2907168405","https://openalex.org/W2922285697","https://openalex.org/W2930987385","https://openalex.org/W2934451288","https://openalex.org/W2944034133","https://openalex.org/W2944640843","https://openalex.org/W2955956379","https://openalex.org/W2968671657","https://openalex.org/W2972204926","https://openalex.org/W2972420538","https://openalex.org/W2980710114","https://openalex.org/W3000439740","https://openalex.org/W3009255380","https://openalex.org/W3011148380","https://openalex.org/W3021410417","https://openalex.org/W3021932903","https://openalex.org/W3023181027","https://openalex.org/W3024905620","https://openalex.org/W3036577021","https://openalex.org/W3047696719","https://openalex.org/W3048875959","https://openalex.org/W3080433239","https://openalex.org/W3089199798","https://openalex.org/W3090116547","https://openalex.org/W3090403576","https://openalex.org/W3097415770","https://openalex.org/W3107643073","https://openalex.org/W3110724436","https://openalex.org/W3118351799","https://openalex.org/W3118465088","https://openalex.org/W3119682165","https://openalex.org/W3120131422","https://openalex.org/W3130233319","https://openalex.org/W3135858207","https://openalex.org/W3137141944","https://openalex.org/W3137435428","https://openalex.org/W3138038860","https://openalex.org/W3152320120","https://openalex.org/W3154156099","https://openalex.org/W3167690256","https://openalex.org/W3169926378","https://openalex.org/W3173958865","https://openalex.org/W3192117757","https://openalex.org/W3193496845","https://openalex.org/W3198521780","https://openalex.org/W3207521149","https://openalex.org/W3208508703","https://openalex.org/W3214749583","https://openalex.org/W4205763171","https://openalex.org/W4206657045","https://openalex.org/W4210952675","https://openalex.org/W4213271168","https://openalex.org/W4213452353","https://openalex.org/W4220881041","https://openalex.org/W4224301905","https://openalex.org/W4224304577","https://openalex.org/W4281695985","https://openalex.org/W4285082032","https://openalex.org/W4285300106","https://openalex.org/W4285384274","https://openalex.org/W4285585202","https://openalex.org/W4296817160","https://openalex.org/W4297107077","https://openalex.org/W6648509400","https://openalex.org/W6783906148","https://openalex.org/W6791840828"],"related_works":["https://openalex.org/W4401067611","https://openalex.org/W4414259707","https://openalex.org/W4384010616","https://openalex.org/W7172204243","https://openalex.org/W4399800242","https://openalex.org/W4408734602","https://openalex.org/W7163823195","https://openalex.org/W4220881041","https://openalex.org/W7163051388","https://openalex.org/W2780950673"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":14},{"year":2025,"cited_by_count":13},{"year":2024,"cited_by_count":14}],"updated_date":"2026-11-04T10:54:05.112534","created_date":"2023-07-12T00:00:00"}