{"id":"https://openalex.org/W4378740329","doi":"https://doi.org/10.1088/1361-6641/acd9e5","title":"Process optimization of 4H-SiC chemical mechanical polishing based on grey relational analysis","display_name":"Process optimization of 4H-SiC chemical mechanical polishing based on grey relational analysis","publication_year":2023,"publication_date":"2023-05-30","ids":{"openalex":"https://openalex.org/W4378740329","doi":"https://doi.org/10.1088/1361-6641/acd9e5"},"language":"en","primary_location":{"id":"doi:10.1088/1361-6641/acd9e5","doi":"https://doi.org/10.1088/1361-6641/acd9e5","is_oa":true,"landing_page_url":"https://doi.org/10.1088/1361-6641/acd9e5","pdf_url":"https://iopscience.iop.org/article/10.1088/1361-6641/acd9e5/pdf","source":{"id":"https://openalex.org/S106302738","display_name":"Semiconductor Science and Technology","issn_l":"0268-1242","issn":["0268-1242","1361-6641"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320083","host_organization_name":"IOP Publishing","host_organization_lineage":["https://openalex.org/P4310320083","https://openalex.org/P4310311669"],"host_organization_lineage_names":["IOP Publishing","Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Semiconductor Science and Technology","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://iopscience.iop.org/article/10.1088/1361-6641/acd9e5/pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5009924190","display_name":"Xinxing Ban","orcid":"https://orcid.org/0000-0002-9715-9047","observed_orcids":["https://orcid.org/0000-0002-9715-9047"]},"institutions":[{"id":"https://openalex.org/I36152291","display_name":"Henan University of Technology","ror":"https://ror.org/05sbgwt55","country_code":"CN","type":"education","lineage":["https://openalex.org/I36152291"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Xinxing Ban","raw_affiliation_strings":["School of Mechanical and Electrical Engineering, Henan University of Technology, No. 100 Lianhua Street, Zhengzhou, 450001, CHINA"],"raw_orcid":"https://orcid.org/0000-0002-9715-9047","affiliations":[{"raw_affiliation_string":"School of Mechanical and Electrical Engineering, Henan University of Technology, No. 100 Lianhua Street, Zhengzhou, 450001, CHINA","institution_ids":["https://openalex.org/I36152291"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102608723","display_name":"Tianxu Duan","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I36152291","display_name":"Henan University of Technology","ror":"https://ror.org/05sbgwt55","country_code":"CN","type":"education","lineage":["https://openalex.org/I36152291"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Tianxu Duan","raw_affiliation_strings":["School of Mechanical and Electrical Engineering, Henan University of Technology, No. 100 Lianhua Street, Zhengzhou, Henan, 450001, CHINA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Mechanical and Electrical Engineering, Henan University of Technology, No. 100 Lianhua Street, Zhengzhou, Henan, 450001, CHINA","institution_ids":["https://openalex.org/I36152291"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110797227","display_name":"Zhuangzhi Tian","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I36152291","display_name":"Henan University of Technology","ror":"https://ror.org/05sbgwt55","country_code":"CN","type":"education","lineage":["https://openalex.org/I36152291"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhuangzhi Tian","raw_affiliation_strings":["School of Mechanical and Electrical Engineering, Henan University of Technology, No. 100 Lianhua Street, Zhengzhou, Henan, 450001, CHINA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Mechanical and Electrical Engineering, Henan University of Technology, No. 100 Lianhua Street, Zhengzhou, Henan, 450001, CHINA","institution_ids":["https://openalex.org/I36152291"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101823425","display_name":"Yunhe Li","orcid":"https://orcid.org/0000-0002-5386-6727","observed_orcids":["https://orcid.org/0000-0002-5386-6727"]},"institutions":[{"id":"https://openalex.org/I36152291","display_name":"Henan University of Technology","ror":"https://ror.org/05sbgwt55","country_code":"CN","type":"education","lineage":["https://openalex.org/I36152291"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yunhe Li","raw_affiliation_strings":["School of Mechanical and Electrical Engineering, Henan University of Technology, No. 100 Lianhua Street, Zhengzhou, Henan, 450001, CHINA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Mechanical and Electrical Engineering, Henan University of Technology, No. 100 Lianhua Street, Zhengzhou, Henan, 450001, CHINA","institution_ids":["https://openalex.org/I36152291"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101800895","display_name":"Jianhui Zhu","orcid":"https://orcid.org/0000-0002-9900-0937","observed_orcids":["https://orcid.org/0000-0002-9900-0937"]},"institutions":[{"id":"https://openalex.org/I4405278235","display_name":"Zhengzhou Research Institute for Abrasives & Grinding (China)","ror":"https://ror.org/05dxj4973","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210143891","https://openalex.org/I4405278235"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jianhui Zhu","raw_affiliation_strings":["Zhengzhou Research Institute for Abrasives and Grinding Co Ltd, No. 121 Wutong Street, Zhengzhou, Henan, 450000, CHINA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Zhengzhou Research Institute for Abrasives and Grinding Co Ltd, No. 121 Wutong Street, Zhengzhou, Henan, 450000, CHINA","institution_ids":["https://openalex.org/I4405278235"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5028703717","display_name":"Ningchang Wang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405278235","display_name":"Zhengzhou Research Institute for Abrasives & Grinding (China)","ror":"https://ror.org/05dxj4973","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210143891","https://openalex.org/I4405278235"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ningchang Wang","raw_affiliation_strings":["Zhengzhou Research Institute for Abrasives and Grinding Co Ltd, No. 121 Wutong Street, Zhengzhou, Henan, 450000, CHINA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Zhengzhou Research Institute for Abrasives and Grinding Co Ltd, No. 121 Wutong Street, Zhengzhou, Henan, 450000, CHINA","institution_ids":["https://openalex.org/I4405278235"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103052579","display_name":"Shaoxing Han","orcid":"https://orcid.org/0000-0002-9096-430X","observed_orcids":["https://orcid.org/0000-0002-9096-430X"]},"institutions":[{"id":"https://openalex.org/I4405278235","display_name":"Zhengzhou Research Institute for Abrasives & Grinding (China)","ror":"https://ror.org/05dxj4973","country_code":"CN","type":"company","lineage":["https://openalex.org/I4210143891","https://openalex.org/I4405278235"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Shaoxing Han","raw_affiliation_strings":["Zhengzhou Research Institute for Abrasives and Grinding Co Ltd, No. 121 Wutong Street, Zhengzhou, Henan, 450000, CHINA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Zhengzhou Research Institute for Abrasives and Grinding Co Ltd, No. 121 Wutong Street, Zhengzhou, Henan, 450000, CHINA","institution_ids":["https://openalex.org/I4405278235"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085502573","display_name":"Hui Qiu","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I36152291","display_name":"Henan University of Technology","ror":"https://ror.org/05sbgwt55","country_code":"CN","type":"education","lineage":["https://openalex.org/I36152291"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Hui Qiu","raw_affiliation_strings":["School of Mechanical and Electrical Engineering, Henan University of Technology, No. 100 Lianhua Street, Zhengzhou, Henan, 450001, CHINA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Mechanical and Electrical Engineering, Henan University of Technology, No. 100 Lianhua Street, Zhengzhou, Henan, 450001, CHINA","institution_ids":["https://openalex.org/I36152291"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100623072","display_name":"Zhengxin Li","orcid":"https://orcid.org/0000-0003-3249-0430","observed_orcids":["https://orcid.org/0000-0003-3249-0430"]},"institutions":[{"id":"https://openalex.org/I36152291","display_name":"Henan University of Technology","ror":"https://ror.org/05sbgwt55","country_code":"CN","type":"education","lineage":["https://openalex.org/I36152291"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhengxin Li","raw_affiliation_strings":["School of Material Science and Engineering, Henan University of Technology, No. 100 Lianhua Street, Zhengzhou, 450001, CHINA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Material Science and Engineering, Henan University of Technology, No. 100 Lianhua Street, Zhengzhou, 450001, CHINA","institution_ids":["https://openalex.org/I36152291"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5009924190"],"corresponding_institution_ids":["https://openalex.org/I36152291"],"apc_list":{"value":3075,"currency":"USD","value_usd":3075},"apc_paid":null,"fwci":1.0086,"has_fulltext":true,"cited_by_count":10,"citation_normalized_percentile":{"value":0.72712779,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":97},"biblio":{"volume":"38","issue":"7","first_page":"075014","last_page":"075014"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10188","display_name":"Advanced machining processes and optimization","score":9.999999747378752e-05,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/4h-sic","display_name":"4H-SiC","score":0.9890000224113464},{"id":"https://openalex.org/keywords/chemical-mechanical-polishing","display_name":"chemical mechanical polishing","score":0.9470000267028809},{"id":"https://openalex.org/keywords/grey-relational-analysis","display_name":"grey relational analysis","score":0.8500000238418579},{"id":"https://openalex.org/keywords/process-parameter-optimization","display_name":"process parameter optimization","score":0.871999979019165},{"id":"https://openalex.org/keywords/material-removal-rate","display_name":"material removal rate","score":0.9539999961853027},{"id":"https://openalex.org/keywords/surface-roughness","display_name":"surface roughness","score":1.0},{"id":"https://openalex.org/keywords/multi-objective-optimization","display_name":"multi-objective optimization","score":0.7459999918937683},{"id":"https://openalex.org/keywords/downforce","display_name":"downforce","score":0.6150000095367432},{"id":"https://openalex.org/keywords/rotational-speed","display_name":"rotational speed","score":0.8939999938011169},{"id":"https://openalex.org/keywords/slurry-flow-rate","display_name":"slurry flow rate","score":0.902999997138977},{"id":"https://openalex.org/keywords/abrasive-particle-size","display_name":"abrasive particle size","score":0.9729999899864197}],"concepts":[{"id":"https://openalex.org/C180088628","wikidata":"https://www.wikidata.org/wiki/Q1069404","display_name":"Chemical-mechanical planarization","level":3,"score":0.9027888774871826},{"id":"https://openalex.org/C138113353","wikidata":"https://www.wikidata.org/wiki/Q611639","display_name":"Polishing","level":2,"score":0.8230298757553101},{"id":"https://openalex.org/C64734493","wikidata":"https://www.wikidata.org/wiki/Q5608296","display_name":"Grey relational analysis","level":2,"score":0.7428990602493286},{"id":"https://openalex.org/C107365816","wikidata":"https://www.wikidata.org/wiki/Q114817","display_name":"Surface roughness","level":2,"score":0.6366390585899353},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6330846548080444},{"id":"https://openalex.org/C2780957350","wikidata":"https://www.wikidata.org/wiki/Q372301","display_name":"Abrasive","level":2,"score":0.6325986981391907},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6317855715751648},{"id":"https://openalex.org/C81063470","wikidata":"https://www.wikidata.org/wiki/Q1256787","display_name":"Rotational speed","level":2,"score":0.6253207921981812},{"id":"https://openalex.org/C115952470","wikidata":"https://www.wikidata.org/wiki/Q332172","display_name":"Process optimization","level":2,"score":0.5404883027076721},{"id":"https://openalex.org/C172120300","wikidata":"https://www.wikidata.org/wiki/Q1134348","display_name":"Volumetric flow rate","level":2,"score":0.5180225968360901},{"id":"https://openalex.org/C2778517922","wikidata":"https://www.wikidata.org/wiki/Q7140482","display_name":"Particle (ecology)","level":2,"score":0.4964450001716614},{"id":"https://openalex.org/C94293008","wikidata":"https://www.wikidata.org/wiki/Q23925154","display_name":"Slurry","level":2,"score":0.45922958850860596},{"id":"https://openalex.org/C187530423","wikidata":"https://www.wikidata.org/wiki/Q7140503","display_name":"Particle size","level":2,"score":0.4342691898345947},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3815726041793823},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.36226099729537964},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.27692365646362305},{"id":"https://openalex.org/C57879066","wikidata":"https://www.wikidata.org/wiki/Q41217","display_name":"Mechanics","level":1,"score":0.18986248970031738},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.16900759935379028},{"id":"https://openalex.org/C42360764","wikidata":"https://www.wikidata.org/wiki/Q83588","display_name":"Chemical engineering","level":1,"score":0.14592388272285461},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.08839163184165955},{"id":"https://openalex.org/C144237770","wikidata":"https://www.wikidata.org/wiki/Q747534","display_name":"Mathematical economics","level":1,"score":0.0},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1088/1361-6641/acd9e5","doi":"https://doi.org/10.1088/1361-6641/acd9e5","is_oa":true,"landing_page_url":"https://doi.org/10.1088/1361-6641/acd9e5","pdf_url":"https://iopscience.iop.org/article/10.1088/1361-6641/acd9e5/pdf","source":{"id":"https://openalex.org/S106302738","display_name":"Semiconductor Science and Technology","issn_l":"0268-1242","issn":["0268-1242","1361-6641"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320083","host_organization_name":"IOP Publishing","host_organization_lineage":["https://openalex.org/P4310320083","https://openalex.org/P4310311669"],"host_organization_lineage_names":["IOP Publishing","Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Semiconductor Science and Technology","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1088/1361-6641/acd9e5","doi":"https://doi.org/10.1088/1361-6641/acd9e5","is_oa":true,"landing_page_url":"https://doi.org/10.1088/1361-6641/acd9e5","pdf_url":"https://iopscience.iop.org/article/10.1088/1361-6641/acd9e5/pdf","source":{"id":"https://openalex.org/S106302738","display_name":"Semiconductor Science and Technology","issn_l":"0268-1242","issn":["0268-1242","1361-6641"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320083","host_organization_name":"IOP Publishing","host_organization_lineage":["https://openalex.org/P4310320083","https://openalex.org/P4310311669"],"host_organization_lineage_names":["IOP Publishing","Institute of Physics"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Semiconductor Science and Technology","raw_type":"journal-article"},"sustainable_development_goals":[],"study_designs":[],"awards":[{"id":"https://openalex.org/G2412424850","display_name":null,"funder_award_id":"2022M712923","funder_id":"https://openalex.org/F4320321543","funder_display_name":"China Postdoctoral Science Foundation"},{"id":"https://openalex.org/G3006644507","display_name":null,"funder_award_id":"22A460003","funder_id":"https://openalex.org/F4320325625","funder_display_name":"Education Department of Henan Province"}],"funders":[{"id":"https://openalex.org/F4320321543","display_name":"China Postdoctoral Science Foundation","ror":"https://ror.org/0426zh255"},{"id":"https://openalex.org/F4320321955","display_name":"Henan University of Technology","ror":"https://ror.org/05sbgwt55"},{"id":"https://openalex.org/F4320322878","display_name":"Henan University","ror":"https://ror.org/003xyzq10"},{"id":"https://openalex.org/F4320325625","display_name":"Education Department of Henan Province","ror":null}],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W4378740329.pdf","grobid_xml":"https://content.openalex.org/works/W4378740329.grobid-xml"},"referenced_works_count":30,"referenced_works":["https://openalex.org/W1968031169","https://openalex.org/W1986171164","https://openalex.org/W2001312624","https://openalex.org/W2008081062","https://openalex.org/W2019856065","https://openalex.org/W2028554850","https://openalex.org/W2028702750","https://openalex.org/W2050617266","https://openalex.org/W2088677186","https://openalex.org/W2128479808","https://openalex.org/W2330630852","https://openalex.org/W2344646906","https://openalex.org/W2580563717","https://openalex.org/W2602917654","https://openalex.org/W2791811751","https://openalex.org/W2885997350","https://openalex.org/W2918133862","https://openalex.org/W2948570028","https://openalex.org/W2949728079","https://openalex.org/W2966773802","https://openalex.org/W3011214208","https://openalex.org/W3014695375","https://openalex.org/W3167916481","https://openalex.org/W3190133057","https://openalex.org/W3211304520","https://openalex.org/W4213081587","https://openalex.org/W4214703959","https://openalex.org/W4244121291","https://openalex.org/W4306391221","https://openalex.org/W4306411202"],"related_works":["https://openalex.org/W2200576463","https://openalex.org/W6960454124","https://openalex.org/W4362625166","https://openalex.org/W7165727286","https://openalex.org/W7223104213","https://openalex.org/W2045537210","https://openalex.org/W121279742","https://openalex.org/W7101425679","https://openalex.org/W3137435428","https://openalex.org/W2050617266"],"abstract_inverted_index":{"Abstract":[0],"Ultra-smooth":[1],"and":[2,25,37,64,72,91,104,110,134,151,164,179],"low-damage":[3],"processing":[4],"of":[5,46,74,108,123,140,159,166,186],"single-crystalline":[6],"4":[7,31,47],"H-SiC":[8,32,48],"has":[9],"become":[10],"a":[11,15],"research":[12],"focus":[13],"as":[14,95],"substrate":[16],"for":[17],"third-generation":[18],"semiconductor":[19],"wafers.":[20],"However,":[21],"the":[22,53,100,124,138,141,157,184],"high":[23,65],"hardness":[24],"strong":[26],"chemical":[27],"inertia":[28],"significantly":[29],"affect":[30],"chemical-mechanical":[33],"polishing":[34,42,177],"(CMP)":[35],"efficiency":[36,178],"accuracy.":[38],"In":[39],"this":[40],"study,":[41],"process":[43,126,143,174],"optimization":[44,173],"experiments":[45,82],"are":[49,78,112,127,144,169],"conducted":[50],"based":[51],"on":[52],"grey":[54,101,105,187],"relational":[55,102,106,188],"analysis":[56,189],"method":[57],"to":[58],"achieve":[59],"low":[60],"surface":[61,76],"roughness":[62],"(Ra)":[63],"material":[66],"removal":[67],"rate":[68,90],"(MRR).":[69],"First,":[70],"MRR":[71,109,158],"Ra":[73,111,165],"Si":[75],"(0001)":[77],"obtained":[79],"by":[80,114],"orthogonal":[81],"considering":[83],"down":[84,130,145],"force,":[85,131,146],"rotation":[86,128,149],"speed,":[87,129,150],"slurry":[88],"flow":[89,135,147],"abrasive":[92],"particle":[93,132,152],"size":[94,153],"four":[96],"key":[97],"factors.":[98],"Then":[99],"coefficient":[103],"grade":[107],"calculated":[113],"data":[115],"processing.":[116],"The":[117,176],"results":[118],"show":[119],"that":[120],"significant":[121],"factors":[122,139],"single-objective":[125],"size,":[133],"rate,":[136,148],"while":[137],"multi-objective":[142,172],"in":[154,190],"turn.":[155],"Finally,":[156],"208.12":[160],"nm":[161,168],"h":[162],"\u22121":[163],"0.391":[167],"polished":[170],"using":[171],"parameters.":[175],"accuracy":[180],"were":[181],"improved,":[182],"confirming":[183],"applicability":[185],"CMP.":[191]},"counts_by_year":[{"year":2026,"cited_by_count":3},{"year":2025,"cited_by_count":3},{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":1}],"updated_date":"2026-10-27T15:51:10.671819","created_date":"2023-05-31T00:00:00"}