{"id":"https://openalex.org/W4378450641","doi":"https://doi.org/10.1016/j.microrel.2023.115028","title":"Investigation of hygrothermally induced failures in multilayer ceramic capacitors during thermal reflow process","display_name":"Investigation of hygrothermally induced failures in multilayer ceramic capacitors during thermal reflow process","publication_year":2023,"publication_date":"2023-05-23","ids":{"openalex":"https://openalex.org/W4378450641","doi":"https://doi.org/10.1016/j.microrel.2023.115028"},"language":"en","primary_location":{"id":"doi:10.1016/j.microrel.2023.115028","doi":"https://doi.org/10.1016/j.microrel.2023.115028","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2023.115028","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5066953488","display_name":"Rilwan Kayode Apalowo","orcid":"https://orcid.org/0000-0002-4816-4931","observed_orcids":["https://orcid.org/0000-0002-4816-4931"]},"institutions":[{"id":"https://openalex.org/I139322472","display_name":"Universiti Sains Malaysia","ror":"https://ror.org/02rgb2k63","country_code":"MY","type":"education","lineage":["https://openalex.org/I139322472"]},{"id":"https://openalex.org/I180664298","display_name":"Federal University of Technology","ror":"https://ror.org/01pvx8v81","country_code":"NG","type":"education","lineage":["https://openalex.org/I180664298"]}],"countries":["MY","NG"],"is_corresponding":false,"raw_author_name":"Rilwan Kayode Apalowo","raw_affiliation_strings":["Department of Mechanical Engineering, Federal University of Technology, PMB 704, Akure, Nigeria","School of Mechanical Engineering, Universiti Sains Malaysia, Nibong Tebal 14300, Malaysia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Federal University of Technology, PMB 704, Akure, Nigeria","institution_ids":["https://openalex.org/I180664298"]},{"raw_affiliation_string":"School of Mechanical Engineering, Universiti Sains Malaysia, Nibong Tebal 14300, Malaysia","institution_ids":["https://openalex.org/I139322472"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088345333","display_name":"Aizat Abas","orcid":"https://orcid.org/0000-0002-7014-0370","observed_orcids":["https://orcid.org/0000-0002-7014-0370"]},"institutions":[{"id":"https://openalex.org/I139322472","display_name":"Universiti Sains Malaysia","ror":"https://ror.org/02rgb2k63","country_code":"MY","type":"education","lineage":["https://openalex.org/I139322472"]}],"countries":["MY"],"is_corresponding":true,"raw_author_name":"Aizat Abas","raw_affiliation_strings":["School of Mechanical Engineering, Universiti Sains Malaysia, Nibong Tebal 14300, Malaysia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Universiti Sains Malaysia, Nibong Tebal 14300, Malaysia","institution_ids":["https://openalex.org/I139322472"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051624166","display_name":"Zuraihana Bachok","orcid":"https://orcid.org/0000-0002-5319-983X","observed_orcids":["https://orcid.org/0000-0002-5319-983X"]},"institutions":[{"id":"https://openalex.org/I139322472","display_name":"Universiti Sains Malaysia","ror":"https://ror.org/02rgb2k63","country_code":"MY","type":"education","lineage":["https://openalex.org/I139322472"]}],"countries":["MY"],"is_corresponding":false,"raw_author_name":"Zuraihana Bachok","raw_affiliation_strings":["School of Mechanical Engineering, Universiti Sains Malaysia, Nibong Tebal 14300, Malaysia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Universiti Sains Malaysia, Nibong Tebal 14300, Malaysia","institution_ids":["https://openalex.org/I139322472"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5001760726","display_name":"Mohamad Fikri Mohd Sharif","orcid":null,"observed_orcids":[]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Mohamad Fikri Mohd Sharif","raw_affiliation_strings":["Western Digital Corporation, Plot 301A Taman Perindustrian, Batu Kawan, Penang 14100, Malaysia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Western Digital Corporation, Plot 301A Taman Perindustrian, Batu Kawan, Penang 14100, Malaysia","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078970936","display_name":"Fakhrozi Che Ani","orcid":"https://orcid.org/0000-0001-7023-5591","observed_orcids":["https://orcid.org/0000-0001-7023-5591"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Fakhrozi Che Ani","raw_affiliation_strings":["Western Digital Corporation, Plot 301A Taman Perindustrian, Batu Kawan, Penang 14100, Malaysia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Western Digital Corporation, Plot 301A Taman Perindustrian, Batu Kawan, Penang 14100, Malaysia","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5076058194","display_name":"Mohamad Riduwan Ramli","orcid":"https://orcid.org/0000-0002-6207-748X","observed_orcids":["https://orcid.org/0000-0002-6207-748X"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Mohamad Riduwan Ramli","raw_affiliation_strings":["Western Digital Corporation, Plot 301A Taman Perindustrian, Batu Kawan, Penang 14100, Malaysia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Western Digital Corporation, Plot 301A Taman Perindustrian, Batu Kawan, Penang 14100, Malaysia","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5072224082","display_name":"Muhamed Abdul Fatah Muhamed Mukhtar","orcid":"https://orcid.org/0000-0002-3656-3783","observed_orcids":["https://orcid.org/0000-0002-3656-3783"]},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Muhamed Abdul Fatah bin Muhamed Mukhtar","raw_affiliation_strings":["Western Digital Corporation, Plot 301A Taman Perindustrian, Batu Kawan, Penang 14100, Malaysia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Western Digital Corporation, Plot 301A Taman Perindustrian, Batu Kawan, Penang 14100, Malaysia","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5088345333"],"corresponding_institution_ids":["https://openalex.org/I139322472"],"apc_list":{"value":2190,"currency":"USD","value_usd":2190},"apc_paid":null,"fwci":1.2828,"has_fulltext":false,"cited_by_count":18,"citation_normalized_percentile":{"value":0.77273992,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":93,"max":99},"biblio":{"volume":"146","issue":null,"first_page":"115028","last_page":"115028"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10219","display_name":"Mechanical Behavior of Composites","score":0.0003000000142492354,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","score":0.0003000000142492354,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/multilayer-ceramic-capacitors","display_name":"multilayer ceramic capacitors","score":0.9959999918937683},{"id":"https://openalex.org/keywords/thermal-reflow","display_name":"thermal reflow","score":0.9679999947547913},{"id":"https://openalex.org/keywords/moisture-contamination","display_name":"moisture contamination","score":0.6940000057220459},{"id":"https://openalex.org/keywords/voids","display_name":"voids","score":0.6769999861717224},{"id":"https://openalex.org/keywords/interfacial-delamination","display_name":"interfacial delamination","score":0.9929999709129333},{"id":"https://openalex.org/keywords/thermal-expansion-mismatch","display_name":"thermal expansion mismatch","score":0.6850000023841858},{"id":"https://openalex.org/keywords/coefficient-of-thermal-expansion","display_name":"coefficient of thermal expansion","score":0.843999981880188},{"id":"https://openalex.org/keywords/crack-propagation","display_name":"crack propagation","score":0.8109999895095825},{"id":"https://openalex.org/keywords/vapor-pressure","display_name":"vapor pressure","score":0.5559999942779541},{"id":"https://openalex.org/keywords/adhesive-debonding","display_name":"adhesive debonding","score":0.6179999709129333},{"id":"https://openalex.org/keywords/extended-finite-element-method","display_name":"extended finite element method","score":0.7770000100135803}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8725694417953491},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.8244566917419434},{"id":"https://openalex.org/C30239060","wikidata":"https://www.wikidata.org/wiki/Q5253111","display_name":"Delamination (geology)","level":4,"score":0.7715986967086792},{"id":"https://openalex.org/C52192207","wikidata":"https://www.wikidata.org/wiki/Q5322","display_name":"Capacitor","level":3,"score":0.644646167755127},{"id":"https://openalex.org/C115974795","wikidata":"https://www.wikidata.org/wiki/Q337701","display_name":"Ceramic capacitor","level":4,"score":0.6224671602249146},{"id":"https://openalex.org/C134132462","wikidata":"https://www.wikidata.org/wiki/Q45621","display_name":"Ceramic","level":2,"score":0.5722830295562744},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.5623152256011963},{"id":"https://openalex.org/C166595027","wikidata":"https://www.wikidata.org/wiki/Q143983","display_name":"Epoxy","level":2,"score":0.5366249680519104},{"id":"https://openalex.org/C204366326","wikidata":"https://www.wikidata.org/wiki/Q3027650","display_name":"Deformation (meteorology)","level":2,"score":0.42523226141929626},{"id":"https://openalex.org/C47463417","wikidata":"https://www.wikidata.org/wiki/Q6583695","display_name":"Thermal expansion","level":2,"score":0.42422354221343994},{"id":"https://openalex.org/C176177977","wikidata":"https://www.wikidata.org/wiki/Q960836","display_name":"Thermal shock","level":2,"score":0.4172517955303192},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.3479558825492859},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.15342587232589722},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.14994272589683533},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C77928131","wikidata":"https://www.wikidata.org/wiki/Q193343","display_name":"Tectonics","level":2,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C58097730","wikidata":"https://www.wikidata.org/wiki/Q176318","display_name":"Subduction","level":3,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.microrel.2023.115028","doi":"https://doi.org/10.1016/j.microrel.2023.115028","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2023.115028","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":30,"referenced_works":["https://openalex.org/W1672698912","https://openalex.org/W1748376858","https://openalex.org/W1977601180","https://openalex.org/W2008413308","https://openalex.org/W2012776478","https://openalex.org/W2060728346","https://openalex.org/W2062262280","https://openalex.org/W2066633305","https://openalex.org/W2090489054","https://openalex.org/W2095226680","https://openalex.org/W2140845912","https://openalex.org/W2145203134","https://openalex.org/W2152962070","https://openalex.org/W2285008244","https://openalex.org/W2341822376","https://openalex.org/W2613945126","https://openalex.org/W2756562624","https://openalex.org/W2796478672","https://openalex.org/W2808857573","https://openalex.org/W2863375912","https://openalex.org/W2891535831","https://openalex.org/W2919979955","https://openalex.org/W2962236119","https://openalex.org/W2980142707","https://openalex.org/W3084773660","https://openalex.org/W3135054202","https://openalex.org/W3142424911","https://openalex.org/W3161859152","https://openalex.org/W4236608455","https://openalex.org/W4245095550"],"related_works":["https://openalex.org/W4394754118","https://openalex.org/W4306783295","https://openalex.org/W7005976526","https://openalex.org/W4385495193","https://openalex.org/W7204628310","https://openalex.org/W1977397101","https://openalex.org/W2022496562","https://openalex.org/W6987477498","https://openalex.org/W2049695291","https://openalex.org/W2149468946"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":10},{"year":2023,"cited_by_count":2}],"updated_date":"2026-11-10T11:39:43.021295","created_date":"2023-05-27T00:00:00"}