{"id":"https://openalex.org/W4367359241","doi":"https://doi.org/10.1007/978-3-031-26708-6_4","title":"Advanced Flip Chip Packaging","display_name":"Advanced Flip Chip Packaging","publication_year":2023,"publication_date":"2023-01-01","ids":{"openalex":"https://openalex.org/W4367359241","doi":"https://doi.org/10.1007/978-3-031-26708-6_4"},"language":"en","primary_location":{"id":"doi:10.1007/978-3-031-26708-6_4","doi":"https://doi.org/10.1007/978-3-031-26708-6_4","is_oa":false,"landing_page_url":"https://doi.org/10.1007/978-3-031-26708-6_4","pdf_url":null,"source":{"id":"https://openalex.org/S4210224994","display_name":"Springer series in reliability engineering","issn_l":"1614-7839","issn":["1614-7839","2196-999X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Springer Series in Reliability Engineering","raw_type":"book-chapter"},"volume":{"id":"https://openalex.org/W4367359188","display_name":"Interconnect Reliability in Advanced Memory Device Packaging"},"type":"book-chapter","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5062159963","display_name":"Gan Chong Leong","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405261545","display_name":"Micron (Taiwan)","ror":"https://ror.org/05fkhqk36","country_code":"TW","type":"company","lineage":["https://openalex.org/I11912373","https://openalex.org/I4405261545"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chong Leong, Gan","raw_affiliation_strings":["Package Development Engineering, Micron Memory Taiwan Co. Ltd., Taichung, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Package Development Engineering, Micron Memory Taiwan Co. Ltd., Taichung, Taiwan","institution_ids":["https://openalex.org/I4405261545"]}]},{"author_position":"last","author":{"id":null,"display_name":"Chen-Yu, Huang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405261545","display_name":"Micron (Taiwan)","ror":"https://ror.org/05fkhqk36","country_code":"TW","type":"company","lineage":["https://openalex.org/I11912373","https://openalex.org/I4405261545"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chen-Yu, Huang","raw_affiliation_strings":["Package Development Engineering, Micron Memory Taiwan Co. Ltd., Taichung, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Package Development Engineering, Micron Memory Taiwan Co. Ltd., Taichung, Taiwan","institution_ids":["https://openalex.org/I4405261545"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4405261545"],"apc_list":null,"apc_paid":null,"fwci":17.3422,"has_fulltext":false,"cited_by_count":24,"citation_normalized_percentile":{"value":0.99549706,"is_in_top_1_percent":true,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":88,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"67","last_page":"94"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.5570999979972839,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.5570999979972839,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.4413999915122986,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.00019999999494757503,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/flip-chip","display_name":"flip-chip packaging","score":0.9980000257492065},{"id":"https://openalex.org/keywords/solder-bumps","display_name":"solder bumps","score":0.6000000238418579},{"id":"https://openalex.org/keywords/cu-pillar-bumps","display_name":"Cu pillar bumps","score":0.8740000128746033},{"id":"https://openalex.org/keywords/heterogeneous-integration","display_name":"heterogeneous integration","score":0.7360000014305115},{"id":"https://openalex.org/keywords/2-5d-packaging","display_name":"2.5D packaging","score":0.9300000071525574},{"id":"https://openalex.org/keywords/package-reliability","display_name":"package reliability","score":0.6959999799728394},{"id":"https://openalex.org/keywords/solder-bridging","display_name":"solder bridging","score":0.5619999766349792},{"id":"https://openalex.org/keywords/self-alignment","display_name":"self-alignment","score":0.5509999990463257},{"id":"https://openalex.org/keywords/assembly-process","display_name":"assembly process","score":0.34599998593330383}],"concepts":[{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.9042054414749146},{"id":"https://openalex.org/C125619702","wikidata":"https://www.wikidata.org/wiki/Q7783038","display_name":"Thermal copper pillar bump","level":5,"score":0.8502850532531738},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7269387245178223},{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.6756019592285156},{"id":"https://openalex.org/C184788189","wikidata":"https://www.wikidata.org/wiki/Q130652","display_name":"Package on package","level":4,"score":0.6368907690048218},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5334067344665527},{"id":"https://openalex.org/C126233035","wikidata":"https://www.wikidata.org/wiki/Q5101572","display_name":"Chip-scale package","level":3,"score":0.5137652158737183},{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.5039858222007751},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.48098504543304443},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.42460885643959045},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.42195719480514526},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.40864384174346924},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3751499056816101},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.2994289696216583},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2766605615615845},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.25387710332870483},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.23867183923721313},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.09095153212547302},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.07602286338806152},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.0},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C165013422","wikidata":"https://www.wikidata.org/wiki/Q4388382","display_name":"Wafer dicing","level":3,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1007/978-3-031-26708-6_4","doi":"https://doi.org/10.1007/978-3-031-26708-6_4","is_oa":false,"landing_page_url":"https://doi.org/10.1007/978-3-031-26708-6_4","pdf_url":null,"source":{"id":"https://openalex.org/S4210224994","display_name":"Springer series in reliability engineering","issn_l":"1614-7839","issn":["1614-7839","2196-999X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","norway-1"],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"book series"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Springer Series in Reliability Engineering","raw_type":"book-chapter"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":52,"referenced_works":["https://openalex.org/W1489101311","https://openalex.org/W1498167855","https://openalex.org/W1518992349","https://openalex.org/W1909079895","https://openalex.org/W1963669457","https://openalex.org/W2037766816","https://openalex.org/W2076406639","https://openalex.org/W2079669097","https://openalex.org/W2081399724","https://openalex.org/W2108900661","https://openalex.org/W2111329447","https://openalex.org/W2131976522","https://openalex.org/W2146377415","https://openalex.org/W2174268829","https://openalex.org/W2285575012","https://openalex.org/W2512131651","https://openalex.org/W2513737807","https://openalex.org/W2515125914","https://openalex.org/W2516079558","https://openalex.org/W2517910468","https://openalex.org/W2518432791","https://openalex.org/W2527767093","https://openalex.org/W2625995255","https://openalex.org/W2742900968","https://openalex.org/W2743238938","https://openalex.org/W2744560464","https://openalex.org/W2776303380","https://openalex.org/W2779539783","https://openalex.org/W2783876464","https://openalex.org/W2807831903","https://openalex.org/W2885920693","https://openalex.org/W2886394361","https://openalex.org/W2887015044","https://openalex.org/W2887269008","https://openalex.org/W2900237439","https://openalex.org/W2903158486","https://openalex.org/W2970757043","https://openalex.org/W2970920467","https://openalex.org/W2976911658","https://openalex.org/W3007339685","https://openalex.org/W3015475902","https://openalex.org/W3047957948","https://openalex.org/W3048015058","https://openalex.org/W3175860591","https://openalex.org/W3189070795","https://openalex.org/W3191532810","https://openalex.org/W3192817896","https://openalex.org/W4236984360","https://openalex.org/W4285047886","https://openalex.org/W4285047921","https://openalex.org/W4285102999","https://openalex.org/W4285103170"],"related_works":["https://openalex.org/W2349638333","https://openalex.org/W2119842981","https://openalex.org/W2168917860","https://openalex.org/W2075365888","https://openalex.org/W2783876464","https://openalex.org/W2105420654","https://openalex.org/W4392905035","https://openalex.org/W1988076260","https://openalex.org/W2099873956","https://openalex.org/W2151267402"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":9},{"year":2025,"cited_by_count":7},{"year":2024,"cited_by_count":4},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":1}],"updated_date":"2026-11-10T11:39:43.021295","created_date":"2023-04-30T00:00:00"}