{"id":"https://openalex.org/W4367307935","doi":"https://doi.org/10.1117/12.2657952","title":"Supporting future DRAM overlay and EPE roadmaps with the NXT:2100i","display_name":"Supporting future DRAM overlay and EPE roadmaps with the NXT:2100i","publication_year":2023,"publication_date":"2023-04-28","ids":{"openalex":"https://openalex.org/W4367307935","doi":"https://doi.org/10.1117/12.2657952"},"language":"en","primary_location":{"id":"doi:10.1117/12.2657952","doi":"https://doi.org/10.1117/12.2657952","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.2657952","pdf_url":null,"source":{"id":"https://openalex.org/S7407106495","display_name":"SPIE Optical and EUV Nanolithography","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Optical and EUV Nanolithography XXXVI","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Bart Smeets","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Bart Smeets","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5014775998","display_name":"Paul Aben","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Paul Aben","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013578583","display_name":"Friso Klinkhamer","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Friso Klinkhamer","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074685735","display_name":"Jean Philippe van Damme","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Jean Philippe van Damme","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035806655","display_name":"Bart Paarhuis","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Bart Paarhuis","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087810732","display_name":"Raaja Ganapathy Subramanian","orcid":"https://orcid.org/0000-0002-7610-6798","observed_orcids":["https://orcid.org/0000-0002-7610-6798"]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Raaja Ganapathy Subramanian","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Mohamed El Kodadi","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Mohamed El Kodadi","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5014945485","display_name":"Stefan Lichiardopol","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Stefan Lichiardopol","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5038127539","display_name":"Alberto Pirati","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Alberto Pirati","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088632813","display_name":"Peter Vanoppen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Peter Vanoppen","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5069910606","display_name":"Wim de Boeij","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I927257375","display_name":"ASML (Netherlands)","ror":"https://ror.org/01vxknj13","country_code":"NL","type":"company","lineage":["https://openalex.org/I4210092504","https://openalex.org/I927257375"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Wim de Boeij","raw_affiliation_strings":["ASML Netherlands B.V. (Netherlands)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ASML Netherlands B.V. (Netherlands)","institution_ids":["https://openalex.org/I927257375"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I927257375"],"apc_list":null,"apc_paid":null,"fwci":1.3557,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.74807454,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"34","last_page":"34"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11583","display_name":"Advanced Measurement and Metrology Techniques","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/overlay-metrology","display_name":"overlay metrology","score":0.8539999723434448},{"id":"https://openalex.org/keywords/projection-optics","display_name":"projection optics","score":0.7850000262260437},{"id":"https://openalex.org/keywords/wafer-alignment","display_name":"wafer alignment","score":0.796999990940094},{"id":"https://openalex.org/keywords/edge-placement-error","display_name":"edge placement error","score":0.597000002861023},{"id":"https://openalex.org/keywords/euv-lithography","display_name":"EUV lithography","score":0.8769999742507935},{"id":"https://openalex.org/keywords/deep-ultraviolet-lithography","display_name":"deep ultraviolet lithography","score":0.8109999895095825},{"id":"https://openalex.org/keywords/dram-manufacturing","display_name":"DRAM manufacturing","score":0.7699999809265137}],"concepts":[{"id":"https://openalex.org/C146617872","wikidata":"https://www.wikidata.org/wiki/Q1391868","display_name":"Reticle","level":3,"score":0.9883500337600708},{"id":"https://openalex.org/C162996421","wikidata":"https://www.wikidata.org/wiki/Q371965","display_name":"Extreme ultraviolet lithography","level":2,"score":0.8147618770599365},{"id":"https://openalex.org/C136085584","wikidata":"https://www.wikidata.org/wiki/Q910289","display_name":"Overlay","level":2,"score":0.7678288221359253},{"id":"https://openalex.org/C7366592","wikidata":"https://www.wikidata.org/wiki/Q1255620","display_name":"Dram","level":2,"score":0.7054845094680786},{"id":"https://openalex.org/C2779751349","wikidata":"https://www.wikidata.org/wiki/Q1474480","display_name":"Scanner","level":2,"score":0.6923525929450989},{"id":"https://openalex.org/C195766429","wikidata":"https://www.wikidata.org/wiki/Q394","display_name":"Metrology","level":2,"score":0.6658991575241089},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.6244400143623352},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.59694904088974},{"id":"https://openalex.org/C126780896","wikidata":"https://www.wikidata.org/wiki/Q899871","display_name":"Distortion (music)","level":4,"score":0.5627080798149109},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.559458315372467},{"id":"https://openalex.org/C207789793","wikidata":"https://www.wikidata.org/wiki/Q3028070","display_name":"Critical dimension","level":2,"score":0.5268827080726624},{"id":"https://openalex.org/C187504802","wikidata":"https://www.wikidata.org/wiki/Q1751548","display_name":"Stepper","level":2,"score":0.47850385308265686},{"id":"https://openalex.org/C78371743","wikidata":"https://www.wikidata.org/wiki/Q1672829","display_name":"Optical proximity correction","level":3,"score":0.46348100900650024},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.4563097059726715},{"id":"https://openalex.org/C56951928","wikidata":"https://www.wikidata.org/wiki/Q3539213","display_name":"Trimming","level":2,"score":0.4190226197242737},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.41061365604400635},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3572477698326111},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2874376177787781},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.23201316595077515},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22716599702835083},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.20234787464141846},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.17162978649139404},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.1490892469882965},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.13906541466712952},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.08921849727630615},{"id":"https://openalex.org/C194257627","wikidata":"https://www.wikidata.org/wiki/Q211554","display_name":"Amplifier","level":3,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1117/12.2657952","doi":"https://doi.org/10.1117/12.2657952","is_oa":false,"landing_page_url":"https://doi.org/10.1117/12.2657952","pdf_url":null,"source":{"id":"https://openalex.org/S7407106495","display_name":"SPIE Optical and EUV Nanolithography","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310315543","host_organization_name":"SPIE","host_organization_lineage":["https://openalex.org/P4310315543"],"host_organization_lineage_names":["SPIE"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Optical and EUV Nanolithography XXXVI","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2298021171","https://openalex.org/W3133308431","https://openalex.org/W2092695716","https://openalex.org/W1973288566","https://openalex.org/W4394599221","https://openalex.org/W2020295449","https://openalex.org/W2017186164","https://openalex.org/W7151982094","https://openalex.org/W1498128212","https://openalex.org/W1989139368"],"abstract_inverted_index":{"The":[0,108,131],"foundations":[1],"of":[2,42,48,86,142,151,171,276],"leading":[3],"edge":[4,52],"DRAM":[5],"manufacturing":[6],"are":[7,73,217,247],"built":[8],"on":[9,36,75,83],"accurate":[10,40],"EUV":[11,62,292],"lithography":[12],"exposures":[13],"in":[14,184,281],"close":[15],"synergy":[16],"with":[17,45,115,137,176,200,219,240],"cutting-edge":[18],"immersion":[19,89],"layers":[20,44],"as":[21,23,63,65,270,272,288,290],"well":[22,64,271,289],"advanced":[24],"patterning":[25],"schemes":[26],"(e.g.":[27],"self-aligned":[28],"multiple":[29,43],"patterning).":[30],"Final":[31],"device":[32,46],"yield":[33],"critically":[34],"depends":[35],"the":[37,56,61,66,84,87,94,99,104,121,138,172,231,241,265,273,277],"subsequent":[38],"and":[39,51,102,128,193,209,223,252,256],"stacking":[41],"features":[47],"precise":[49],"width":[50],"placement.":[53],"To":[54],"support":[55],"ever-decreasing":[57],"requirements":[58],"for":[59,125,214],"both":[60,76,126,280],"DUV,":[67],"(edge)":[68,95],"placement":[69,96],"accuracy,":[70],"scanner":[71,90,154],"enhancements":[72],"required":[74],"platforms.":[77],"In":[78,238],"this":[79],"paper":[80],"we":[81],"report":[82],"improvements":[85],"NXT:2100i":[88,109,278],"to":[91,144,286,291],"further":[92],"reduce":[93],"errors":[97],"within":[98],"die":[100],"(intra-field)":[101],"across":[103],"full":[105],"wafer":[106,215,232],"(inter-field).":[107],"incorporates":[110],"a":[111,152,177,201],"new":[112],"projection":[113],"optics":[114],"built-in":[116],"distortion":[117,139,149],"manipulator":[118,140],"that":[119],"extends":[120],"intra-field":[122,253],"correction":[123],"capability":[124],"X":[127],"Y":[129],"directions.":[130],"external":[132],"overlay":[133,159,254],"interface":[134],"is":[135,174,198],"extended":[136],"degrees":[141],"freedom":[143],"handle":[145],"high":[146,156],"spatial":[147,157],"frequent":[148,158],"data":[150],"to-be-matched":[153],"or":[155,165],"fingerprints":[160],"measured":[161],"by":[162,224],"after":[163,166],"develop":[164],"etch":[167],"metrology.":[168],"Thermal":[169],"conditioning":[170],"reticle":[173,181,194,258],"improved":[175,250,257],"fast":[178],"conditioned":[179],"internal":[180],"library":[182],"resulting":[183],"lower":[185],"reticle-to-reticle":[186],"temperature":[187],"variation.":[188],"Improved":[189,206],"lens":[190],"metrology":[191],"(aberrations)":[192],"align":[195],"accuracy":[196,208],"(alignment/overlay)":[197],"achieved":[199],"better":[202],"integrated":[203],"image":[204],"sensor.":[205],"alignment":[207,211,216,227],"reduced":[210],"process":[212],"dependencies":[213],"realized":[218],"12-colors":[220],"parallel":[221],"measurements":[222,229],"adding":[225],"more":[226],"marks":[228],"at":[230],"measure":[233],"side":[234],"without":[235],"throughput":[236],"impact.":[237],"concert":[239],"hardware":[242],"components,":[243],"various":[244],"software":[245],"algorithms":[246],"updated,":[248],"yielding":[249],"inter-":[251],"setup":[255],"heating":[259],"induced":[260],"overlay.":[261],"We":[262],"will":[263],"detail":[264],"specific":[266],"module":[267],"performance":[268,275],"items":[269],"system":[274],"scanner,":[279],"reference":[282],"(DRAM":[283],"relevant":[284],"overlay)":[285],"DUV":[287],"scanners.":[293]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1}],"updated_date":"2026-10-27T15:51:10.671819","created_date":"2023-04-29T00:00:00"}