{"id":"https://openalex.org/W4312376260","doi":"https://doi.org/10.1109/estc55720.2022.9939411","title":"Metallurgical aspects and joint properties of Cu-Ni-In-Cu fine-pitch interconnects for 3D integration","display_name":"Metallurgical aspects and joint properties of Cu-Ni-In-Cu fine-pitch interconnects for 3D integration","publication_year":2022,"publication_date":"2022-09-13","ids":{"openalex":"https://openalex.org/W4312376260","doi":"https://doi.org/10.1109/estc55720.2022.9939411"},"language":"en","primary_location":{"id":"doi:10.1109/estc55720.2022.9939411","doi":"https://doi.org/10.1109/estc55720.2022.9939411","is_oa":false,"landing_page_url":"https://doi.org/10.1109/estc55720.2022.9939411","pdf_url":null,"source":{"id":"https://openalex.org/S4306497785","display_name":"Electronic System-Integration Technology Conference (ESTC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5006090288","display_name":"Steffen Bickel","orcid":"https://orcid.org/0009-0006-8705-5398","observed_orcids":["https://orcid.org/0009-0006-8705-5398"]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]},{"id":"https://openalex.org/I4405268488","display_name":"All Silicon System Integration Dresden","ror":"https://ror.org/014zt3e74","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4405268488","https://openalex.org/I4923324"]},{"id":"https://openalex.org/I78650965","display_name":"Technische Universit\u00e4t Dresden","ror":"https://ror.org/042aqky30","country_code":"DE","type":"education","lineage":["https://openalex.org/I78650965"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Steffen Bickel","raw_affiliation_strings":["Fraunhofer Institute for Reliability and Microintegration - All Silicon System Integration Dresden IZM-ASSID, Moritzburg, Germany","Institute of Electronic Packaging Technology, Technische Universitat Dresden, Dresden, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration - All Silicon System Integration Dresden IZM-ASSID, Moritzburg, Germany","institution_ids":["https://openalex.org/I4210134425","https://openalex.org/I4405268488"]},{"raw_affiliation_string":"Institute of Electronic Packaging Technology, Technische Universitat Dresden, Dresden, Germany","institution_ids":["https://openalex.org/I78650965"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5014886579","display_name":"Iuliana Panchenko","orcid":"https://orcid.org/0000-0001-8576-7611","observed_orcids":["https://orcid.org/0000-0001-8576-7611"]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]},{"id":"https://openalex.org/I4405268488","display_name":"All Silicon System Integration Dresden","ror":"https://ror.org/014zt3e74","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4405268488","https://openalex.org/I4923324"]},{"id":"https://openalex.org/I78650965","display_name":"Technische Universit\u00e4t Dresden","ror":"https://ror.org/042aqky30","country_code":"DE","type":"education","lineage":["https://openalex.org/I78650965"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Iuliana Panchenko","raw_affiliation_strings":["Fraunhofer Institute for Reliability and Microintegration - All Silicon System Integration Dresden IZM-ASSID, Moritzburg, Germany","Institute of Electronic Packaging Technology, Technische Universitat Dresden, Dresden, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration - All Silicon System Integration Dresden IZM-ASSID, Moritzburg, Germany","institution_ids":["https://openalex.org/I4210134425","https://openalex.org/I4405268488"]},{"raw_affiliation_string":"Institute of Electronic Packaging Technology, Technische Universitat Dresden, Dresden, Germany","institution_ids":["https://openalex.org/I78650965"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5083945050","display_name":"M. J\u00fcrgen Wolf","orcid":"https://orcid.org/0000-0003-2476-7954","observed_orcids":["https://orcid.org/0000-0003-2476-7954"]},"institutions":[{"id":"https://openalex.org/I4210134425","display_name":"Fraunhofer Institute for Reliability and Microintegration","ror":"https://ror.org/031aqk326","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4923324"]},{"id":"https://openalex.org/I4405268488","display_name":"All Silicon System Integration Dresden","ror":"https://ror.org/014zt3e74","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210134425","https://openalex.org/I4405268488","https://openalex.org/I4923324"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"M. Jurgen Wolf","raw_affiliation_strings":["Fraunhofer Institute for Reliability and Microintegration - All Silicon System Integration Dresden IZM-ASSID, Moritzburg, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Fraunhofer Institute for Reliability and Microintegration - All Silicon System Integration Dresden IZM-ASSID, Moritzburg, Germany","institution_ids":["https://openalex.org/I4210134425","https://openalex.org/I4405268488"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.1656,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.69779493,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"343","last_page":"349"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9359999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9359999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.0632999986410141,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/fine-pitch-interconnects","display_name":"fine pitch interconnects","score":0.9229999780654907},{"id":"https://openalex.org/keywords/3d-integration","display_name":"3D integration","score":0.8429999947547913},{"id":"https://openalex.org/keywords/low-temperature-bonding","display_name":"low-temperature bonding","score":0.8569999933242798},{"id":"https://openalex.org/keywords/indium-solder","display_name":"indium solder","score":0.5320000052452087},{"id":"https://openalex.org/keywords/intermetallic-compound-growth","display_name":"intermetallic compound growth","score":0.7739999890327454},{"id":"https://openalex.org/keywords/solid-liquid-interface","display_name":"solid-liquid interface","score":0.7200000286102295},{"id":"https://openalex.org/keywords/die-shear-strength","display_name":"die shear strength","score":0.8970000147819519},{"id":"https://openalex.org/keywords/wettability","display_name":"wettability","score":0.6579999923706055},{"id":"https://openalex.org/keywords/delamination","display_name":"delamination","score":0.7950000166893005},{"id":"https://openalex.org/keywords/advanced-packaging","display_name":"advanced packaging","score":0.47600001096725464}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8514894843101501},{"id":"https://openalex.org/C27501479","wikidata":"https://www.wikidata.org/wiki/Q428069","display_name":"Intermetallic","level":3,"score":0.8161734342575073},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.7881046533584595},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6539474725723267},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.6435010433197021},{"id":"https://openalex.org/C13530604","wikidata":"https://www.wikidata.org/wiki/Q15318","display_name":"Melting point","level":2,"score":0.6116853356361389},{"id":"https://openalex.org/C134514944","wikidata":"https://www.wikidata.org/wiki/Q817136","display_name":"Wetting","level":2,"score":0.6080482602119446},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.4925900101661682},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.49147117137908936},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.46241188049316406},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.4376162588596344},{"id":"https://openalex.org/C2778492893","wikidata":"https://www.wikidata.org/wiki/Q6557453","display_name":"Liquid metal","level":2,"score":0.416523814201355},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3886842131614685},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.099953293800354},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/estc55720.2022.9939411","doi":"https://doi.org/10.1109/estc55720.2022.9939411","is_oa":false,"landing_page_url":"https://doi.org/10.1109/estc55720.2022.9939411","pdf_url":null,"source":{"id":"https://openalex.org/S4306497785","display_name":"Electronic System-Integration Technology Conference (ESTC)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)","raw_type":"proceedings-article"},{"id":"pmh:oai:publica.fraunhofer.de:publica/447663","doi":null,"is_oa":false,"landing_page_url":"https://publica.fraunhofer.de/handle/publica/447663","pdf_url":null,"source":{"id":"https://openalex.org/S4306400318","display_name":"Fraunhofer-Publica (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"conference paper"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":27,"referenced_works":["https://openalex.org/W588476364","https://openalex.org/W1439379214","https://openalex.org/W1928941428","https://openalex.org/W1965729523","https://openalex.org/W1989994503","https://openalex.org/W1997281749","https://openalex.org/W2011745227","https://openalex.org/W2019219902","https://openalex.org/W2019338694","https://openalex.org/W2060148738","https://openalex.org/W2064390073","https://openalex.org/W2075677573","https://openalex.org/W2083521045","https://openalex.org/W2085644521","https://openalex.org/W2099540110","https://openalex.org/W2103164292","https://openalex.org/W2106514741","https://openalex.org/W2113453347","https://openalex.org/W2116358629","https://openalex.org/W2125129298","https://openalex.org/W2152907860","https://openalex.org/W2317762747","https://openalex.org/W2625529982","https://openalex.org/W2791645952","https://openalex.org/W2885172490","https://openalex.org/W2891362398","https://openalex.org/W2971352256"],"related_works":["https://openalex.org/W3093541198","https://openalex.org/W2902269727","https://openalex.org/W2777418559","https://openalex.org/W4406198233","https://openalex.org/W2160895422","https://openalex.org/W7125089063","https://openalex.org/W2648570423","https://openalex.org/W1982691441","https://openalex.org/W2735480572","https://openalex.org/W4403420523"],"abstract_inverted_index":{"Low-temperature":[0],"bonding":[1,180],"technologies":[2],"for":[3,66],"advanced":[4],"packaging":[5],"gained":[6],"substantial":[7],"interest":[8],"in":[9,21,30,55,104,133,178],"both":[10,113],"research":[11],"and":[12,84,116,182],"industry":[13],"within":[14],"recent":[15],"years.":[16],"The":[17,40,123,154],"replacement":[18],"of":[19,33,42,51,76,100,110,121,129],"Sn":[20],"fine-pitch":[22,157],"interconnects":[23,158],"with":[24,47],"In":[25,87,93],"presents":[26,89],"a":[27,77,90,101,137,168,175],"viable":[28,91],"approach":[29],"the":[31,48,56,61,74,81,85,98,108,118,130,134,141,171,179,188,196],"formation":[32,50,109],"micron-scale":[34],"metallic":[35],"interconnections":[36],"using":[37],"liquid":[38,63],"interlayers.":[39],"employment":[41],"Cu-In":[43,105,189],"bumps":[44,106],"is":[45],"associated":[46],"rapid":[49],"intermetallic":[52],"compounds":[53],"(IMCs)":[54],"solid":[57,135],"state":[58],"thus":[59],"reducing":[60],"available":[62],"interlayer":[64],"volume":[65],"prolonged":[67],"shelf":[68],"times.":[69],"To":[70],"overcome":[71],"this":[72,94],"drawback,":[73],"use":[75],"barrier":[78,103],"layer":[79],"between":[80],"Cu":[82],"bump":[83],"deposited":[86],"solder":[88],"option.":[92],"work":[95],"we":[96],"investigated":[97],"impact":[99],"Ni":[102],"on":[107],"IMCs":[111],"at":[112,140,150,187,195],"room":[114],"temperature":[115],"above":[117],"melting":[119],"point":[120],"In.":[122],"results":[124],"show":[125],"an":[126,183],"effective":[127],"suppression":[128],"IMC":[131],"growth":[132,139],"state,":[136],"slow":[138],"solid-liquid":[142],"interface":[143,190],"below":[144],"180":[145],"\u00b0C":[146],"which":[147],"significantly":[148],"accelerates":[149],"further":[151],"increasing":[152],"temperatures.":[153],"fabricated":[155],"Cu-Ni-In-Cu":[156],"exhibit":[159,174],"die":[160],"shear":[161],"strengths":[162],"up":[163],"to":[164],"30":[165],"MPa.":[166],"On":[167],"microscopic":[169],"level":[170],"formed":[172],"interconnect":[173],"compact":[176],"microstructure":[177],"zone":[181],"excellent":[184],"wetting":[185],"behavior":[186],"but":[191],"also":[192],"delaminated":[193],"areas":[194],"Ni-In":[197],"interface.":[198]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":2}],"updated_date":"2026-10-30T12:39:25.321706","created_date":"2023-01-04T00:00:00"}