{"id":"https://openalex.org/W4308980552","doi":"https://doi.org/10.1016/j.matlet.2022.133501","title":"Interface reliability and diffusion barrier property of Co-W barrier layer with modulated structure","display_name":"Interface reliability and diffusion barrier property of Co-W barrier layer with modulated structure","publication_year":2022,"publication_date":"2022-11-14","ids":{"openalex":"https://openalex.org/W4308980552","doi":"https://doi.org/10.1016/j.matlet.2022.133501"},"language":"en","primary_location":{"id":"doi:10.1016/j.matlet.2022.133501","doi":"https://doi.org/10.1016/j.matlet.2022.133501","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.matlet.2022.133501","pdf_url":null,"source":{"id":"https://openalex.org/S55626769","display_name":"Materials Letters","issn_l":"0167-577X","issn":["0167-577X","1873-4979"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-1","ki-jl-1","norway-1","poland-70","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Materials Letters","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5078863705","display_name":"Liping Chen","orcid":"https://orcid.org/0000-0003-3599-5979","observed_orcids":["https://orcid.org/0000-0003-3599-5979"]},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]},{"id":"https://openalex.org/I4391767745","display_name":"State Key Laboratory of Metal Matrix Composites","ror":"https://ror.org/031z5jh56","country_code":"CN","type":"facility","lineage":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Liping Chen","raw_affiliation_strings":["State Key Laboratory of Metal Matrix Composites, Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"State Key Laboratory of Metal Matrix Composites, Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China","institution_ids":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101765605","display_name":"Shuhui Chen","orcid":"https://orcid.org/0000-0001-7532-8375","observed_orcids":["https://orcid.org/0000-0001-7532-8375","https://orcid.org/0000-0002-6692-3217"]},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]},{"id":"https://openalex.org/I4391767745","display_name":"State Key Laboratory of Metal Matrix Composites","ror":"https://ror.org/031z5jh56","country_code":"CN","type":"facility","lineage":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Shuhui Chen","raw_affiliation_strings":["State Key Laboratory of Metal Matrix Composites, Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"State Key Laboratory of Metal Matrix Composites, Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China","institution_ids":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5003098301","display_name":"Peixin Chen","orcid":"https://orcid.org/0000-0003-1308-8016","observed_orcids":["https://orcid.org/0000-0003-1308-8016","https://orcid.org/0009-0000-5605-855X","https://orcid.org/0009-0002-8641-1048"]},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]},{"id":"https://openalex.org/I4391767745","display_name":"State Key Laboratory of Metal Matrix Composites","ror":"https://ror.org/031z5jh56","country_code":"CN","type":"facility","lineage":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Peixin Chen","raw_affiliation_strings":["State Key Laboratory of Metal Matrix Composites, Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"State Key Laboratory of Metal Matrix Composites, Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China","institution_ids":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100393056","display_name":"Liang Cao","orcid":"https://orcid.org/0000-0002-2117-2245","observed_orcids":["https://orcid.org/0000-0002-2117-2245"]},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]},{"id":"https://openalex.org/I4391767745","display_name":"State Key Laboratory of Metal Matrix Composites","ror":"https://ror.org/031z5jh56","country_code":"CN","type":"facility","lineage":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Liang Cao","raw_affiliation_strings":["State Key Laboratory of Metal Matrix Composites, Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"State Key Laboratory of Metal Matrix Composites, Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China","institution_ids":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100351458","display_name":"Ming Li","orcid":"https://orcid.org/0000-0002-7279-2460","observed_orcids":["https://orcid.org/0000-0002-7279-2460"]},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]},{"id":"https://openalex.org/I4391767745","display_name":"State Key Laboratory of Metal Matrix Composites","ror":"https://ror.org/031z5jh56","country_code":"CN","type":"facility","lineage":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ming Li","raw_affiliation_strings":["State Key Laboratory of Metal Matrix Composites, Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"State Key Laboratory of Metal Matrix Composites, Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China","institution_ids":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5021936819","display_name":"Tao Hang","orcid":"https://orcid.org/0000-0001-6902-0788","observed_orcids":["https://orcid.org/0000-0001-6902-0788"]},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]},{"id":"https://openalex.org/I4391767745","display_name":"State Key Laboratory of Metal Matrix Composites","ror":"https://ror.org/031z5jh56","country_code":"CN","type":"facility","lineage":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Tao Hang","raw_affiliation_strings":["State Key Laboratory of Metal Matrix Composites, Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"State Key Laboratory of Metal Matrix Composites, Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China","institution_ids":["https://openalex.org/I183067930","https://openalex.org/I4391767745"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5021936819"],"corresponding_institution_ids":["https://openalex.org/I183067930","https://openalex.org/I4391767745"],"apc_list":{"value":2160,"currency":"USD","value_usd":2160},"apc_paid":null,"fwci":0.2722,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.38829227,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":88,"max":96},"biblio":{"volume":"331","issue":null,"first_page":"133501","last_page":"133501"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9961000084877014,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9961000084877014,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.0019000000320374966,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.000699999975040555,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/co-w-alloys","display_name":"Co-W alloys","score":0.9210000038146973},{"id":"https://openalex.org/keywords/diffusion-barrier","display_name":"diffusion barrier","score":0.7950000166893005},{"id":"https://openalex.org/keywords/pulsed-electrodeposition","display_name":"pulse electrodeposition","score":0.7900000214576721},{"id":"https://openalex.org/keywords/intermetallic-compound-growth","display_name":"intermetallic compound growth","score":0.781000018119812},{"id":"https://openalex.org/keywords/interface-reliability","display_name":"interface reliability","score":0.6700000166893005},{"id":"https://openalex.org/keywords/shear-strength","display_name":"shear strength","score":0.828000009059906},{"id":"https://openalex.org/keywords/grain-refinement","display_name":"grain refinement","score":0.640999972820282},{"id":"https://openalex.org/keywords/electromigration","display_name":"electromigration","score":0.6110000014305115},{"id":"https://openalex.org/keywords/thermal-fatigue","display_name":"thermal fatigue","score":0.8220000267028809},{"id":"https://openalex.org/keywords/microelectronics-packaging","display_name":"microelectronic packaging","score":0.9070000052452087}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.874858558177948},{"id":"https://openalex.org/C2778836790","wikidata":"https://www.wikidata.org/wiki/Q5275435","display_name":"Diffusion barrier","level":3,"score":0.8647622466087341},{"id":"https://openalex.org/C2779833192","wikidata":"https://www.wikidata.org/wiki/Q17015866","display_name":"Barrier layer","level":3,"score":0.8316717147827148},{"id":"https://openalex.org/C56052488","wikidata":"https://www.wikidata.org/wiki/Q103382","display_name":"Amorphous solid","level":2,"score":0.6142719984054565},{"id":"https://openalex.org/C2780026712","wikidata":"https://www.wikidata.org/wiki/Q37756","display_name":"Alloy","level":2,"score":0.5147212147712708},{"id":"https://openalex.org/C133347239","wikidata":"https://www.wikidata.org/wiki/Q486921","display_name":"Isothermal process","level":2,"score":0.4937373101711273},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.484628289937973},{"id":"https://openalex.org/C69357855","wikidata":"https://www.wikidata.org/wiki/Q163214","display_name":"Diffusion","level":2,"score":0.423541396856308},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4203781485557556},{"id":"https://openalex.org/C8010536","wikidata":"https://www.wikidata.org/wiki/Q160398","display_name":"Crystallography","level":1,"score":0.17509064078330994},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.061888545751571655},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.matlet.2022.133501","doi":"https://doi.org/10.1016/j.matlet.2022.133501","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.matlet.2022.133501","pdf_url":null,"source":{"id":"https://openalex.org/S55626769","display_name":"Materials Letters","issn_l":"0167-577X","issn":["0167-577X","1873-4979"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-b","jufo-1","ki-jl-1","norway-1","poland-70","russia-white-list-1","vabb-shw"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Materials Letters","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[{"id":"https://openalex.org/G7407669934","display_name":"\u4e09\u7ef4\u7535\u5b50\u5c01\u88c5\u805a\u5408\u7269\u7edd\u7f18\u819c\u5171\u4ef7\u63a5\u679d\u53cc\u5411\u4e92\u8fde\u65b9\u6cd5\u7814\u7a76","funder_award_id":"21972091","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G862042367","display_name":null,"funder_award_id":"51991374","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320322999","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W1974590391","https://openalex.org/W1996076184","https://openalex.org/W2004136020","https://openalex.org/W2027502505","https://openalex.org/W2035541598","https://openalex.org/W2065249092","https://openalex.org/W2483196149","https://openalex.org/W2994143592","https://openalex.org/W2998159764","https://openalex.org/W3137778107","https://openalex.org/W3183857675","https://openalex.org/W3209489766","https://openalex.org/W4206155624"],"related_works":["https://openalex.org/W3199984881","https://openalex.org/W4389301732","https://openalex.org/W4206155624","https://openalex.org/W4377089197","https://openalex.org/W1996076184","https://openalex.org/W2101458468","https://openalex.org/W1967269794","https://openalex.org/W4394785483","https://openalex.org/W2070625893","https://openalex.org/W2951395087"],"abstract_inverted_index":null,"counts_by_year":[{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":1}],"updated_date":"2026-11-06T12:05:46.655746","created_date":"2022-11-20T00:00:00"}