{"id":"https://openalex.org/W4297200765","doi":"https://doi.org/10.1016/j.microrel.2022.114707","title":"Effect of electroless Cu depositions for micro-via structure and thermal cycling reliability","display_name":"Effect of electroless Cu depositions for micro-via structure and thermal cycling reliability","publication_year":2022,"publication_date":"2022-09-25","ids":{"openalex":"https://openalex.org/W4297200765","doi":"https://doi.org/10.1016/j.microrel.2022.114707"},"language":"en","primary_location":{"id":"doi:10.1016/j.microrel.2022.114707","doi":"https://doi.org/10.1016/j.microrel.2022.114707","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2022.114707","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100459182","display_name":"Zheng Zhang","orcid":"https://orcid.org/0000-0003-3127-8710","observed_orcids":["https://orcid.org/0000-0003-3127-8710","https://orcid.org/0009-0005-2040-2343","https://orcid.org/0000-0002-6204-3802"]},"institutions":[{"id":"https://openalex.org/I98285908","display_name":"The University of Osaka","ror":"https://ror.org/035t8zc32","country_code":"JP","type":"education","lineage":["https://openalex.org/I98285908"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Zheng Zhang","raw_affiliation_strings":["Flexible 3D System Integration Laboratory, SANKEN, Osaka University, 8-1 Mihogaoka, Ibaraki 567-0047, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Flexible 3D System Integration Laboratory, SANKEN, Osaka University, 8-1 Mihogaoka, Ibaraki 567-0047, Japan","institution_ids":["https://openalex.org/I98285908"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109149223","display_name":"Ming-Chun Hsieh","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I98285908","display_name":"The University of Osaka","ror":"https://ror.org/035t8zc32","country_code":"JP","type":"education","lineage":["https://openalex.org/I98285908"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Ming-Chun Hsieh","raw_affiliation_strings":["Flexible 3D System Integration Laboratory, SANKEN, Osaka University, 8-1 Mihogaoka, Ibaraki 567-0047, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Flexible 3D System Integration Laboratory, SANKEN, Osaka University, 8-1 Mihogaoka, Ibaraki 567-0047, Japan","institution_ids":["https://openalex.org/I98285908"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100448104","display_name":"Ran Liu","orcid":"https://orcid.org/0000-0002-6343-4645","observed_orcids":["https://orcid.org/0000-0002-6343-4645"]},"institutions":[{"id":"https://openalex.org/I98285908","display_name":"The University of Osaka","ror":"https://ror.org/035t8zc32","country_code":"JP","type":"education","lineage":["https://openalex.org/I98285908"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Ran Liu","raw_affiliation_strings":["Flexible 3D System Integration Laboratory, SANKEN, Osaka University, 8-1 Mihogaoka, Ibaraki 567-0047, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Flexible 3D System Integration Laboratory, SANKEN, Osaka University, 8-1 Mihogaoka, Ibaraki 567-0047, Japan","institution_ids":["https://openalex.org/I98285908"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045956884","display_name":"Jeyun Yeom","orcid":"https://orcid.org/0000-0002-6937-5551","observed_orcids":["https://orcid.org/0000-0002-6937-5551"]},"institutions":[{"id":"https://openalex.org/I98285908","display_name":"The University of Osaka","ror":"https://ror.org/035t8zc32","country_code":"JP","type":"education","lineage":["https://openalex.org/I98285908"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Jeyun Yeom","raw_affiliation_strings":["Flexible 3D System Integration Laboratory, SANKEN, Osaka University, 8-1 Mihogaoka, Ibaraki 567-0047, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Flexible 3D System Integration Laboratory, SANKEN, Osaka University, 8-1 Mihogaoka, Ibaraki 567-0047, Japan","institution_ids":["https://openalex.org/I98285908"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042506049","display_name":"Aiji Suetake","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I98285908","display_name":"The University of Osaka","ror":"https://ror.org/035t8zc32","country_code":"JP","type":"education","lineage":["https://openalex.org/I98285908"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Aiji Suetake","raw_affiliation_strings":["Flexible 3D System Integration Laboratory, SANKEN, Osaka University, 8-1 Mihogaoka, Ibaraki 567-0047, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Flexible 3D System Integration Laboratory, SANKEN, Osaka University, 8-1 Mihogaoka, Ibaraki 567-0047, Japan","institution_ids":["https://openalex.org/I98285908"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101771519","display_name":"Hiroshi Yoshida","orcid":"https://orcid.org/0000-0002-3610-6873","observed_orcids":["https://orcid.org/0000-0002-3610-6873"]},"institutions":[{"id":"https://openalex.org/I98285908","display_name":"The University of Osaka","ror":"https://ror.org/035t8zc32","country_code":"JP","type":"education","lineage":["https://openalex.org/I98285908"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hiroshi Yoshida","raw_affiliation_strings":["Flexible 3D System Integration Laboratory, SANKEN, Osaka University, 8-1 Mihogaoka, Ibaraki 567-0047, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Flexible 3D System Integration Laboratory, SANKEN, Osaka University, 8-1 Mihogaoka, Ibaraki 567-0047, Japan","institution_ids":["https://openalex.org/I98285908"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088824951","display_name":"Chuantong Chen","orcid":"https://orcid.org/0000-0002-2365-4387","observed_orcids":["https://orcid.org/0000-0002-2365-4387"]},"institutions":[{"id":"https://openalex.org/I98285908","display_name":"The University of Osaka","ror":"https://ror.org/035t8zc32","country_code":"JP","type":"education","lineage":["https://openalex.org/I98285908"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Chuantong Chen","raw_affiliation_strings":["Flexible 3D System Integration Laboratory, SANKEN, Osaka University, 8-1 Mihogaoka, Ibaraki 567-0047, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Flexible 3D System Integration Laboratory, SANKEN, Osaka University, 8-1 Mihogaoka, Ibaraki 567-0047, Japan","institution_ids":["https://openalex.org/I98285908"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088476969","display_name":"Joonhaeng Kang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405265021","display_name":"Okuno Chemical Industries Co., Ltd. (Japan)","ror":"https://ror.org/03mp00c35","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405265021"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Joonhaeng Kang","raw_affiliation_strings":["Okuno Chemical Industries Co. Ltd., 1-10-25 Hanaten-higashi, Tsurumi-ku, Osaka 538-0044, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Okuno Chemical Industries Co. Ltd., 1-10-25 Hanaten-higashi, Tsurumi-ku, Osaka 538-0044, Japan","institution_ids":["https://openalex.org/I4405265021"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Hidekazu Honma","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405265021","display_name":"Okuno Chemical Industries Co., Ltd. (Japan)","ror":"https://ror.org/03mp00c35","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405265021"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Hidekazu Honma","raw_affiliation_strings":["Okuno Chemical Industries Co. Ltd., 1-10-25 Hanaten-higashi, Tsurumi-ku, Osaka 538-0044, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Okuno Chemical Industries Co. Ltd., 1-10-25 Hanaten-higashi, Tsurumi-ku, Osaka 538-0044, Japan","institution_ids":["https://openalex.org/I4405265021"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5022229131","display_name":"Yuhei Kitahara","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405265021","display_name":"Okuno Chemical Industries Co., Ltd. (Japan)","ror":"https://ror.org/03mp00c35","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405265021"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yuhei Kitahara","raw_affiliation_strings":["Okuno Chemical Industries Co. Ltd., 1-10-25 Hanaten-higashi, Tsurumi-ku, Osaka 538-0044, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Okuno Chemical Industries Co. Ltd., 1-10-25 Hanaten-higashi, Tsurumi-ku, Osaka 538-0044, Japan","institution_ids":["https://openalex.org/I4405265021"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055011352","display_name":"Takashi Matsunami","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405265021","display_name":"Okuno Chemical Industries Co., Ltd. (Japan)","ror":"https://ror.org/03mp00c35","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405265021"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takashi Matsunami","raw_affiliation_strings":["Okuno Chemical Industries Co. Ltd., 1-10-25 Hanaten-higashi, Tsurumi-ku, Osaka 538-0044, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Okuno Chemical Industries Co. Ltd., 1-10-25 Hanaten-higashi, Tsurumi-ku, Osaka 538-0044, Japan","institution_ids":["https://openalex.org/I4405265021"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Kuniaki Otsuka","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I4405265021","display_name":"Okuno Chemical Industries Co., Ltd. (Japan)","ror":"https://ror.org/03mp00c35","country_code":"JP","type":"company","lineage":["https://openalex.org/I4405265021"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Kuniaki Otsuka","raw_affiliation_strings":["Okuno Chemical Industries Co. Ltd., 1-10-25 Hanaten-higashi, Tsurumi-ku, Osaka 538-0044, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Okuno Chemical Industries Co. Ltd., 1-10-25 Hanaten-higashi, Tsurumi-ku, Osaka 538-0044, Japan","institution_ids":["https://openalex.org/I4405265021"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5070481334","display_name":"Katsuaki Suganuma","orcid":"https://orcid.org/0000-0003-2137-9905","observed_orcids":["https://orcid.org/0000-0003-2137-9905"]},"institutions":[{"id":"https://openalex.org/I98285908","display_name":"The University of Osaka","ror":"https://ror.org/035t8zc32","country_code":"JP","type":"education","lineage":["https://openalex.org/I98285908"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Katsuaki Suganuma","raw_affiliation_strings":["Flexible 3D System Integration Laboratory, SANKEN, Osaka University, 8-1 Mihogaoka, Ibaraki 567-0047, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Flexible 3D System Integration Laboratory, SANKEN, Osaka University, 8-1 Mihogaoka, Ibaraki 567-0047, Japan","institution_ids":["https://openalex.org/I98285908"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5100459182"],"corresponding_institution_ids":["https://openalex.org/I98285908"],"apc_list":{"value":2260,"currency":"USD","value_usd":2260},"apc_paid":null,"fwci":0.7485,"has_fulltext":false,"cited_by_count":14,"citation_normalized_percentile":{"value":0.63276335,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":93,"max":98},"biblio":{"volume":"138","issue":null,"first_page":"114707","last_page":"114707"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.5390999913215637,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.5390999913215637,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.44209998846054077,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.010400000028312206,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electroless-copper-plating","display_name":"electroless copper plating","score":0.9750000238418579},{"id":"https://openalex.org/keywords/microvias","display_name":"microvias","score":0.8880000114440918},{"id":"https://openalex.org/keywords/thermal-cycling-reliability","display_name":"thermal cycling reliability","score":0.8349999785423279},{"id":"https://openalex.org/keywords/nanovoids","display_name":"nanovoids","score":0.7919999957084656},{"id":"https://openalex.org/keywords/nickel-additive","display_name":"nickel additive","score":0.8080000281333923},{"id":"https://openalex.org/keywords/hydrogen-bubbles","display_name":"hydrogen bubbles","score":0.8999999761581421},{"id":"https://openalex.org/keywords/reflow","display_name":"reflow","score":0.5220000147819519},{"id":"https://openalex.org/keywords/printed-circuit-board-interconnects","display_name":"printed circuit board interconnects","score":0.8050000071525574}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8322941660881042},{"id":"https://openalex.org/C2983159094","wikidata":"https://www.wikidata.org/wiki/Q9484729","display_name":"Electroless deposition","level":3,"score":0.7361770868301392},{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.6990989446640015},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.5036081671714783},{"id":"https://openalex.org/C30239060","wikidata":"https://www.wikidata.org/wiki/Q5253111","display_name":"Delamination (geology)","level":4,"score":0.4840030372142792},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.4714525640010834},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.46360456943511963},{"id":"https://openalex.org/C64297162","wikidata":"https://www.wikidata.org/wiki/Q1987070","display_name":"Deposition (geology)","level":3,"score":0.4341426491737366},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.3869858384132385},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3801070749759674},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.35074383020401},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.30271708965301514},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.2872806191444397},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.06742820143699646},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C2816523","wikidata":"https://www.wikidata.org/wiki/Q180184","display_name":"Sediment","level":2,"score":0.0},{"id":"https://openalex.org/C58097730","wikidata":"https://www.wikidata.org/wiki/Q176318","display_name":"Subduction","level":3,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C77928131","wikidata":"https://www.wikidata.org/wiki/Q193343","display_name":"Tectonics","level":2,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1016/j.microrel.2022.114707","doi":"https://doi.org/10.1016/j.microrel.2022.114707","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.microrel.2022.114707","pdf_url":null,"source":{"id":"https://openalex.org/S133646729","display_name":"Microelectronics Reliability","issn_l":"0026-2714","issn":["0026-2714","1872-941X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-70","russia-white-list-2"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Microelectronics Reliability","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[{"id":"https://openalex.org/G3633360255","display_name":null,"funder_award_id":"JPNP20017","funder_id":"https://openalex.org/F4320321034","funder_display_name":"New Energy and Industrial Technology Development Organization"}],"funders":[{"id":"https://openalex.org/F4320321034","display_name":"New Energy and Industrial Technology Development Organization","ror":"https://ror.org/0055k7a87"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W2013677561","https://openalex.org/W2015157479","https://openalex.org/W2035785936","https://openalex.org/W2050328706","https://openalex.org/W2080750370","https://openalex.org/W2095691449","https://openalex.org/W2193212110","https://openalex.org/W2891062054","https://openalex.org/W2899634019","https://openalex.org/W2971190423","https://openalex.org/W3048206167"],"related_works":["https://openalex.org/W4411688784","https://openalex.org/W4410582922","https://openalex.org/W7125782302","https://openalex.org/W4377698522","https://openalex.org/W2971190423","https://openalex.org/W4401699523","https://openalex.org/W4377697952","https://openalex.org/W2995993153","https://openalex.org/W4402042967","https://openalex.org/W4400042456"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":3},{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":5},{"year":2023,"cited_by_count":2}],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2022-09-27T00:00:00"}