{"id":"https://openalex.org/W4293518751","doi":"https://doi.org/10.1109/icse56004.2022.9863169","title":"Investigation of Hybrid Graphene-hBN and Graphene-GO as a Direct Contact Heat Spreader","display_name":"Investigation of Hybrid Graphene-hBN and Graphene-GO as a Direct Contact Heat Spreader","publication_year":2022,"publication_date":"2022-08-15","ids":{"openalex":"https://openalex.org/W4293518751","doi":"https://doi.org/10.1109/icse56004.2022.9863169"},"language":"en","primary_location":{"id":"doi:10.1109/icse56004.2022.9863169","doi":"https://doi.org/10.1109/icse56004.2022.9863169","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icse56004.2022.9863169","pdf_url":null,"source":{"id":"https://openalex.org/S4306418714","display_name":"IEEE International Conference on Semiconductor Electronics","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE International Conference on Semiconductor Electronics (ICSE)","raw_type":"proceedings-article"},"parent_works":[],"lineage":["https://openalex.org/W4293518751"],"child_works_count":0,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5080022651","display_name":"Nur Julia Nazim Bulya Nazim","orcid":"https://orcid.org/0000-0002-7527-6189","observed_orcids":["https://orcid.org/0000-0002-7527-6189"]},"institutions":[{"id":"https://openalex.org/I4576418","display_name":"University of Technology Malaysia","ror":"https://ror.org/026w31v75","country_code":"MY","type":"education","lineage":["https://openalex.org/I4576418"]}],"countries":["MY"],"is_corresponding":false,"raw_author_name":"Nur Julia Nazim Bulya Nazim","raw_affiliation_strings":["Universiti Teknologi Malaysia, Kuala Lumpur, Malaysia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Universiti Teknologi Malaysia, Kuala Lumpur, Malaysia","institution_ids":["https://openalex.org/I4576418"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5019719424","display_name":"Mohd Faizol Abdullah","orcid":"https://orcid.org/0000-0001-6911-0716","observed_orcids":["https://orcid.org/0000-0001-6911-0716"]},"institutions":[{"id":"https://openalex.org/I891303086","display_name":"MIMOS (Malaysia)","ror":"https://ror.org/01k94e681","country_code":"MY","type":"government","lineage":["https://openalex.org/I891303086"]}],"countries":["MY"],"is_corresponding":false,"raw_author_name":"Mohd Faizol Abdullah","raw_affiliation_strings":["MIMOS Semiconductor (M) Sdn Bhd, Kuala Lumpur, Malaysia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"MIMOS Semiconductor (M) Sdn Bhd, Kuala Lumpur, Malaysia","institution_ids":["https://openalex.org/I891303086"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111932841","display_name":"Mohd Rofei Mat Hussin","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I891303086","display_name":"MIMOS (Malaysia)","ror":"https://ror.org/01k94e681","country_code":"MY","type":"government","lineage":["https://openalex.org/I891303086"]}],"countries":["MY"],"is_corresponding":false,"raw_author_name":"Mohd Rofei Mat Hussin","raw_affiliation_strings":["MIMOS Semiconductor (M) Sdn Bhd, Kuala Lumpur, Malaysia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"MIMOS Semiconductor (M) Sdn Bhd, Kuala Lumpur, Malaysia","institution_ids":["https://openalex.org/I891303086"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5080982614","display_name":"Siti Aishah Mohamad Badaruddin","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I891303086","display_name":"MIMOS (Malaysia)","ror":"https://ror.org/01k94e681","country_code":"MY","type":"government","lineage":["https://openalex.org/I891303086"]}],"countries":["MY"],"is_corresponding":false,"raw_author_name":"Siti Aishah Mohamad Badaruddin","raw_affiliation_strings":["MIMOS Semiconductor (M) Sdn Bhd, Kuala Lumpur, Malaysia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"MIMOS Semiconductor (M) Sdn Bhd, Kuala Lumpur, Malaysia","institution_ids":["https://openalex.org/I891303086"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100890047","display_name":"Muhamad Amri Ismail","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I891303086","display_name":"MIMOS (Malaysia)","ror":"https://ror.org/01k94e681","country_code":"MY","type":"government","lineage":["https://openalex.org/I891303086"]}],"countries":["MY"],"is_corresponding":false,"raw_author_name":"Muhamad Amri Ismail","raw_affiliation_strings":["MIMOS Semiconductor (M) Sdn Bhd, Kuala Lumpur, Malaysia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"MIMOS Semiconductor (M) Sdn Bhd, Kuala Lumpur, Malaysia","institution_ids":["https://openalex.org/I891303086"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5036681249","display_name":"Abdul Manaf Hashim","orcid":"https://orcid.org/0000-0002-0946-3613","observed_orcids":["https://orcid.org/0000-0002-0946-3613"]},"institutions":[{"id":"https://openalex.org/I4576418","display_name":"University of Technology Malaysia","ror":"https://ror.org/026w31v75","country_code":"MY","type":"education","lineage":["https://openalex.org/I4576418"]}],"countries":["MY"],"is_corresponding":false,"raw_author_name":"Abdul Manaf Hashim","raw_affiliation_strings":["Universiti Teknologi Malaysia, Kuala Lumpur, Malaysia"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Universiti Teknologi Malaysia, Kuala Lumpur, Malaysia","institution_ids":["https://openalex.org/I4576418"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.0,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"42","issue":null,"first_page":"121","last_page":"124"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9771000146865845,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9771000146865845,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10083","display_name":"Graphene research and applications","score":0.009600000455975533,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.002199999988079071,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/hexagonal-boron-nitride","display_name":"hexagonal boron nitride","score":0.9150000214576721},{"id":"https://openalex.org/keywords/graphene-oxide","display_name":"graphene oxide","score":0.9850000143051147},{"id":"https://openalex.org/keywords/plasma-treatment","display_name":"plasma treatment","score":0.6309999823570251},{"id":"https://openalex.org/keywords/coil-cooling","display_name":"coil cooling","score":0.7799999713897705},{"id":"https://openalex.org/keywords/thermal-management","display_name":"thermal management","score":0.3919999897480011}],"concepts":[{"id":"https://openalex.org/C30080830","wikidata":"https://www.wikidata.org/wiki/Q169917","display_name":"Graphene","level":2,"score":0.9210917353630066},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6675763726234436},{"id":"https://openalex.org/C2779851234","wikidata":"https://www.wikidata.org/wiki/Q50690","display_name":"Oxide","level":2,"score":0.6009037494659424},{"id":"https://openalex.org/C123671423","wikidata":"https://www.wikidata.org/wiki/Q332329","display_name":"Contact resistance","level":3,"score":0.59292072057724},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.57276850938797},{"id":"https://openalex.org/C30403606","wikidata":"https://www.wikidata.org/wiki/Q2981904","display_name":"Electromagnetic coil","level":2,"score":0.5180618762969971},{"id":"https://openalex.org/C48632124","wikidata":"https://www.wikidata.org/wiki/Q617088","display_name":"Heat spreader","level":3,"score":0.504346489906311},{"id":"https://openalex.org/C82706917","wikidata":"https://www.wikidata.org/wiki/Q10251","display_name":"Plasma","level":2,"score":0.43988269567489624},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.36079341173171997},{"id":"https://openalex.org/C186937647","wikidata":"https://www.wikidata.org/wiki/Q1796959","display_name":"Heat sink","level":2,"score":0.35746875405311584},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3573254942893982},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.35169389843940735},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3494685888290405},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1619604527950287},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.13551223278045654},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.11565530300140381},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.10853457450866699},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1055745780467987},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icse56004.2022.9863169","doi":"https://doi.org/10.1109/icse56004.2022.9863169","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icse56004.2022.9863169","pdf_url":null,"source":{"id":"https://openalex.org/S4306418714","display_name":"IEEE International Conference on Semiconductor Electronics","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE International Conference on Semiconductor Electronics (ICSE)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.5690000057220459}],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W2037394995","https://openalex.org/W2061053687","https://openalex.org/W2077926445","https://openalex.org/W2120334718","https://openalex.org/W2510917012","https://openalex.org/W2895075063","https://openalex.org/W2946857080","https://openalex.org/W2965196536","https://openalex.org/W3130359620","https://openalex.org/W3201553020","https://openalex.org/W3203436711","https://openalex.org/W3213115824","https://openalex.org/W4281738537"],"related_works":["https://openalex.org/W4281738537","https://openalex.org/W2793933437","https://openalex.org/W4318003388","https://openalex.org/W3196829837","https://openalex.org/W2079589603","https://openalex.org/W6999464099","https://openalex.org/W3048683803","https://openalex.org/W3203436711","https://openalex.org/W2765634199","https://openalex.org/W1536295862"],"abstract_inverted_index":{"This":[0],"article":[1],"studies":[2],"the":[3,40,60,88,94,103,116,122,129,132,145,153,156],"suitability":[4],"of":[5,42,69,106,113,131],"hybrid":[6],"graphene-hexagonal":[7],"boron":[8],"nitride":[9],"(G-hBN)":[10],"and":[11,29,33,52,63,78,97,143,158],"graphene-graphene":[12],"oxide":[13],"(G-GO)":[14],"as":[15],"direct":[16],"contact":[17],"heat":[18,35,56,118,160],"spreaders":[19,57],"on":[20,39],"a":[21,99,137],"Pt/Cu/Ti":[22,133],"micro-coil.":[23],"The":[24],"Ar/CH4plasma":[25],"treatment":[26,90],"converts":[27],"hBN":[28,62,124],"GO":[30,64],"into":[31],"G-hBN":[32,51,159],"G-GO":[34,53,157],"spreaders,":[36],"respectively":[37],"based":[38],"appearance":[41],"graphene":[43],"Raman":[44],"I(G)":[45],"peak":[46],"at":[47,107],"~1575":[48],"cm\u22121.":[49],"Both":[50],"are":[54],"superior":[55],"compared":[58],"to":[59,93,111],"initial":[61],"with":[65],"more":[66,74,79],"than":[67,80],"0.5-times":[68,81],"hotspot":[70,95,141],"temperature":[71,142],"reduction,":[72],"10-times":[73],"coil":[75,104],"cooling":[76],"effects,":[77],"reduction":[82,139],"in":[83,102,140],"lateral":[84,146],"thermal":[85,147],"resistance.":[86],"However,":[87],"plasma":[89],"is":[91,120,152],"damaging":[92],"device":[96],"causes":[98],"severe":[100],"increase":[101],"resistance":[105,130,148],"least":[108],"1.2-times":[109],"due":[110],"thinning":[112],"metal.":[114],"Therefore,":[115],"preferential":[117],"spreader":[119],"still":[121],"non-hybridized":[123],"since":[125],"it":[126],"negligibly":[127],"affects":[128],"coil.":[134],"It":[135,151],"offers":[136],"~16%":[138],"reduces":[144],"by":[149],"~37.4%.":[150],"third-best":[154],"after":[155],"spreaders.":[161]},"counts_by_year":[],"updated_date":"2026-11-14T11:04:58.165337","created_date":"2022-08-30T00:00:00"}