{"id":"https://openalex.org/W4293072969","doi":"https://doi.org/10.1016/j.icheatmasstransfer.2022.106147","title":"Paving 3D interconnected Cring-C3N4@rGO skeleton for polymer composites with efficient thermal management performance yet high electrical insulation","display_name":"Paving 3D interconnected Cring-C3N4@rGO skeleton for polymer composites with efficient thermal management performance yet high electrical insulation","publication_year":2022,"publication_date":"2022-01-01","ids":{"openalex":"https://openalex.org/W4293072969","doi":"https://doi.org/10.1016/j.icheatmasstransfer.2022.106147"},"language":"en","primary_location":{"id":"doi:10.1016/j.icheatmasstransfer.2022.106147","doi":"https://doi.org/10.1016/j.icheatmasstransfer.2022.106147","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.icheatmasstransfer.2022.106147","pdf_url":null,"source":{"id":"https://openalex.org/S118246204","display_name":"International Communications in Heat and Mass Transfer","issn_l":"0735-1933","issn":["0735-1933","1879-0178"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-140","russia-white-list-1"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Communications in Heat and Mass Transfer","raw_type":"journal-article"},"volume":null,"type":"article","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://doi.org/10.2139/ssrn.4087314","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100427050","display_name":"Yifan Li","orcid":"https://orcid.org/0000-0003-0107-9980","observed_orcids":["https://orcid.org/0000-0003-0107-9980"]},"institutions":[{"id":"https://openalex.org/I135905480","display_name":"Shanghai Polytechnic University","ror":"https://ror.org/02as5yg64","country_code":"CN","type":"education","lineage":["https://openalex.org/I135905480"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yifan Li","raw_affiliation_strings":["School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China","Shanghai Engineering Research Center of Advanced Thermal Functional Materials, Shanghai Polytechnic University, Shanghai 201209, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China","institution_ids":["https://openalex.org/I135905480"]},{"raw_affiliation_string":"Shanghai Engineering Research Center of Advanced Thermal Functional Materials, Shanghai Polytechnic University, Shanghai 201209, China","institution_ids":["https://openalex.org/I135905480"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031913604","display_name":"Haiping Xu","orcid":"https://orcid.org/0000-0002-0199-9413","observed_orcids":["https://orcid.org/0000-0002-0199-9413"]},"institutions":[{"id":"https://openalex.org/I135905480","display_name":"Shanghai Polytechnic University","ror":"https://ror.org/02as5yg64","country_code":"CN","type":"education","lineage":["https://openalex.org/I135905480"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Haiping Xu","raw_affiliation_strings":["School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China","Shanghai Engineering Research Center of Advanced Thermal Functional Materials, Shanghai Polytechnic University, Shanghai 201209, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China","institution_ids":["https://openalex.org/I135905480"]},{"raw_affiliation_string":"Shanghai Engineering Research Center of Advanced Thermal Functional Materials, Shanghai Polytechnic University, Shanghai 201209, China","institution_ids":["https://openalex.org/I135905480"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058611905","display_name":"Yuan Zhang","orcid":"https://orcid.org/0000-0002-5616-7139","observed_orcids":["https://orcid.org/0000-0002-5616-7139"]},"institutions":[{"id":"https://openalex.org/I135905480","display_name":"Shanghai Polytechnic University","ror":"https://ror.org/02as5yg64","country_code":"CN","type":"education","lineage":["https://openalex.org/I135905480"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuan Zhang","raw_affiliation_strings":["School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China","institution_ids":["https://openalex.org/I135905480"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072386838","display_name":"Lan Dong","orcid":"https://orcid.org/0000-0002-5623-3933","observed_orcids":["https://orcid.org/0000-0002-5623-3933"]},"institutions":[{"id":"https://openalex.org/I135905480","display_name":"Shanghai Polytechnic University","ror":"https://ror.org/02as5yg64","country_code":"CN","type":"education","lineage":["https://openalex.org/I135905480"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Lan Dong","raw_affiliation_strings":["School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China","Shanghai Engineering Research Center of Advanced Thermal Functional Materials, Shanghai Polytechnic University, Shanghai 201209, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China","institution_ids":["https://openalex.org/I135905480"]},{"raw_affiliation_string":"Shanghai Engineering Research Center of Advanced Thermal Functional Materials, Shanghai Polytechnic University, Shanghai 201209, China","institution_ids":["https://openalex.org/I135905480"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078421729","display_name":"Chuanjiao Liu","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I135905480","display_name":"Shanghai Polytechnic University","ror":"https://ror.org/02as5yg64","country_code":"CN","type":"education","lineage":["https://openalex.org/I135905480"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chuanjiao Liu","raw_affiliation_strings":["School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China","institution_ids":["https://openalex.org/I135905480"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085511442","display_name":"Huaqing Xie","orcid":"https://orcid.org/0000-0001-5793-7871","observed_orcids":["https://orcid.org/0000-0001-5793-7871"]},"institutions":[{"id":"https://openalex.org/I135905480","display_name":"Shanghai Polytechnic University","ror":"https://ror.org/02as5yg64","country_code":"CN","type":"education","lineage":["https://openalex.org/I135905480"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Huaqing Xie","raw_affiliation_strings":["School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China","Shanghai Engineering Research Center of Advanced Thermal Functional Materials, Shanghai Polytechnic University, Shanghai 201209, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China","institution_ids":["https://openalex.org/I135905480"]},{"raw_affiliation_string":"Shanghai Engineering Research Center of Advanced Thermal Functional Materials, Shanghai Polytechnic University, Shanghai 201209, China","institution_ids":["https://openalex.org/I135905480"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100377274","display_name":"Wei Yu","orcid":"https://orcid.org/0000-0002-0536-5637","observed_orcids":["https://orcid.org/0000-0002-0536-5637"]},"institutions":[{"id":"https://openalex.org/I135905480","display_name":"Shanghai Polytechnic University","ror":"https://ror.org/02as5yg64","country_code":"CN","type":"education","lineage":["https://openalex.org/I135905480"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Wei Yu","raw_affiliation_strings":["School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China","Shanghai Engineering Research Center of Advanced Thermal Functional Materials, Shanghai Polytechnic University, Shanghai 201209, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China","institution_ids":["https://openalex.org/I135905480"]},{"raw_affiliation_string":"Shanghai Engineering Research Center of Advanced Thermal Functional Materials, Shanghai Polytechnic University, Shanghai 201209, China","institution_ids":["https://openalex.org/I135905480"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5031913604","https://openalex.org/A5100377274"],"corresponding_institution_ids":["https://openalex.org/I135905480"],"apc_list":{"value":3300,"currency":"USD","value_usd":3300},"apc_paid":null,"fwci":1.7843,"has_fulltext":false,"cited_by_count":32,"citation_normalized_percentile":{"value":0.85101487,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":93,"max":99},"biblio":{"volume":"135","issue":null,"first_page":"106147","last_page":"106147"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10511","display_name":"High voltage insulation and dielectric phenomena","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13116","display_name":"Heat Transfer and Numerical Methods","score":0.0,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermal-interface-materials","display_name":"thermal interface materials","score":0.8579999804496765},{"id":"https://openalex.org/keywords/polymer-composites","display_name":"polymer composites","score":0.8259999752044678},{"id":"https://openalex.org/keywords/graphene-oxide","display_name":"graphene oxide","score":0.7900000214576721},{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"thermal conductivity","score":0.8370000123977661},{"id":"https://openalex.org/keywords/electrical-insulation","display_name":"electrical insulation","score":0.9919999837875366},{"id":"https://openalex.org/keywords/thermal-contact-resistance","display_name":"thermal contact resistance","score":0.972000002861023},{"id":"https://openalex.org/keywords/heat-dissipation","display_name":"heat dissipation","score":0.8190000057220459},{"id":"https://openalex.org/keywords/microelectronics-thermal-management","display_name":"microelectronics thermal management","score":0.8130000233650208}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8977195024490356},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.8049859404563904},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.6772730946540833},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.5980464816093445},{"id":"https://openalex.org/C30080830","wikidata":"https://www.wikidata.org/wiki/Q169917","display_name":"Graphene","level":2,"score":0.5834038257598877},{"id":"https://openalex.org/C172100665","wikidata":"https://www.wikidata.org/wiki/Q7465774","display_name":"Thermal conduction","level":2,"score":0.5571281909942627},{"id":"https://openalex.org/C2778223994","wikidata":"https://www.wikidata.org/wiki/Q905592","display_name":"Filler (materials)","level":2,"score":0.538899302482605},{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.49489158391952515},{"id":"https://openalex.org/C64839514","wikidata":"https://www.wikidata.org/wiki/Q918306","display_name":"Thermal insulation","level":3,"score":0.48105505108833313},{"id":"https://openalex.org/C187937830","wikidata":"https://www.wikidata.org/wiki/Q175403","display_name":"Microelectronics","level":2,"score":0.4781397581100464},{"id":"https://openalex.org/C2779851234","wikidata":"https://www.wikidata.org/wiki/Q50690","display_name":"Oxide","level":2,"score":0.4586098790168762},{"id":"https://openalex.org/C104779481","wikidata":"https://www.wikidata.org/wiki/Q50707","display_name":"Composite number","level":2,"score":0.4159350097179413},{"id":"https://openalex.org/C45058047","wikidata":"https://www.wikidata.org/wiki/Q4119687","display_name":"Thermal contact conductance","level":4,"score":0.4135289788246155},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.41191041469573975},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.3069249391555786},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.20792469382286072},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.1357761025428772},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1016/j.icheatmasstransfer.2022.106147","doi":"https://doi.org/10.1016/j.icheatmasstransfer.2022.106147","is_oa":false,"landing_page_url":"https://doi.org/10.1016/j.icheatmasstransfer.2022.106147","pdf_url":null,"source":{"id":"https://openalex.org/S118246204","display_name":"International Communications in Heat and Mass Transfer","issn_l":"0735-1933","issn":["0735-1933","1879-0178"],"is_oa":false,"is_in_doaj":false,"is_core":true,"listed_in":["cwts-core","dongbi-c","jufo-1","norway-1","poland-140","russia-white-list-1"],"host_organization":"https://openalex.org/P4310320990","host_organization_name":"Elsevier BV","host_organization_lineage":["https://openalex.org/P4310320990"],"host_organization_lineage_names":["Elsevier BV"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"International Communications in Heat and Mass Transfer","raw_type":"journal-article"},{"id":"doi:10.2139/ssrn.4087314","doi":"https://doi.org/10.2139/ssrn.4087314","is_oa":true,"landing_page_url":"https://doi.org/10.2139/ssrn.4087314","pdf_url":null,"source":{"id":"https://openalex.org/S4210172589","display_name":"SSRN Electronic Journal","issn_l":"1556-5068","issn":["1556-5068"],"is_oa":true,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I1318003438","host_organization_name":"RELX Group (Netherlands)","host_organization_lineage":["https://openalex.org/I1318003438"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SSRN Electronic Journal","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.2139/ssrn.4087314","doi":"https://doi.org/10.2139/ssrn.4087314","is_oa":true,"landing_page_url":"https://doi.org/10.2139/ssrn.4087314","pdf_url":null,"source":{"id":"https://openalex.org/S4210172589","display_name":"SSRN Electronic Journal","issn_l":"1556-5068","issn":["1556-5068"],"is_oa":true,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":"https://openalex.org/I1318003438","host_organization_name":"RELX Group (Netherlands)","host_organization_lineage":["https://openalex.org/I1318003438"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"SSRN Electronic Journal","raw_type":"journal-article"},"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.651199996471405,"display_name":"Industry, innovation and infrastructure"}],"study_designs":[],"awards":[{"id":"https://openalex.org/G1315110568","display_name":null,"funder_award_id":"51876112","funder_id":"https://openalex.org/F4320329022","funder_display_name":"Shanghai Polytechnic University"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320329022","display_name":"Shanghai Polytechnic University","ror":"https://ror.org/02as5yg64"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":56,"referenced_works":["https://openalex.org/W888770116","https://openalex.org/W1789298139","https://openalex.org/W2019915094","https://openalex.org/W2049575791","https://openalex.org/W2090045000","https://openalex.org/W2316921421","https://openalex.org/W2467817828","https://openalex.org/W2560106354","https://openalex.org/W2562187105","https://openalex.org/W2564292562","https://openalex.org/W2588349191","https://openalex.org/W2599563998","https://openalex.org/W2603759660","https://openalex.org/W2608078843","https://openalex.org/W2611928798","https://openalex.org/W2763766243","https://openalex.org/W2766860051","https://openalex.org/W2780793454","https://openalex.org/W2801264830","https://openalex.org/W2883477231","https://openalex.org/W2898342959","https://openalex.org/W2908349159","https://openalex.org/W2920832097","https://openalex.org/W2920971975","https://openalex.org/W2941052650","https://openalex.org/W2969901941","https://openalex.org/W2969999336","https://openalex.org/W2970959463","https://openalex.org/W2980628094","https://openalex.org/W3036086989","https://openalex.org/W3039627354","https://openalex.org/W3045593299","https://openalex.org/W3047910322","https://openalex.org/W3083699203","https://openalex.org/W3093262745","https://openalex.org/W3099467508","https://openalex.org/W3111856746","https://openalex.org/W3122265800","https://openalex.org/W3125493085","https://openalex.org/W3127688682","https://openalex.org/W3129093178","https://openalex.org/W3134324024","https://openalex.org/W3140379956","https://openalex.org/W3153456389","https://openalex.org/W3165716836","https://openalex.org/W3166143543","https://openalex.org/W3174986063","https://openalex.org/W3193939027","https://openalex.org/W3196870815","https://openalex.org/W3216165106","https://openalex.org/W4210564764","https://openalex.org/W4210934859","https://openalex.org/W4221022823","https://openalex.org/W4224009005","https://openalex.org/W4229439628","https://openalex.org/W6810503102"],"related_works":["https://openalex.org/W4379375266","https://openalex.org/W2908349159","https://openalex.org/W2970959463","https://openalex.org/W4317467768","https://openalex.org/W7123904746","https://openalex.org/W7166657395","https://openalex.org/W2965527923","https://openalex.org/W4313898728","https://openalex.org/W2944947864","https://openalex.org/W4384131355"],"abstract_inverted_index":null,"counts_by_year":[{"year":2026,"cited_by_count":5},{"year":2025,"cited_by_count":5},{"year":2024,"cited_by_count":13},{"year":2023,"cited_by_count":7},{"year":2022,"cited_by_count":2}],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2022-08-26T00:00:00"}