{"id":"https://openalex.org/W4286571909","doi":"https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830383","title":"5G mmWave Power Amplifier and Low-Noise Amplifier in 300mm GaN-on-Si Technology","display_name":"5G mmWave Power Amplifier and Low-Noise Amplifier in 300mm GaN-on-Si Technology","publication_year":2022,"publication_date":"2022-06-12","ids":{"openalex":"https://openalex.org/W4286571909","doi":"https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830383"},"language":"en","primary_location":{"id":"doi:10.1109/vlsitechnologyandcir46769.2022.9830383","doi":"https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830383","is_oa":false,"landing_page_url":"https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830383","pdf_url":null,"source":{"id":"https://openalex.org/S4363605407","display_name":"IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","raw_type":"proceedings-article"},"volume":null,"type":"conference-paper","is_traditional":true,"indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100717174","display_name":"Qiang Yu","orcid":"https://orcid.org/0000-0002-0695-1603","observed_orcids":["https://orcid.org/0000-0002-0695-1603"]},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Qiang Yu","raw_affiliation_strings":["Intel Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079954157","display_name":"Han Wui Then","orcid":"https://orcid.org/0000-0003-4646-5906","observed_orcids":["https://orcid.org/0000-0003-4646-5906"]},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Han Wui Then","raw_affiliation_strings":["Intel Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Derek Thomson","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Derek Thomson","raw_affiliation_strings":["Intel Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Jessica Chou","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jessica Chou","raw_affiliation_strings":["Intel Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Jeffrey Garrett","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jeffrey Garrett","raw_affiliation_strings":["Intel Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Iwen Huang","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Iwen Huang","raw_affiliation_strings":["Intel Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055548726","display_name":"Ibukunoluwa Momson","orcid":"https://orcid.org/0000-0001-5983-4489","observed_orcids":["https://orcid.org/0000-0001-5983-4489"]},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ibukunoluwa Momson","raw_affiliation_strings":["Intel Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044109602","display_name":"Surej Ravikumar","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Surej Ravikumar","raw_affiliation_strings":["Intel Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072034895","display_name":"Seahee Hwangbo","orcid":"https://orcid.org/0000-0002-9897-8925","observed_orcids":["https://orcid.org/0000-0002-9897-8925"]},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Seahee Hwangbo","raw_affiliation_strings":["Intel Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085019685","display_name":"Alvaro D. Latorre-Rey","orcid":"https://orcid.org/0000-0003-4603-9894","observed_orcids":["https://orcid.org/0000-0003-4603-9894"]},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Alvaro Latorre-Rey","raw_affiliation_strings":["Intel Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Ananda Roy","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ananda Roy","raw_affiliation_strings":["Intel Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074180218","display_name":"M. Radosavljevi\u0107","orcid":"https://orcid.org/0009-0006-1359-601X","observed_orcids":["https://orcid.org/0009-0006-1359-601X"]},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Marko Radosavljevic","raw_affiliation_strings":["Intel Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081823995","display_name":"Michael Beumer","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Michael Beumer","raw_affiliation_strings":["Intel Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Pratik Koirala","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Pratik Koirala","raw_affiliation_strings":["Intel Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Nicole Thomas","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Nicole Thomas","raw_affiliation_strings":["Intel Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Nityan Nair","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Nityan Nair","raw_affiliation_strings":["Intel Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042434167","display_name":"Heli Vora","orcid":"https://orcid.org/0000-0002-9240-3899","observed_orcids":["https://orcid.org/0000-0002-9240-3899"]},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Heli Vora","raw_affiliation_strings":["Intel Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5028737493","display_name":"Samuel D. Bader","orcid":"https://orcid.org/0000-0001-7557-0735","observed_orcids":["https://orcid.org/0000-0001-7557-0735"]},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Samuel Bader","raw_affiliation_strings":["Intel Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013822048","display_name":"Johann C. Rode","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Johann Rode","raw_affiliation_strings":["Intel Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Jonathan Jensen","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jonathan Jensen","raw_affiliation_strings":["Intel Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5021093754","display_name":"Said Rami","orcid":null,"observed_orcids":[]},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Said Rami","raw_affiliation_strings":["Intel Corporation"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation","institution_ids":["https://openalex.org/I1343180700"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I1343180700"],"apc_list":null,"apc_paid":null,"fwci":7.0607,"has_fulltext":false,"cited_by_count":20,"citation_normalized_percentile":{"value":0.98503497,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":95,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"126","last_page":"127"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11248","display_name":"Advanced Power Amplifier Design","score":0.5684000253677368,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11248","display_name":"Advanced Power Amplifier Design","score":0.5684000253677368,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.42309999465942383,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10099","display_name":"GaN-based semiconductor devices and materials","score":0.004699999932199717,"subfield":{"id":"https://openalex.org/subfields/3104","display_name":"Condensed Matter Physics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/5g-millimeter-wave","display_name":"5G millimeter-wave","score":0.7919999957084656},{"id":"https://openalex.org/keywords/power-amplifier","display_name":"power amplifier","score":0.9079999923706055},{"id":"https://openalex.org/keywords/low-noise-amplifier","display_name":"low noise amplifier","score":1.0},{"id":"https://openalex.org/keywords/gan-on-si","display_name":"GaN-on-Si","score":0.9869999885559082},{"id":"https://openalex.org/keywords/300-mm-wafers","display_name":"300 mm wafers","score":0.8870000243186951},{"id":"https://openalex.org/keywords/integrated-circuits","display_name":"integrated circuits","score":0.414000004529953},{"id":"https://openalex.org/keywords/phased-arrays","display_name":"phased arrays","score":0.8330000042915344},{"id":"https://openalex.org/keywords/mobile-devices","display_name":"mobile devices","score":0.7820000052452087},{"id":"https://openalex.org/keywords/noise-figure","display_name":"noise figure","score":0.675000011920929},{"id":"https://openalex.org/keywords/power-added-efficiency","display_name":"power-added efficiency","score":0.6290000081062317}],"concepts":[{"id":"https://openalex.org/C194257627","wikidata":"https://www.wikidata.org/wiki/Q211554","display_name":"Amplifier","level":3,"score":0.7099522352218628},{"id":"https://openalex.org/C155332784","wikidata":"https://www.wikidata.org/wiki/Q1151304","display_name":"Low-noise amplifier","level":4,"score":0.6931829452514648},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.4765796661376953},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.463736891746521},{"id":"https://openalex.org/C99498987","wikidata":"https://www.wikidata.org/wiki/Q2210247","display_name":"Noise (video)","level":3,"score":0.4437696635723114},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.43025046586990356},{"id":"https://openalex.org/C172218469","wikidata":"https://www.wikidata.org/wiki/Q4477697","display_name":"Direct-coupled amplifier","level":5,"score":0.42864862084388733},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.413776695728302},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.39601069688796997},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.39334747195243835},{"id":"https://openalex.org/C145366948","wikidata":"https://www.wikidata.org/wiki/Q178947","display_name":"Operational amplifier","level":4,"score":0.22426822781562805},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2083832323551178},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.18495044112205505},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.12101489305496216},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.0},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/vlsitechnologyandcir46769.2022.9830383","doi":"https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830383","is_oa":false,"landing_page_url":"https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830383","pdf_url":null,"source":{"id":"https://openalex.org/S4363605407","display_name":"IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"listed_in":[],"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"study_designs":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W4385337587","https://openalex.org/W4367147957","https://openalex.org/W4400229848","https://openalex.org/W3094133020","https://openalex.org/W4402716062","https://openalex.org/W4404445088","https://openalex.org/W2914036353","https://openalex.org/W4390188615","https://openalex.org/W2555582969","https://openalex.org/W4394586255"],"abstract_inverted_index":{"This":[0,70],"paper":[1],"presents":[2],"fully":[3],"integrated":[4],"power":[5],"amplifier":[6,10],"(PA)":[7],"and":[8,33,39,52,61],"low-noise":[9],"(LNA)":[11],"targeting":[12],"5G":[13],"mmWave":[14,76],"band":[15],"n260":[16],"(37GHz-40GHz)":[17],"in":[18,67,78],"300mm":[19,79],"GaN-on-Si":[20,80],"technology.":[21,81],"At":[22],"39.5GHz,":[23],"the":[24],"PA":[25],"achieves":[26,46],"measured":[27],"Psat,":[28],"peak":[29],"PAE,":[30],"linear":[31],"gain,":[32,48],"OP1dB":[34],"of":[35,75],"25dBm,":[36],"38.8%,":[37],"24.8dB,":[38],"19.8dBm,":[40],"occupying":[41],"only":[42],"0.079mm2.":[43],"The":[44],"LNA":[45],"24.6dB":[47],"2.9dB":[49],"noise":[50],"figure,":[51],"-11.4dBm":[53],"IIP3":[54],"at":[55],"38GHz.":[56],"Both":[57],"circuits":[58,77],"are":[59],"compact":[60],"viable":[62],"candidates":[63],"for":[64],"phased":[65],"arrays":[66],"mobile":[68],"devices.":[69],"is":[71],"industry\u2019s":[72],"first":[73],"demonstration":[74]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":5},{"year":2024,"cited_by_count":5},{"year":2023,"cited_by_count":5},{"year":2022,"cited_by_count":3}],"updated_date":"2026-11-07T11:25:07.637180","created_date":"2022-07-22T00:00:00"}